POWER DRIVER HYBRID
FOR 3-PHASE BRUSHLESS DC MOTORS
RADIATION TOLERANT FULL BRIDGE
Mii
MICROCIRCUITS PRODUCTS
DIVISION
Features:
• Designed for 100 krad(Si) Total Dose
• Hermetically Sealed Package
• 2A Peak Output Current
• Built-in High-Side Gate Drive Circuit
• N- and P-channel MOSFETs for Ease of Drive
• Electrically Isolated Package
• Interface Directly with UC1625 Motor Controller
Applications:
• 3-Phase BLDC Motor Control
• Fin Actuator Control
• Antenna Deployment Control
• Mirror Position Control
• X-Y Table Control
• Gimbal Stabilization Platform
• Guidance System
DESCRIPTION
The 42144 Full Bridge Power Driver Hybrid is designed for high reliability applications in harsh environment. This
compact design offers a full-bridge power driver stage for three-phase brushless DC motor applications. The
circuit is electrically isolated from the metal case for ease of mounting in the system. The hybrid package provides
two mounting ears for ease of assembly and low thermal resistance path. Each phase contains a high-side gate
drive circuit for the P-channel power MOSFET, a series gate resistor for the low-side N-channel power MOSFET,
and three Schottky diodes. The high-side gate drive circuit accepts an open-collector signal of the application
controller circuit and generates required gate voltage to operate the high-side MOSFET. The low-side gate resistor
will prevent any oscillations and minimize ringing. As an option, a Schottky diode in series with the low-side
MOSFET insures that braking current will not flow backward through the N-channel MOSFET. Sources of the lowside MOSFETs are terminated individually allowing user to configure the desired current sensing option.
Micropac 42144 Full Bridge Power Driver Hybrid employed selected components that are capable to perform in
radiation environment with minimum degradation. The hybrid will perform over the full military temperature range
of –55°C to +125°C. It is fabricated using DSCC certified manufacturing processes that are fully in compliance with
MIL-PRF-38534. This device is available in a variety of quality levels from COTS to Class K including any custom
screening requirements. The basic data sheet part is environmentally screened to H level in accordance with
Table C-IX of MIL-PRF-38534.
Storage Temperature Range ................................................................................................................. -65ºC to +150ºC
Operating Junction Temperature .......................................................................................................... -55ºC to +150ºC
Lead Solder Temperature for 10 seconds ............................................................................................................. 300ºC
Case Temperature................................................................................................................................................... 125ºC
Motor Bus Voltage
GROUND
OUTPUT, Phase A
OUTPUT, Phase B
OUTPUT, Phase C
INPUT, High Side, Phase A
INPUT, High Side, Phase B
INPUT, High Side, Phase C
INPUT, Low Side, Phase A
INPUT, Low Side, Phase B
INPUT, Low Side, Phase C
Current Sense, Phase A
Current Sense, Phase B
Current Sense, Phase C
Not Used
Not Used
Not Used
Not Used
Function
Figure 2. Pin Function
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
MICROPAC INDUSTRIES, INC.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.