
2SK3157
Silicon N Channel MOS FET
High Speed Power Switching
Features
• Low on-resistance
RDS = 50 mΩ typ.
• High speed switching
• 4 V gate drive device can be driven from 5 V source
Outline
ADE-208-769A (Z)
2nd. Edition
Februaty 1999
TO–220FM
G
D
1. Gate
2. Drain
1
2
3
S
3. Source

2SK3157
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body-drain diode reverse drain current I
Avalanche current I
Avalanche energy E
Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note3
AP
Note3
AR
Note1
Note2
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50 Ω
Electrical Characteristics (Ta = 25°C)
150 V
±20 V
20 A
80 A
20 A
20 A
30 mJ
35 W
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
Gate to source breakdown voltage V
Gate to source leak current I
Zero gate voltege drain current I
Gate to source cutoff voltage V
Static drain to source on state R
resistance R
(BR)DSS
(BR)GSS
GSS
DSS
GS(off)
DS(on)
DS(on)
150 — — V ID = 10 mA, VGS = 0
±20——V I
= ±100 µA, VDS = 0
G
——±10 µAVGS = ±16 V, VDS = 0
——10µAVDS = 150 V, VGS = 0
1.0 — 2.5 V ID = 1 mA, VDS = 10 V
—5070mΩ ID = 10 A, VGS = 10 V
—6080mΩ ID = 10 A, VGS = 4 V
Forward transfer admittance |yfs|1322—S ID = 10 A, VDS = 10 V
Input capacitance Ciss — 1750 — pF VDS = 10 V
Output capacitance Coss — 600 — pF VGS = 0
Reverse transfer capacitance Crss — 300 — pF f = 1 MHz
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Body–drain diode forward voltage V
Body–drain diode reverse
recovery time
t
d(on)
r
d(off)
f
DF
rr
— 18 — ns ID = 10 A, VGS = 10 V
— 125 — ns RL = 3 Ω
— 400 — ns
— 190 — ns
— 0.9 — V IF = 20 A, VGS = 0
— 170 — ns IF = 20 A, VGS = 0
diF/ dt = 50 A/ µs
Note: 4. Pulse test
Note4
Note4
Note4
2

Main Characteristics
2SK3157
Power vs. Temperature Derating
40
30
20
10
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
10 V
20
5 V
16
4 V
Pulse Test
3 V
500
200
100
50
D
20
10
5
2
Operation in
1
0.5
0.2
0.1
0.05
0.1
this area is
limited by R
Ta = 25°C
0.3
Drain Current I (A)
DC Operation
(Tc = 25°C)
DS(on)
1
3
Drain to Source Voltage V (V)
Typical Transfer Characteristics
20
Maximum Safe Operation Area
V = 10 V
DS
Pulse Test
16
10 µs
100 µs
PW = 10 ms(1shot)
1 ms
10
30
DS
1000
300100
D
12
8
Drain Current I (A)
4
0
246810
Drain to Source Voltage V (V)
V = 2.5 V
GS
2 V
DS
D
12
75°C
8
Drain Current I (A)
4
0
12345
Gate to Source Voltage V (V)
25°C
Tc = –25°C
GS
3

2SK3157
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
2.0
Pulse Test
1.6
DS(on)
V (V)
1.2
I = 20 A
D
0.8
10 A
0.4
Drain to Source Saturation Voltage
0
48
12
16 20
Gate to Source Voltage V (V)
Static Drain to Source on State Resistance
vs. Temperature
250
Ω
Pulse Test
200
DS(on)
R (m )
150
I = 20 A
D
5, 10 A
100
V = 4 V
GS
50
5, 10 A
20 A
10 V
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
5 A
GS
Static Drain to Source on State Resistance
vs. Drain Current
1000
Ω
500
200
DS(on)
R (m )
100
V = 4 V
GS
50
10 V
20
Drain to Source On State Resistance
10
2
1
5
Drain Current I (A)
10
20
D
Forward Transfer Admittance vs.
Drain Current
100
fs
30
Tc = –25 °C
10
75 °C
3
25 °C
1
0.3
Forward Transfer Admittance |y | (S)
0.1
0.1
0.2
0.5
2
1
Drain Current I (A)
V = 10 V
Pulse Test
10
520
D
Pulse Test
50
DS
50 100
100
4

2SK3157
Body–Drain Diode Reverse
Recovery Time
1000
di / dt = 50 A / µs
500
V = 0, Ta = 25 °C
GS
200
100
50
20
Reverse Recovery Time trr (ns)
10
0.1 1 3 10 1000.3 30
Reverse Drain Current I (A)
DR
Typical Capacitance vs.
Drain to Source Voltage
10000
3000
Ciss
1000
300
100
Capacitance C (pF)
30
V = 0
GS
Coss
Crss
f = 1 MHz
10
01020304050
Drain to Source Voltage V (V)
DS
200
I = 20A
D
V
160
DS
V = 100 V
DD
50 V
GS
25 V
120
Dynamic Input Characteristics
V
DS
80
40
Drain to Source Voltage V (V)
0
V = 100 V
DD
50 V
25 V
40 80 120 160 200
Gate Charge Qg (nc)
20
5000
Switching Characteristics
2000
16
GS
1000
12
500
200
8
4
0
100
50
Switching Time t (ns)
Gate to Source Voltage V (V)
20
10
0.5
0.2
0.1
Drain Current I (A)
V = 10 V, V = 30 V
GS
DD
PW = 5 µs, duty < 1 %
t
d(off)
t
f
t
r
t
d(on)
2
510
1
20
D
50
5

2SK3157
Reverse Drain Current vs.
Source to Drain Voltage
20
Pulse Test
16
DR
V = 10 V
12
8
4
GS
5 V
0, –5 V
Reverse Drain Current I (A)
0
0.2 0.4 0.6 0.8 1.0
Source to Drain Voltage V (V)
SD
Maximun Avalanche Energy vs.
Channel Temperature Derating
50
I = 20 A
AP
AR
40
V = 50 V
DD
duty < 0.1 %
Rg > 50
Ω
30
20
10
0
Repetitive Avalanche Energy E (mJ)
25 50 75 100 125 150
Channel Temperature Tch (°C)
Vin
15 V
Avalanche Test Circuit Avalanche Waveform
V
DSS
V – V
DSS DD
AR
1
2
V
DS
L
E = • L • I •
AP
2
Monitor
I
AP
Monitor
I
Rg
D. U. T
V
DD
AP
V
I
D
50Ω
V
DD
0
DS
V
(BR)DSS
6

2SK3157
Normalized Transient Thermal Impedance vs. Pulse Width
3
s (t)
1
γ
D = 1
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.01
10 µ
0.02
0.01
1shot pulse
100 µ 1 m 10 m
Pulse Width PW (S)
Switching Time Test Circuit Waveform
Tc = 25°C
θ γ θ
ch – c(t) = s (t) • ch – c
θ
ch – c = 3.57°C/W, Tc = 25°C
P
DM
PW
T
D =
100 m 1 10
PW
T
Vin Monitor
Vin
10 V
50Ω
D.U.T.
R
L
V
DD
= 30 V
Vout
Monitor
Vin
Vout
td(on)
10%
10%
90%
tr
90%
td(off)
90%
10%
t
f
7

Cautions
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intellectual property rights, in connection with use of the information contained in this document.
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received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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