Datasheet 2SK2529 Datasheet (HIT)

Page 1
2SK2529
Silicon N-Channel MOS FET
Application
High speed power switching
Features
• Low on-resistance
• High speed switching
• 4 V gate drive device can be driven from 5 V source
= 7 mΩ typ.
DS(on)
ADE-208-356F
7th. Edition
Outline
TO-220CFM
G
D
S
1
2
3
1. Gate
2. Drain
3. Source
Page 2
2SK2529
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I Avalanche current IAP* Avalanche energy EAR* Channel dissipation Pch*
DSS
GSS
D
D(pulse)
DR
1
*
3
3
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes 1. PW ≤ 10 µs, duty cycle ≤ 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50 Ω
60 V ±20 V 50 A 200 A 50 A 45 A 174 mJ 35 W
2
Page 3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Gate to source leak current I Zero gate voltage drain current I Gate to source cutoff voltage V Static drain to source on state
R
GSS
DSS
GS(off)
DS(on)
resistance
Forward transfer admittance |yfs|3555—SI
Input capacitance Ciss — 3550 — pF VDS = 10 V Output capacitance Coss — 1760 — pF VGS = 0 Reverse transfer capacitance Crss — 500 — pF f = 1 MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
voltage Body to drain diode reverse
t
rr
recovery time Note 1. Pulse Test
60 — — V ID = 10 mA, VGS = 0
±20 — — V IG = ±100 µA, VDS = 0
——±10 µAVGS = ±16 V, VDS = 0 ——10µAVDS = 60 V, VGS = 0
1.0 — 2.0 V ID = 1 mA, VDS = 10 V — 7 10 mΩ ID = 25 A
V
= 10 V*
GS
—1016mΩI
= 25 A
D
V
= 4 V*
GS
= 25 A
D
V
= 10 V*
DS
1
1
1
— 35 — ns ID = 25 A — 230 — ns VGS = 10 V — 470 — ns RL = 1.2 Ω — 360 — ns — 0.85 — V IF = 50 A, VGS = 0
— 135 — ns IF = 50 A, VGS = 0
di
/ dt = 50 A / µs
F
2SK2529
3
Page 4
2SK2529
Power vs. Temperature Derating
40
30
20
10
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
10 V
100
6 V
5 V
80
4 V
Pulse Test
3.5 V
500
Maximum Safe Operation Area
200 100
D
50 20
10
Operation in this area is
5
Drain Current I (A)
limited by R
DS(on)
2 1
Ta = 25 °C
0.5
0.1 0.3 1 Drain to Source Voltage V (V)
Typical Transfer Characteristics
100
V = 10 V
DS
Pulse Test
80
10 µs
100 µs
PW = 10 ms (1shot)
1 ms
DC Operation (Tc = 25°C)
3
10
30
DS
100
D
60
40
Drain Current I (A)
20
0
246810
Drain to Source Voltage V (V)
3 V
V = 2.5 V
GS
DS
D
60
40
Tc = 75°C
Drain Current I (A)
20
0
12345
Gate to Source Voltage V (V)
25°C
–25°C
GS
4
Page 5
2SK2529
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
1.0
0.8
DS(on)
Pulse Test
0.6
I = 50 A
0.4
0.2
D
20 A 10 A
Drain to Source Voltage V (V)
0
24
Gate to Source Voltage V (V)
6
810
GS
Static Drain to Source on State Resistance
vs. Temperature
0.04
Ω
DS(on)
R ( )
0.032
0.024
0.016
0.008
Pulse Test
V = 4 V
GS
I = 50 A
D
10, 20, 50 A
10 V
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
10, 20 A
Static Drain to Source on State Resistance
vs. Drain Current
0.5
Ω
0.2
0.1
0.05
DS(on)
R ( )
0.02
0.01
0.005
0.002
0.001
Drain to Source On State Resistance
0.0005
1 10 100 1000
3
V = 4 V
GS
10 V
30 300
Drain Current I (A)
Pulse Test
D
Forward Transfer Admittance vs.
Drain Current
500
V = 10 V
200
DS
Pulse Test
100
50
Tc = –25 °C
20 10
5
75 °C
25 °C
2 1
Forward Transfer Admittance |yfs| (S)
0.5
0.1
0.3 1 3 10 30 100 Drain Current I (A)
D
5
Page 6
2SK2529
Body to Drain Diode Reverse
Recovery Time
5000 2000
1000
500 200
100
50 20
10
Reverse Recovery Time trr (ns)
5
0.3 1 3 10 30 100
0.1
di / dt = 50 A / µs V = 0, Ta = 25 °C
GS
Reverse Drain Current I (A)
Dynamic Input Characteristics
100
I = 50 A
D
80
DS
V = 10 V
DD
60
V
DS
25 V 50 V
40
20
Drain to Source Voltage V (V)
0
40 80 120 160 200
V = 50 V
DD
25 V 10 V
Gate Charge Qg (nc)
V
DR
GS
Typical Capacitance vs.
Drain to Source Voltage
10000
5000
2000
1000
500
Capacitance C (pF)
200
V = 0
GS
f = 1 MHz
100
01020304050
Drain to Source Voltage V (V)
Switching Characteristics
20
5000 2000
GS
1000
16
500
12
200 100
8
4
50
Switching Time t (ns)
20 10
Gate to Source Voltage V (V)
0
5
0.1
0.3 1 3 10 30 100 Drain Current I (A)
Ciss
Coss
Crss
DS
t
d(off)
t
f
t
r
t
d(on)
V = 10 V, V = 30 V
GS
DD
PW = 5 µs, duty < 1 %
D
6
Page 7
2SK2529
Reverse Drain Current vs.
Source to Drain Voltage
100
80
DR
10 V
60
40
5 V
V = 0, –5 V
GS
20
Reverse Drain Current I (A)
0
0.4 0.8 1.2 1.6 2.0
Source to Drain Voltage V (V)
Normalized Transient Thermal Impedance vs. Pulse Width
3
s (t)
1
γ
D = 1
Pulse Test
SD
Maximun Avalanche Energy vs.
Channel Temperature Derating
200
I = 45 A
AP
AR
160
V = 25 V
DD
duty < 0.1 % Rg > 50
Ω
120
80
40
0
Repetive Avalanche Energy E (mJ)
25 50 75 100 125 150
Channel Temperature Tch (°C)
Tc = 25°C
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.01 10 µ
0.02
0.01
1shot pulse
100 µ 1 m 10 m
Pulse Width PW (S)
θ γ θ
ch – c(t) = s (t) • ch – c
θ
ch – c = 3.57 °C/W, Tc = 25 °C
P
DM
PW T
D =
100 m 1 10
PW
T
7
Page 8
2SK2529
Vin 15 V
Switching Time Test Circuit Waveform
V
DS
Monitor
Rg
50Ω
Avalanche Test Circuit and Waveform
AR
1 2
L
E = • L • I •
I
AP
Monitor
I
AP
D. U. T
V
DD
V
DD
0
V
2
AP
I
D
DSS
V – V
DSS DD
V
DS
V
(BR)DSS
Vin Monitor
Vin 10 V
50Ω
D.U.T.
R
L
V
DD
= 30 V
Vout Monitor
Vin
Vout
td(on)
10%
10%
90%
tr
90%
td(off)
90%
10%
t
f
8
Page 9
Unit: mm
1.0 ± 0.2
1.15 ± 0.2
0.6 ± 0.1
10.0 ± 0.3
2.542.54
φ
3.2 ± 0.2
12.0 ± 0.3
2.5 ± 0.2
4.1 ± 0.3
4.5 ± 0.3
2.7 ± 0.2
15.0 ± 0.3
13.60 ± 1.0
0.7 ± 0.1
Hitachi Code JEDEC EIAJ
(reference value)
Weight
TO-220CFM — —
1.9 g
Page 10
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223
Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533
Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Loading...