Datasheet 2sk3611 Datasheet

Page 1
2SK3611-01MR
FUJI POWER MOSFET
Super F AP-G Series
Features
High speed switching Low on-resistance No secondary breadown Low driving power Avalanche-proof
Applications
Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item Symbol Ratings Unit
Drain-source voltage VDS 250
VDSX *5 220 Continuous drain current ID ±10 Pulsed drain current ID(puls] ±40 Gate-source voltage VGS ±30 Non-repetitive Avalanche current IAS *2 10 Maximum Avalanche Energy EAS *1 182 Maximum Drain-Source dV/dt dVDS/dt *4 20 Peak Diode Recovery dV/dt dV/dt *3 5 Max. power dissipation PD Ta=25
Tc=25 Operating and storage Tch +150 temperature range Tstg Isolation voltage VISO 2
*1 L=3.05mH, Vcc=48V *2 Tch 150°C
<
*4 VDS 250V
=
Electrical characteristics (Tc =25°C unless otherwise specified)
Item
Drain-source breakdown voltaget Gate threshold voltage
Zero gate voltage drain current IDSS
Gate-source leakage current Drain-source on-state resistance Forward transcondutance Input capacitance Output capacitance Reverse transfer capacitance Turn-on time ton
Turn-off time toff
Total Gate Charge Gate-Source Charge Gate-Drain Charge Avalanche capability Diode forward on-voltage Reverse recovery time Reverse recovery charge
Thermalcharacteristics
Item Symbol Test Conditions
Thermal resistance
*5 VGS=-30V *6 t=60sec f=60Hz
<
=
www.fujielectric.co.jp/denshi/scd
°C °C
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*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C
=
Symbol
V(BR)DSS VGS(th)
IGSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD IAV VSD trr
Qrr
Rth(ch-c) channel to case Rth(ch-a) channel to ambient
2.16
25
-55 to +150
<
=
Test Conditions
ID= 250µA VGS=0V ID= 250µA VDS=VGS Tch=25°C
VDS=250V VGS=0V Tch=125°C
VDS=200V VGS=0V
VGS=±30V
VDS=0V
ID=5A VGS=10V
ID=5A VDS=25V VDS=75V VGS=0V
f=1MHz VCC=48V ID=5A VGS=10V
RGS=10 Ω
VCC=125V
ID=10A
VGS=10V
L=100µH Tch=25°C
IF=10A VGS=0V Tch=25°C
IF=10A VGS=0V
-di/dt=100A/µs
N-CHANNEL SILICON POWER MOSFET
Outline Drawings (mm)
TO-220F
V V A A V A mJ kV/µs kV/µs W
°C °C kVrms
Tch=25°C
<
=
Equivalent circuit schematic
Drain(D)
Gate(G)
Source(S)
Min. Typ. Max. Units
250
3.0 5.0 25
250
10 100
200 260
510
785 1178
88 132
46
12 18
2.7 4.1
22 33
7.4 11.1
21 31.5
812 5 7.5
10
1.10 1.65
0.155
1.05
Min. Typ. Max. Units
5.0
58.0
°C/W °C/W
ns
V V µA
nA mΩ
S pF
nC
A V µs µC
1
Page 2
2SK361 1-01MR
Characteristics
FUJI POWER MOSFET
Allowable Power Dissipation PD=f(Tc)
30
25
20
15
PD [W]
10
5
0
0 25 50 75 100 125 150
Tc [°C]
Typical Output Characteristics
ID=f(VDS):80µs Pulse test,Tch=25°C
30
20V
25
20
7.0V
10V
8V
7.5V
Maximum Avalanche Energy vs. starting Tch E(AV)=f(starting Tch):Vcc=48V,I(AV)<=10A
300
250
200
150
EAV [mJ]
100
50
0
0 25 50 75 100 125 150
starting Tch [°C]
Typical Transfer Characteristic
ID=f(VGS):80µs Pulse test, VDS=25V,Tch=25°C
100
10
15
ID [A]
10
5
0
024681012
6.5V
6.0V
VGS=5.5V
VDS [V]
Typical Transconductance
gfs=f(ID):80µs Pulse test, VDS=25V,Tch=25°C
100
10
gfs [S]
1
ID[A]
1
0.1 012345678910
VGS[V]
Typical Drain-Source on-state Resistance
RDS(on)=f(ID):80µs Pulse test, Tch=25°C
0.6
0.5
0.4
]
Ω
0.3
RDS(on) [
0.2
VGS=
5.5V
6.0V
6.5V
7.0V
7.5V 8V
10V
20V
0.1
0.1 1 10 100
ID [A]
0.1
0.0 0 5 10 15 20 25 30
ID [A]
2
Page 3
2SK361 1-01MR
FUJI POWER MOSFET
Drain-Source On-state Resistance RDS(on)=f(Tch):ID=5A,VGS=10V
800
700
600
]
Ω
500
400
RDS(on) [ m
300
200
100
0
-50 -25 0 25 50 75 100 125 150
max.
typ.
Tch [°C]
Typical Gate Charge Characteristics
VGS=f(Qg):ID=10A, Tch=25°C
14
12
Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=250
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
VGS(th) [V]
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50 -25 0 25 50 75 100 125 150
max.
min.
Tch [°C]
Typical Capacitance C=f(VDS):VGS=0V,f=1MHz
0
10
µ
A
Ciss
10
8
6
VGS [V]
4
2
0
Vcc= 125V
0 10203040
Qg [nC]
Typical Forward Characteristics of Reverse Diode
IF=f(VSD):80µs Pulse test,Tch=25°C
100
10
IF [A]
1
-1
10
C [nF]
-2
10
-3
10
-1
10
0
10
1
10
VDS [V]
Typical Switching Characteristics vs. ID
t=f(ID):Vcc=48V , VGS=10V, RG=10Ω
3
10
2
10
t [ns]
10
tf
td(off)
td(on)
1
10
Coss
Crss
2
0.1
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
VSD [V]
tr
0
10
-1
10
0
10
1
10
2
10
ID [A]
3
Page 4
2SK361 1-01MR
Transient Thermal Impedance Zth(ch-c)=f(t):D=0
1
10
0
10
C/W]
°
-1
10
Zth(ch-c) [
-2
10
-3
10
-6
10
Maximum Avalanche Current Pulsewidth
IAV=f(tAV):starting Tch=25°C. Vcc=48V
2
10
-5
10
FUJI POWER MOSFET
-4
10
-3
10
t [sec]
-2
10
-1
10
0
10
Avalanche current IAV [A]
10
10
1
10
Single Pulse
0
10
-1
-2
-8
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
tAV [sec]
4
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