Datasheet 2SK3289 Datasheet (HIT)

Silicon N Channel MOS FET
High Speed Switching
Features
Low on-resistance
RDS =1.26 typ. (VGS = 10 V , ID = 150 mA) RDS = 2.8 typ. (VGS = 4 V , ID = 50 mA)
4 V gate drive device.
Small package (CMPAK)
Outline
2SK3289
ADE-208-743C (Z)
4th.Edition.
June 1999
CMPAK
G
3
1
D
S
2
1. Source
2. Gate
3. Drain
2SK3289
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body-drain diode reverse drain current I Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note1
Note 2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10 µs, duty cycle 1%
2. Value on the alumina ceramic board (12.5 x 20 x 0.7 mm)
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Gate to source leak current I Zero gate voltege drain
GSS
I
DSS
current Gate to source cutoff voltage V Static drain to source on state R resistance R
GS(off)
DS(on)
DS(on)
Forward transfer admittance |yfs| 145 220 mS I Input capacitance Ciss 6 pF VDS = 10 V Output capacitance Coss 18 pF VGS = 0 Reverse transfer capacitance Crss 2 pF f = 1 MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t
d(on)
r
d(off)
f
Note: 3. Pulse test
4. Marking is AN See characteristics curves of 2SK3287
30 V ID = 100 µA, VGS = 0
±20 V IG = ±100 µA, VDS = 0
——±5 µAVGS = ±16 V, VDS = 0 ——1 µAVDS = 30 V, VGS = 0
1.3 2.3 V ID = 10µA, VDS = 5 V — 1.26 3.44 I 2.8 3.44 I
200 ns ID = 150 mA, VGS = 10 V — 600 ns RL = 66.6 1100 ns — 1100 ns
30 V ±20 V 300 mA
1.2 A 300 mA 300 mW
= 150 mA,VGS = 10 V
D
= 50 mA,VGS = 4 V
D
= 150 mA, VDS =10 V
D
Note 3
Note 3
Note 3
2
Main Characteristics
2SK3289
400
Power vs. Temperature Derating
300
200
100
Channel Dissipation *Pch (mW)
0
0
50 100 150 200
Ambient Temperature Ta ( °C)
*Value on the alumina ceramic boad.(12.5x20x0.7mm)
Maximum Safe Operation Area
5 2
1.0
0.5
D
0.2
0.1
0.05 Operation in this area
0.02
is limited by RDS(on)
0.01
0.005
Drain Current I (A)
0.002
0.001
Ta=25 °C
0.0005
0.1
0.05 0.2 0.5
1.0 10 50
Drain to Source Voltage V (V)
Value on the alumina ceramic boad.(12.5x20x0.7mm)
PW = 10 ms
(1 shot)
DC Operation
25
DS
20
10 µs
100 µs
1 ms
3
2SK3289
Package Dimensions
Unit: mm
0.3
+ 0.1 – 0.05
0.65
1.3
2.0
0.3
+ 0.2 – 0.2
+ 0.2 – 0.2
0.65
+ 0.10 – 0.05
0.3
+ 0.1 – 0.0.5
0.2
+ 0.1
– 0.1
0.9
0.425
+ 0.1
– 0.1
1.25
0.425
+ 0.3
2.1
– 0.3
0.16
0 ~ 0.1
+ 0.10 – 0.06
Hitachi Code
EIAJ
JEDEC
CMPAK
SC–70
4
2SK3289
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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