
2SK3148
Silicon N Channel MOS FET
High Speed Power Switching
Features
• Low on-resistance
RDS = 45 mΩ typ.
• High speed switching
• 4 V gate drive device can be driven from 5 V source
Outline
ADE-208-748A (Z)
2nd. Edition
February 1999
TO–220FM
G
D
1. Gate
2. Drain
1
2
3
S
3. Source

2SK3148
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body-drain diode reverse drain current I
Avalanche current I
Avalanche energy E
Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note3
AP
Note3
AR
Note1
Note2
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50 Ω
Electrical Characteristics (Ta = 25°C)
100 V
±20 V
20 A
60 A
20 A
20 A
40 mJ
30 W
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
Gate to source breakdown voltage V
Gate to source leak current I
Zero gate voltege drain current I
Gate to source cutoff voltage V
Static drain to source on state R
resistance R
(BR)DSS
(BR)GSS
GSS
DSS
GS(off)
DS(on)
DS(on)
100 — — V ID = 10 mA, VGS = 0
±20——V I
= ±100 µA, VDS = 0
G
——±10 µAVGS = ±16 V, VDS = 0
——10µAVDS = 100 V, VGS = 0
1.0 — 2.5 V ID = 1 mA, VDS = 10 V
—4560mΩ ID = 10 A, VGS = 10 V
—6585mΩ ID = 10 A, VGS = 4 V
Forward transfer admittance |yfs| 9 15 — S ID = 10 A, VDS = 10 V
Input capacitance Ciss — 840 — pF VDS = 10 V
Output capacitance Coss — 350 — pF VGS = 0
Reverse transfer capacitance Crss — 180 — pF f = 1 MHz
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Body–drain diode forward voltage V
Body–drain diode reverse
recovery time
t
d(on)
r
d(off)
f
DF
rr
— 15 — ns ID = 10 A, VGS = 10 V
— 120 — ns RL = 3 Ω
— 200 — ns
— 150 — ns
— 0.9 — V IF = 20 A, VGS = 0
— 90 — ns IF = 20 A, VGS = 0
diF/ dt = 50 A/ µs
Note: 4. Pulse test
Note4
Note4
Note4
2

Main Characteristics
2SK3148
Power vs. Temperature Derating
40
30
20
10
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
20
16
4 V
10 V
3.5 V
6 V
D
12
Pulse Test
3 V
500
Maximum Safe Operation Area
100
D
30
10
PW =10 ms (1shot)
DC Operation (Tc = 25°C)
3
1
0.3
0.1
0.05
Operation in
this area is
limited by R
DS(on)
Ta = 25 °C
0.5
1 2 10 20 100
550
Drain Current I (A)
Drain to Source Voltage V (V)
Typical Transfer Characteristics
20
V = 10 V
DS
Pulse Test
16
D
12
100 µs
1 ms
10 µs
DS
200
500
8
Drain Current I (A)
4
0
246810
Drain to Source Voltage V (V)
V =2.5 V
GS
DS
8
4
0
Tc = 75°C
12345
Drain Current I (A)
Gate to Source Voltage V (V)
–25°C
25°C
GS
3

2SK3148
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
2.5
)
2.0
DS(on
V (V)
1.5
Pulse Test
1.0
I = 15 A
D
0.5
10 A
Drain to Source Saturation Voltage
0
48
Gate to Source Voltage V (V)
12
16 20
GS
Static Drain to Source on State Resistance
vs. Temperature
250
Pulse Test
mΩ
200
DS(on)
R ( )
150
5,10 A
15 A
100
V = 4 V
GS
50
5,10 A
10 V
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature T
c
(°C)
5 A
15 A
Static Drain to Source on State Resistance
vs. Drain Current
500
Pulse Test
200
DS(on)
R ( )mΩ
100
50
V = 4 V
GS
10 V
20
Drain to Source On State Resistance
10
1
2
Drain Current I (A)
205
10 100
D
Forward Transfer Admittance vs.
Drain Current
50
fs
20
Tc = –25 °C
10
75 °C
5
2
1
Forward Transfer Admittance |y | (S)
0.5
V = 10 V
DS
Pulse Test
0.1 0.3 1 3 10 30 100
Drain Current I (A)
D
50
25 °C
4

2SK3148
Body–Drain Diode Reverse
Recovery Time
500
di / dt = 50 A / µs
200
V = 0, Ta = 25°C
GS
100
50
20
10
5
2
Reverse Recovery Time trr (ns)
1
0.1 0.3
13
Reverse Drain Current I (A)
Dynamic Input Characteristics
200
I = 15 A
D
V = 100 V
160
DS
DD
50 V
25 V
120
V
DS
10 30 50
DR
V
GS
20
16
12
10000
5000
2000
1000
500
200
100
Capacitance C (pF)
50
V = 0
GS
20
f = 1 MHz
10
01020304050
Drain to Source Voltage V (V)
1000
500
GS
200
100
Typical Capacitance vs.
Drain to Source Voltage
Ciss
Coss
Crss
Switching Characteristics
V = 10 V, V = 30 V
GS
DD
PW = 5 µs, duty < 1%
t
d(off)
t
f
DS
80
40
Drain to Source Voltage V (V)
0
V = 100 V
DD
50 V
25 V
20 40 60 80 100
Gate Charge Qg (nc)
8
4
50
Switching Time t (ns)
t
r
20
Gate to Source Voltage V (V)
0
10
0.1 0.2 1
0.5 50
Drain Current I (A)
t
d(on)
2
D
10
20
5

2SK3148
Reverse Drain Current vs.
Source to Drain Voltage
20
Pulse Test
16
DR
12
8
4
10 V
V = 0, –5 V
GS
5 V
Reverse Drain Current I (A)
0
0.2 0.4 0.6 0.8 1.0
Source to Drain Voltage V (V)
SD
Maximun Avalanche Energy vs.
Channel Temperature Derating
50
I = 20 A
AP
V = 50 V
AR
40
DD
duty < 0.1 %
Rg > 50
30
20
10
0
Repetive Avalanche Energy E (mJ)
25 50 75 100 125 150
Channel Temperature Tch (°C)
Avalanche WaveformAvalanche Test Circuit
Ω
Vin
15 V
V
DS
Monitor
Rg
50Ω
L
I
AP
Monitor
D. U. T
V
1
E = • L • I •
AR
2
I
AP
V
DD
I
D
V
DD
0
AP
2
DSS
V – V
DSS DD
V
DS
V
(BR)DSS
6

2SK3148
Normalized Transient Thermal Impedance vs. Pulse Width
3
s (t)
1
γ
D = 1
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.01
10 µ
0.02
0.01
1shot pulse
100 µ 1 m 10 m
Pulse Width PW (S)
Switching Time Test Circuit Waveform
Tc = 25°C
θ γ θ
ch – c(t) = s (t) • ch – c
θ
ch – c = 4.17 °C/W, Tc = 25°C
P
DM
PW
T
D =
100 m 1 10
PW
T
Vin Monitor
Vin
10 V
50Ω
D.U.T.
R
L
V
DD
= 30 V
Vout
Monitor
Vin
Vout
td(on)
10%
10%
90%
tr
90%
td(off)
90%
10%
t
f
7

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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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