
Silicon N-Channel Junction FET
Application
Low frequency low noise amplifier
Outline
TO-92 (2)
2SK291
1. Drain
2. Source
3. Gate
3
2
1

2SK291
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Gate to drain voltage V
Gate to source voltage V
Drain current I
Gate current I
GDO
GSO
D
G
Channel power dissipation Pch 300 mW
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Gate to drain breakdown
V
(BR)GDO
voltage
Gate to source breakdown
V
(BR)GSO
voltage
Gate cutoff current I
Drain current I
Gate to source cutoff voltage V
GSS
DSS
GS(off)
Forward transfer admittance |yfs| 25 45 — mS V
Input capacitance Ciss — 8.5 — pF V
Noise voltage referred to input e
n
Note: 1. The 2SK291 is grouped by I
Grade P Q R S T
I
DSS
5 to 16 14 to 24 20 to 32 28 to 42 36 to 50
–15 — — V IG = –100 µA
–15 — — V IG = –100 µA
— — 10 nA VGS = –7 V, VDS = 0
1
*
5 — 50 mA VDS = 5 V, VGS = 0
— — –3.0 V V
— 1.2 — nV/√Hz V
as follows.
DSS
–15 V
–15 V
50 mA
5mA
= 5 V, ID = 100 µA
DS
= 5 V, VGS = 0, f = 1 kHz
DS
= 5 V, VGS = 0, f = 1 MHz
DS
= 5 V, ID = 5 mA, Rg = 0,
DS
f = 100 kHz
2

2SK291
Maximum Channel Power
Dissipation Curve
450
(mW)
ch
300
150
Channel Power Dissipation P
0
50 100 150
Ambient Temperature Ta (°C)
Typical Transfer Characteristics
30
VDS = 5 V
20
(mA)
D
Typical Output Characteristics
30
VDS = 5 V
= 0 V
V
GS
20
(mA)
D
–0.1
–0.2
–0.3
10
Drain Current I
–0.4
–0.5
–0.6
–0.8
0 246
Drain to Source Voltage V
DS
(V)
Forward Transfer Admittance vs.
Drain to Source Voltage
60
VDS = 5 V
(mS)
f = 1 kHz
50
fs
40
10
Drain Current I
0
–2.0 –1.2–1.6 –0.8 0–0.4
Gate to Source Voltage V
GS
(V)
30
20
10
0
Forward Transfer Admittance y
–2.0 –1.2–1.6 –0.8 0–0.4
Gate to Source Voltage V
GS
(V)
3

2SK291
Input Capacitance vs.
Gate to Source Voltage
14
12
(pF)
iss
VDS = 5 V
f = 1 MHz
10
8
6
Input Capacitance C
4
–1.0 –0.6–0.8 –0.4 0–0.2
Gate to Source Voltage V
Noise Voltage Referred
to Input vs. Frequency
50
√
VDS = 5 V
R
20
g
= 0
(nV/ Hz)
n
10
5
I
= 2 mA
D
2
5 mA
10 mA
1.0
GS
(V)
Noise Voltage Referred to Input vs.
Signal Source Resistance
20
√
10
VDS = 5 V
(nV/ Hz)
n
I
= 5 mA
D
5
Ta = 25°C
f = 120 Hz
2
100 kHz
1.0
0.5
Noise Voltage Referred to Input e
0.2
√
4 KTR
g
1 100
Signal Source Resistance Rg (Ω)
Noise Voltage Referred to Input vs.
Drain to Source Voltage
20
√
10
(nV/ Hz)
n
5
2
1.0
0.5
f = 1 kHz
100 kHz
1 k 10 k10
ID = 10 mA
R
= 0
g
Noise Voltage Referred to Input e
0.5
10 1 k
4
Frequency f (Hz)
Noise Voltage Referred to Input e
0.2
10 k 100 k100
0.2 1.0 5 200.5 2 10
Drain to Source Voltage V
DS
(V)

2SK291
Equivalent Noise Resistance vs.
Drain Current
1,000
(Ω)
500
eq
VDS = 5 V
f = 0.5~4 MHz
200
100
50
20
Equivalent Noise Resistance R
10
1 5 20 10021050
Drain Current I
(mA)
D
Equivalent Noise Resistance
vs. Frequency
70
60
VDS = 5 V
I
= 10 mA
D
(Ω)
eq
50
40
30
Equivalent Noise Resistance R
20
024135
Frequency f (MHz)
5

Unit: mm
0.60 Max
0.45 ± 0.1
4.8 ± 0.3
1.27
2.54
0.7
5.0 ± 0.2
2.3 Max
12.7 Min
3.8 ± 0.3
0.5
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
TO-92 (2)
Conforms
Conforms
0.25 g

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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
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failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
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