Datasheet 2SK2645-01MR Datasheet

Page 1
2SK2645-01MR
Fuji Semiconductor, Inc. - P.O. Box 702708 - Dallas, TX 75370 - 972-733-1700 - www.fujisemiconductor.com
FAP-IIS Series
N-channel MOS-FET
600V 1,2Ω 9A 50W
>Features > Outline Drawing
-High Speed Switching
-Low On-Resistance
-No Secondary Breakdown
-High Voltage
GS = ± 30V Guarantee
-V
-Repetitive Avalanche Rated
>Applications
-Switching Regulators
-UPS
-DC-DC converters
-General Purpose Power Amplifier
>Maximum Ratings and Characteristics > Equivalent Circuit
-Absolute Maximum Ratings (TC=25°C), unless otherwise specified
Item Symbol Rating Unit Drain-Source-Voltage V Continous Drain Current I Pulsed Drain Current I Gate-Source-Voltage V Repetitive or Non-Repetitive (T
≤ 150°C)
ch
Avalanche Energy E Max. Power Dissipation P Operating and Storage Temperature Range T
T
DS D D(puls) GS
I
AR AS D ch stg
-55 ~ +150 °C
600 V
9 A
32 A
±30 V
9 A
71,9 mJ
50 W
150 °C
Electrical Characteristics (T
-
=25°C), unless otherwise specified
C
Item Symbol Test conditions Min. Typ. Max. Unit Drain-Source Breakdown-Voltage V Gate Threshhold Voltage V Zero Gate Voltage Drain Current I
Gate Source Leakage Current I Drain Source On-State Resistance R Forward Transconductance g Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Turn-On-Time t
Turn-Off-Time t
(ton=t
on
d(on)+tr
off (ton=td(off)+tf
)
)
Avalanche Capability I Diode Forward On-Voltage V Reverse Recovery Time t Reverse Recovery Charge Q
(BR)DSS ID GS(th) ID DSS VDS
GSS VGS DS(on) ID fs ID iss VDS oss VGS rss
t
d(on)
t
r ID
t
d(off)
t
f AV SD IF rr IF=IDR rr
=1mA VGS=0V =1mA V
=600V Tch=25°C
V
=0V Tch=125°C
GS
=±30V VDS=0V =4A VGS=10V =4A VDS=25V
VCC=300V
RGS=10 Ω
L = 100µH
=2x IDR VGS=0V Tch=25°C
-dIF/dt=100A/µs Tch=25°C
DS=VGS
=25V
=0V
f=1MHz 70 110 pF
=9A
VGS=10V
=25°C
T
ch
VGS=0V
600 V
3,5 4,0 4,5 V
10 500 µA
0,2 1,0 mA
10 100 nA
1,0 1,2
2,5 5 S
900 1400 pF 150 230 pF
25 40 ns 70 110 ns 60 90 ns 35 60 ns
9 A
1,0 1,5 V
550 ns
7,0 µC
Ω
- Thermal Characteristics Item Symbol Test conditions Min. Typ. Max. Unit Thermal Resistance R
R
th(ch-a) th(ch-c)
channel to air 62,5 °C/W channel to case 2,5 °C/W
Collmer Semiconductor - P.O. Box 702708 - Dallas TX - 75370 - 972.233.1589 - 972.233.0481 Fax - www.collmer.com - 11/98
Page 2
N-channel MOS-FET
2SK2645-01MR
FAP-IIS Series
Typical Output Characteristics
Drain-Source On-State Resistance vs. T
Typical Transfer Characteristics
→
→
→
Typical Drain-Source On-State-Resistance vs. I
Typical Forward Transconductance vs. I
Gate Threshold Voltage vs. T
→
→
→
Typical Capacitances vs. V
Typical Gate Charge Characteristic
Forward Characteristics of Reverse Diode
→
→
→
Avalanche Energy Derating
Safe Operation Area
→
→
→
This specification is subject to change without notice!
600V 1,2Ω 9A 50W
> Characteristics
ID=f(VDS); 80µs pulse test; TC=25°C
R
= f(Tch); ID=4A; VGS=10V
DS(on)
ch
ID=f(VGS); 80µs pulse test; VDS=25V; Tch=25°C
↑
↑
[A]
D
I
]
Ω
[
DS(ON)
R
1
VDS [V]
R
=f(ID); 80µs pulse test; TC=25°C
DS(on)
4
ID [A]
C=f(VDS); VGS=0V; f=1MHz
↑
]
Ω
[
DS(ON)
R
D
gfs=f(ID); 80µs pulse test; VDS=25V; Tch=25°C
2
Tch [°C]
D
↑
[S]
fs
g
DS
5
ID [A]
VGS=f(Qg); ID=9A; Tc=25°C
↑
[A]
D
I
3
VGS [V]
V
=f(Tch); ID=1mA; VDS=V
GS(th)
ch
GS
↑
[V]
GS(th)
V
IF=f(VSD); 80µs pulse test; VGS=0V
6
Tch [°C]
↑
C [F]
7
VDS [V]
Eas=f(starting Tch); VCC=60V; IAV=9A ID=f(VDS): D=0,01, Tc=25°C
↑
[V]
DS
V
↑ 10 ↑ 12
[A]
D
I
Eas [mJ]
Starting Tch [°C]
VDS [V]
8
Qg [nC]
↑
[K/W]
th(ch-c)
Z
↑ ↑
[V]
GS
V
[A]
F
I
VSD [V]
Transient Thermal impedance
Z
=f(t) parameter:D=t/T
thch
t [s]
9
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