
2SK2800
Silicon N Channel MOS FET
High Speed Power Switching
Features
• Low on-resistance
R
= 15 mΩ typ.
DS(on)
• High speed switching
• Low drive current
• 4V gate drive device can be driven from 5V source
Outline
ADE-208-513G (Z)
8th. Edition
Jun 1998
TO–220AB
G
D
3
1. Gate
2. Drain (Flange)
3. Source
1
2
S

2SK2800
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body-drain diode reverse drain current I
Avalanche current I
Avalanche energy E
Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note 3
AP
Note 3
AR
Note1
Note 2
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW ≤ 10µs, duty cycle ≤ 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50Ω
60 V
±20 V
40 A
160 A
40 A
40 A
137 mJ
50 W
2

2SK2800
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
Gate to source breakdown voltage V
Gate to source leak current I
Zero gate voltege drain current I
Gate to source cutoff voltage V
Static drain to source on state R
resistance R
(BR)DSS
(BR)GSS
GSS
DSS
GS(off)
DS(on)
DS(on)
60——V I
±20——V I
——±10 µAVGS = ±16V, VDS = 0
——10µAVDS = 60 V, VGS = 0
1.5 — 2.5 V ID = 1mA, VDS = 10V
—1520mΩID = 20A, VGS = 10V
—2540mΩID = 20A, VGS = 4V
Forward transfer admittance |yfs| 2035—S ID = 20A, VDS = 10V
Input capacitance Ciss — 1500 — pF VDS = 10V
Output capacitance Coss — 720 — pF VGS = 0
Reverse transfer capacitance Crss — 200 — pF f = 1MHz
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Body–drain diode forward voltage V
Body–drain diode reverse
t
d(on)
r
d(off)
f
DF
rr
— 20 — ns ID = 20A, RL = 1.5Ω
— 180 — ns VGS = 10V
— 200 — ns
— 200 — ns
— 0.95 — V IF = 40A, VGS = 0
—70—V I
recovery time
Note: 4. Pulse test
= 10mA, VGS = 0
D
= ±100µA, VDS = 0
G
= 40A, VGS = 0
F
diF/ dt =50A/µs
Note4
Note4
Note4
3

2SK2800
Main Characteristics
100
Power vs. Temperature Derating
75
50
25
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
50
10 V
6 V
40
4.5 V
4 V
1000
Maximum Safe Operation Area
300
100
D
30
10
3
Operation in
1
this area is
limited by R
Drain Current I (A)
0.3
Ta = 25 °C
0.1
0.1 0.3 1
Drain to Source Voltage V (V)
Typical Transfer Characteristics
50
V = 10 V
DS
Pulse Test
40
10 µs
100 µs
PW = 10 ms (1shot)
DC Operation (Tc = 25°C)
DS(on)
3
10
1 ms
30
DS
100
D
30
20
Drain Current I (A)
10
0
Drain to Source Voltage V (V)
4
Pulse Test
3.5 V
V = 3 V
GS
246810
DS
D
30
Tc = 75°C
20
Drain Current I (A)
10
0
12345
Gate to Source Voltage V (V)
25°C
–25°C
GS

2SK2800
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
2.0
Pulse Test
1.6
DS(on)
V (V)
1.2
I = 50 A
0.8
0.4
Drain to Source Saturation Voltage
0
48
Gate to Source Voltage V (V)
D
20 A
10 A
12
16 20 1 10 100250
GS
Static Drain to Source on State Resistance
vs. Temperature
0.05
Pulse Test
W
0.04
DS(on)
R ( )
0.03
V = 4 V
GS
0.02
I = 20 A
D
50 A
10, 20 A
0.01
10 V
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
10 A
Static Drain to Source on State Resistance
vs. Drain Current
0.5
Pulse Test
0.2
0.1
DS(on)
R ( )W
0.05
V = 4 V
GS
0.02
0.01
Drain to Source On State Resistance
0.005
10 V
205
Drain Current I (A)
D
Forward Transfer Admittance vs.
Drain Current
100
fs
50
20
10
Tc = –25 °C
25 °C
75 °C
5
2
Forward Transfer Admittance |y | (S)
1
1
5
2
Drain Current I (A)
V = 10 V
DS
Pulse Test
10 20 50
D
100
5

2SK2800
Body–Drain Diode Reverse
Recovery Time
1000
500
200
100
50
20
Reverse Recovery Time trr (ns)
10
di / dt = 50 A / µs
V = 0, Ta = 25 °C
GS
0.1 0.3 1 3 10 30 100
Reverse Drain Current I (A)
DR
Dynamic Input Characteristics
100
I = 40 A
D
80
DS
60
V
DS
V = 10 V
DD
25 V
50 V
V
GS
40
20
Drain to Source Voltage V (V)
0
V = 50 V
DD
25 V
10 V
8 16243240
Gate Charge Qg (nc)
Typical Capacitance vs.
5000
2000
1000
500
200
Capacitance C (pF)
100
50
Drain to Source Voltage
01020304050
Drain to Source Voltage V (V)
Switching Characteristics
20
16
GS
1000
300
100
12
30
8
10
4
Switching Time t (ns)
3
Gate to Source Voltage V (V)
0
1
0.1 0.3 1 3 10 30 100
Drain Current I (A)
V = 0
GS
f = 1 MHz
Ciss
Coss
Crss
DS
t
d(off)
t
f
t
r
t
d(on)
V = 10 V, V = 30 V
GS
DD
PW = 5 µs, duty < 1 %
D
6

2SK2800
Reverse Drain Current vs.
Source to Drain Voltage
50
40
DR
10 V
30
5 V
V = 0, –5 V
20
GS
10
Reverse Drain Current I (A)
0
0.4 0.8 1.2 1.6 2.0
Source to Drain Voltage V (V)
Avalanche Test Circuit Avalanche Waveform
V
DS
Monitor
Rg
Vin
15 V
50W
Pulse Test
SD
L
I
AP
Monitor
D. U. T
Maximum Avalanche Energy vs.
Channel Temperature Derating
200
AR
160
120
80
40
0
Repetitive Avalanche Energy E (mJ)
25 50 75 100 125 150
Channel Temperature Tch (°C)
1
E = • L • I •
AR
2
I
AP
V
DD
I
D
V
DD
0
AP
2
I = 40 A
AP
V = 25 V
DD
duty < 1 %
Rg > 50
W
V
DSS
V – V
DSS DD
V
DS
V
(BR)DSS
7

2SK2800
3
Normalized Transient Thermal Impedance vs. Pulse Width
s (t)
1
g
D = 1
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.02
0.01
1shot pulse
0.01
10 µ
100 µ 1 m 10 m
Pulse Width PW (S)
Tc = 25°C
q g q
ch – c(t) = s (t) • ch – c
q
ch – c = 2.5 °C/W, Tc = 25 °C
P
DM
PW
T
D =
100 m 1 10
PW
T
Switching Time Test Circuit Waveform
R
L
V
= 30 V
Vout
Monitor
DD
Vin
Vout
td(on)
10%
10%
90%
tr
90%
td(off)
90%
10%
t
f
Vin Monitor
Vin
10 V
D.U.T.
50W
8

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for maximum rating, operating supply voltage range, heat radiation characteristics, installation
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