Datasheet 2SK359 Datasheet (HIT)

Page 1
Application
VHF amplifier
Outline
2SK359
Silicon N-Channel MOS FET
1. Gate
2. Source
3. Drain
3
2
1
Page 2
2SK359
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
1
Drain to source voltage V Gate to source voltage V Drain current I Gate current I
*
DSX
GSS
D
G
Channel power dissipation Pch 400 mW Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. VGS = –4 V
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown
V
(BR)DSX
voltage Gate cutoff current I Drain current I Gate to source cutoff voltage V Forward transfer admittance
GSS
DSS
GS(off)
y
fs
Input capacitance Ciss — 2.5 — pF VDS = 10 V, VGS = 0,
Output capacitance Coss — 1.6 — pF Reverse transfer capacitance Crss — 0.03 — pF Power gain PG — 30 — dB VDS = 10 V, VGS = 0,
Noise figure NF — 2 — dB Note: 1. The 2SK359 is grouped by I
DEF
4 to 8 6 to 10 8 to 12
20 — — V ID = 100 µA, VGS = –4 V
——±20 nA VGS = ±5 V, VDS = 0
1
*
4 — 12 mA V 0 — –2.0 V VDS = 10 V, ID = 10 µA 8 14 — mS V
as follows.
DSS
20 V ±5V 30 mA ±1mA
= 10 V, VGS = 0
DS
= 10 V, VGS = 0,
DS
f = 1 kHz
f = 1 MHz
f = 100 MHz
2
Page 3
2SK359
Maximum Channel Dissipation Curve
600
(mW)
ch
400
200
Channel Power Dissipation P
0
Ambient Temperature Ta (°C)
Typical Transfer Characteristics
10.0 VDS = 10 V
8.0
(mA)
D
6.0
Typical Output Characteristics
10
= 0 V
V
GS
8
(mA)
D
6
–0.1
–0.2 –0.3
4
Drain Current I
2
–0.4 –0.5
–0.6 –0.7
–0.8
15010050
0
Drain to Source Voltage V
DS
102468
(V)
Forward Transfer Admittance vs.
Drain to Source Voltage
20
(mS)
fs
16
F
12
E
4.0
Drain Current I
2.0
0 –2.0 –1.6 –1.2 –0.8 –0.4 0
Gate to Source Voltage V
GS
(V)
D
8
4
VGS = 0 f = 1 kHz
Forward Transfer Admittance y
0
Drain to Source Voltage V
610482
(V)
DS
3
Page 4
2SK359
100
(mS)
50
fs
20
10
Forward Transfer Admittance y
0.5
(pF)
rss
0.2
0.1
Forward Transfer Admittance vs.
Drain Current
VDS = 10 V f = 1 kHz
5
2
1
0.5 2 201.0 1050.2 Drain Current I
(mA)
D
Reverse Transfer Capacitance vs.
Drain to Source Voltage
VGS = 0 f = 1 MHz
Input Capacitance vs.
Drain to Source Voltage
20
10
(pF)
iss
5
2
1.0
Input Capacitance C
0.5 Drain to Source Voltage V
Output Capacitance vs.
Drain to Source Voltage
20
10
(pF)
oss
5
VGS = 0 f = 1 MHz
2102051.00.5 (V)
DS
VGS = 0 f = 1 MHz
0.05
0.02
Reverse Transfer Capacitance C
0.01
0.5 2 10 2051.0 Drain to Source Voltage V
DS
(V)
2
1.0
Output Capacitance C
0.5
0.5 2 2051.0 10 Drain to Source Voltage V
DS
(V)
4
Page 5
35
30
2SK359
Power Gain, Noise Figure vs.
Drain to Source Voltage
PG
25
20
15
Power Gain PG (dB)
10
5
20
Drain to Source Voltage V
f = 100 MHz
6
4
NF
6104812
(V)
DS
Noise Figure NF (dB)
2
0
5
Page 6
Unit: mm
0.60 Max
0.45 ± 0.1
4.8 ± 0.3
1.27
2.54
0.7
5.0 ± 0.2
2.3 Max
12.7 Min
3.8 ± 0.3
0.5
Hitachi Code JEDEC EIAJ
(reference value)
Weight
TO-92 (2) Conforms Conforms
0.25 g
Page 7
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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