Datasheet 2SK2554 Datasheet (HIT)

Page 1
2SK2554
Silicon N-Channel MOS FET
Application
High speed power switching
Features
• Low on-resistance
• High speed switching
• 4 V gate drive device can be driven from 5 V source
= 4.5 mΩ typ.
DS(on)
ADE-208-359 D
5th. Edition
Outline
TO-3P
G
D
1
2
3
1. Gate
2. Drain
S
(Flange)
3. Source
Page 2
2SK2554
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current IDR* Avalanche current IAP* Avalanche energy EAR* Channel dissipation Pch*
DSS
GSS
D
D(pulse)
1
*
2
3
3
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50 Ω
60 V ±20 V 75 A 300 A 75 A 50 A 214 mJ 150 W
2
Page 3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Gate to source leak current I Zero gate voltage drain current I Gate to source cutoff voltage V Static drain to source on state
R
GSS
DSS
GS(off)
DS(on)
resistance
Forward transfer admittance |yfs|5080—SI
Input capacitance Ciss — 7700 — pF VDS = 10 V Output capacitance Coss — 4100 — pF VGS = 0 Reverse transfer capacitance Crss — 760 — pF f = 1 MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
voltage Body to drain diode reverse
t
rr
recovery time Note: 1. Pulse Test
60 — — V ID = 10 mA, VGS = 0
±20 — — V IG = ±100 µA, VDS = 0
——±10 µAVGS = ±16 V, VDS = 0 — — 100 µAVDS = 60 V, VGS = 0
1.0 — 2.0 V ID = 1 mA, VDS = 10 V — 4.5 6 mΩ ID = 40 A
V
= 10 V*
GS
— 5.8 10 mΩ ID = 40 A
V
= 4 V*
GS
= 40 A
D
V
= 10 V*
DS
1
1
1
— 60 — ns ID = 40 A — 420 — ns VGS = 10 V — 1200 — ns RL = 0.75 Ω — 900 — ns — 0.95 — V IF = 75 A, VGS = 0
— 105 — ns IF = 75 A, VGS = 0
diF / dt = 50 A / µs
2SK2554
3
Page 4
2SK2554
200
Power vs. Temperature Derating
150
100
50
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
10 V
100
5 V 4 V
80
D
60
3 V
Pulse Test
500
Maximum Safe Operation Area
200 100
D
50 20
Operation in
10
this area is limited by R
5
DS(on)
Drain Current I (A)
2 1
Ta = 25 °C
0.5
0.1 0.3 1 Drain to Source Voltage V (V)
Typical Transfer Characteristics
100
V = 10 V
DS
Pulse Test
80
D
60
10 µs
100 µs
PW = 10 ms (1shot)
DC Operation (Tc = 25°C)
3
10
1 ms
30
DS
100
40
Drain Current I (A)
20
0
246810
Drain to Source Voltage V (V)
2.5 V
V = 2 V
GS
DS
40
25°C
–25°C
0
Tc = 75°C
12345
Drain Current I (A)
20
Gate to Source Voltage V (V)
GS
4
Page 5
2SK2554
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
0.5
0.4
DS(on)
Pulse Test
0.3 I = 50 A
D
0.2
0.1
Drain to Source Voltage V (V)
0
24
Gate to Source Voltage V (V)
6
810
GS
Static Drain to Source on State Resistance
vs. Temperature
0.02
Ω
DS(on)
R ( )
0.016
0.012
0.008
Pulse Test
V = 4 V
GS
I = 50 A
D
20 A 10 A
10, 20 A
Static Drain to Source on State Resistance
vs. Drain Current
0.5
Ω
0.2
0.1
0.05
DS(on)
R ( )
0.02
0.01
0.005
0.002
0.001
Drain to Source On State Resistance
0.0005
1 10 100 1000
3
V = 4 V
GS
30 300
Drain Current I (A)
Pulse Test
10 V
D
Forward Transfer Admittance vs.
Drain Current
500
V = 10 V
200
DS
Pulse Test
100
50
Tc = –25 °C
20 10
5
75 °C
25 °C
0.004
10 V
0
10, 20, 50 A
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
2 1
Forward Transfer Admittance |yfs| (S)
0.5
0.1
0.3 1 3 10 30 100 Drain Current I (A)
D
5
Page 6
2SK2554
Body to Drain Diode Reverse
Recovery Time
500
200
100
50
20
10
Reverse Recovery Time trr (ns)
5
di / dt = 50 A / µs V = 0, Ta = 25 °C
GS
0.1 0.3 1 3 10 30 100 Reverse Drain Current I (A)
DR
Dynamic Input Characteristics
100
I = 75 A
D
80
DS
60
V
DS
V = 10 V
DD
25 V 50 V
20
16
12
100000
30000
10000
3000
1000
Capacitance C (pF)
300
V = 0 f = 1 MHz
100
01020304050
Drain to Source Voltage V (V)
10000
3000
GS
1000
300
Typical Capacitance vs. Drain to Source Voltage
GS
Switching Characteristics
t
d(off)
t
f
t
r
Ciss
Coss
Crss
DS
40
20
V = 50 V
DD
Drain to Source Voltage V (V)
0
80 160 240 320 400
V
25 V 10 V
Gate Charge Qg (nc)
GS
8
100
Switching Time t (ns)
4
Gate to Source Voltage V (V)
0
30
V = 10 V, V = 30 V
GS
PW = 5 µs, duty < 1 %
10
0.1 0.3 1 3 10 30 100 Drain Current I (A)
DD
t
d(on)
D
6
Page 7
2SK2554
Reverse Drain Current vs.
Source to Drain Voltage
200
160
DR
10 V
120
5 V
80
V = 0, –5 V
GS
40
Reverse Drain Current I (A)
0
0.4 0.8 1.2 1.6 2.0
Source to Drain Voltage V (V)
Normalized Transient Thermal Impedance vs. Pulse Width
3
s (t)
1
γ
D = 1
Pulse Test
SD
Maximun Avalanche Energy vs.
Channel Temperature Derating
250
I = 50 A
AP
AR
200
V = 25 V
DD
duty < 0.1 % Rg > 50
150
100
50
0
Repetive Avalanche Energy E (mJ)
25 50 75 100 125 150
Channel Temperature Tch (°C)
Tc = 25°C
Ω
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.02
0.01
1shot pulse
0.01 10 µ
100 µ 1 m 10 m
Pulse Width PW (S)
θ γ θ
ch – c(t) = s (t) • ch – c
θ
ch – c = 0.83 °C/W, Tc = 25 °C
P
DM
PW
T
D =
100 m 1 10
PW
T
7
Page 8
2SK2554
Vin 15 V
Switching Time Test Circuit Waveform
V
DS
Monitor
Rg
50Ω
Avalanche Test Circuit and Waveform
AR
1 2
L
E = • L • I •
I
AP
Monitor
I
AP
D. U. T
V
DD
V
DD
0
V
2
AP
I
D
DSS
V – V
DSS DD
V
DS
V
(BR)DSS
Vin Monitor
Vin 10 V
50Ω
D.U.T.
R
L
V
DD
= 30 V
Vout Monitor
Vin
Vout
td(on)
10%
10%
90%
tr
90%
td(off)
90%
10%
t
f
8
Page 9
1.6
0.5
15.6 ± 0.3
φ3.2 ± 0.2
1.0
2.0
Unit: mm
4.8 ± 0.2
1.5
5.0 ± 0.3
19.9 ± 0.2
14.9 ± 0.2
0.3
1.4 Max
3.6
2.0
0.9
1.0
1.0 ± 0.2
5.45 ± 0.55.45 ± 0.5
18.0 ± 0.5
2.8
0.6 ± 0.2
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-3P — Conforms
5.0 g
Page 10
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