—35—nsID = 25 A
—230—nsVGS = 10 V
—470—nsRL = 1.2 Ω
—360—ns
—0.85—VIF = 50 A, VGS = 0
—135—nsIF = 50 A, VGS = 0
di
/ dt = 50 A / µs
F
2SK2529
3
Page 4
2SK2529
Power vs. Temperature Derating
40
30
20
10
Channel Dissipation Pch (W)
0
50100150200
Case Temperature Tc (°C)
Typical Output Characteristics
10 V
100
6 V
5 V
80
4 V
Pulse Test
3.5 V
500
Maximum Safe Operation Area
200
100
D
50
20
10
Operation in
this area is
5
Drain Current I (A)
limited by R
DS(on)
2
1
Ta = 25 °C
0.5
0.10.31
Drain to Source Voltage V (V)
Typical Transfer Characteristics
100
V = 10 V
DS
Pulse Test
80
10 µs
100 µs
PW = 10 ms (1shot)
1 ms
DC Operation (Tc = 25°C)
3
10
30
DS
100
D
60
40
Drain Current I (A)
20
0
246810
Drain to Source Voltage V (V)
3 V
V = 2.5 V
GS
DS
D
60
40
Tc = 75°C
Drain Current I (A)
20
0
12345
Gate to Source Voltage V (V)
25°C
–25°C
GS
4
Page 5
2SK2529
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
1.0
0.8
DS(on)
Pulse Test
0.6
I = 50 A
0.4
0.2
D
20 A
10 A
Drain to Source Voltage V (V)
0
24
Gate to Source Voltage V (V)
6
810
GS
Static Drain to Source on State Resistance
vs. Temperature
0.04
Ω
DS(on)
R ( )
0.032
0.024
0.016
0.008
Pulse Test
V = 4 V
GS
I = 50 A
D
10, 20, 50 A
10 V
0
Static Drain to Source on State Resistance
–4004080120160
Case Temperature Tc (°C)
10, 20 A
Static Drain to Source on State Resistance
vs. Drain Current
0.5
Ω
0.2
0.1
0.05
DS(on)
R ( )
0.02
0.01
0.005
0.002
0.001
Drain to Source On State Resistance
0.0005
1101001000
3
V = 4 V
GS
10 V
30300
Drain Current I (A)
Pulse Test
D
Forward Transfer Admittance vs.
Drain Current
500
V = 10 V
200
DS
Pulse Test
100
50
Tc = –25 °C
20
10
5
75 °C
25 °C
2
1
Forward Transfer Admittance |yfs| (S)
0.5
0.1
0.3131030100
Drain Current I (A)
D
5
Page 6
2SK2529
Body to Drain Diode Reverse
Recovery Time
5000
2000
1000
500
200
100
50
20
10
Reverse Recovery Time trr (ns)
5
0.3131030100
0.1
di / dt = 50 A / µs
V = 0, Ta = 25 °C
GS
Reverse Drain Current I (A)
Dynamic Input Characteristics
100
I = 50 A
D
80
DS
V = 10 V
DD
60
V
DS
25 V
50 V
40
20
Drain to Source Voltage V (V)
0
4080120160200
V = 50 V
DD
25 V
10 V
Gate Charge Qg (nc)
V
DR
GS
Typical Capacitance vs.
Drain to Source Voltage
10000
5000
2000
1000
500
Capacitance C (pF)
200
V = 0
GS
f = 1 MHz
100
01020304050
Drain to Source Voltage V (V)
Switching Characteristics
20
5000
2000
GS
1000
16
500
12
200
100
8
4
50
Switching Time t (ns)
20
10
Gate to Source Voltage V (V)
0
5
0.1
0.3131030100
Drain Current I (A)
Ciss
Coss
Crss
DS
t
d(off)
t
f
t
r
t
d(on)
V = 10 V, V = 30 V
GS
DD
PW = 5 µs, duty < 1 %
D
6
Page 7
2SK2529
Reverse Drain Current vs.
Source to Drain Voltage
100
80
DR
10 V
60
40
5 V
V = 0, –5 V
GS
20
Reverse Drain Current I (A)
0
0.40.81.21.62.0
Source to Drain Voltage V (V)
Normalized Transient Thermal Impedance vs. Pulse Width
3
s (t)
1
γ
D = 1
Pulse Test
SD
Maximun Avalanche Energy vs.
Channel Temperature Derating
200
I = 45 A
AP
AR
160
V = 25 V
DD
duty < 0.1 %
Rg > 50
Ω
120
80
40
0
Repetive Avalanche Energy E (mJ)
255075100125150
Channel Temperature Tch (°C)
Tc = 25°C
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.01
10 µ
0.02
0.01
1shot pulse
100 µ1 m10 m
Pulse Width PW (S)
θ γ θ
ch – c(t) = s (t) • ch – c
θ
ch – c = 3.57 °C/W, Tc = 25 °C
P
DM
PW
T
D =
100 m110
PW
T
7
Page 8
2SK2529
Vin
15 V
Switching Time Test CircuitWaveform
V
DS
Monitor
Rg
50Ω
Avalanche Test Circuit and Waveform
AR
1
2
L
E = • L • I •
I
AP
Monitor
I
AP
D. U. T
V
DD
V
DD
0
V
2
AP
I
D
DSS
V – V
DSSDD
V
DS
V
(BR)DSS
Vin Monitor
Vin
10 V
50Ω
D.U.T.
R
L
V
DD
= 30 V
Vout
Monitor
Vin
Vout
td(on)
10%
10%
90%
tr
90%
td(off)
90%
10%
t
f
8
Page 9
Unit: mm
1.0 ± 0.2
1.15 ± 0.2
0.6 ± 0.1
10.0 ± 0.3
2.542.54
φ
3.2 ± 0.2
12.0 ± 0.3
2.5 ± 0.2
4.1 ± 0.3
4.5 ± 0.3
2.7 ± 0.2
15.0 ± 0.3
13.60 ± 1.0
0.7 ± 0.1
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
TO-220CFM
—
—
1.9 g
Page 10
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore): http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
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