Datasheet 2SK216, 2SK215, 2SK213, 2SK214 Datasheet (HIT)

Page 1
2SK213, 2SK214, 2SK215, 2SK216
Silicon N-Channel MOS FET
Application
High frequency and low frequency power amplifier, high speed switching.
Complementary pair with 2SJ76, J77, J78, J79
Features
Suitable for direct mounting
High forward transfer admittance
Enhancement-mode
Outline
TO-220AB
G
1
D
S
2
3
1. Gate
2. Source (Flange)
3. Drain
Page 2
2SK213, 2SK214, 2SK215, 2SK216
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage 2SK213 V
DSX
2SK214 160 2SK215 180
2SK216 200 Gate to source voltage V Drain current I Body to drain diode reverse drain current I
GSS
D
DR
Channel dissipation Pch 1.75 W
1
Pch* Channel temperature Tch 150 °C Storage temperature Tstg –45 to +150 °C
Note: 1. Value at TC = 25°C
Electrical Characteristics (Ta = 25°C)
140 V
±15 V 500 mA 500 mA
30 W
Item Symbol Min Typ Max Unit Test conditions Drain to source 2SK213 V
(BR)DSX
140 V ID = 1 mA, VGS = –2 V
breakdown voltage 2SK214 160 V
2SK215 180 V 2SK216 200 V
Gate to source breakdown
V
(BR)GSS
±15——V I
= ±10 µA, VDS = 0
G
voltag Gate to source voltage V Drain to source saturation
V
GS(on)
DS(sat)
0.2 1.5 V ID = 10 mA, VDS = 10 V * — 2.0 V ID = 10 mA, VGD = 0 *
1
voltage Forward transfer admittance |yfs|2040—mSI
= 10 mA, VDS = 20 V *
D
Input capacitance Ciss 90 pF ID = 10 mA, VDS = 10 V, Reverse transfer capacitance Crss 2.2 pF f = 1 MHz
Note: 1. Pulse test
1
1
2
Page 3
2SK213, 2SK214, 2SK215, 2SK216
Power vs. Temperature Derating
60
(W)
40
20
Channel Dissipation Pch
50 1000
Case Temperature T
Typical Output Characteristics
50
TC = 25°C
40
(mA)
D
30
C
(°C)
0.8
0.7
0.6
150
500
Typical Output Characteristics
400
(mA)
D
300
200
Drain Current I
100
Drain to Source Voltage V
Typical Transfer Characteristics
500
VDS = 20 V
400
(mA)
D
300
3.5
= –25°C
C
T
12
25
TC = 25°C
3.0
2.5
2.0
1.5
1.0
V
= 0.5 V
GS
1684020
(V)
DS
75
20
Drain Current I
10
Drain to Source Voltage V
60
0.5
0.4
0.3
0.2
VGS = 0.1V
8040200 100
(V)
DS
200
Drain Current I
100
0
Gate Source Voltage V
3
42105
(V)
GS
3
Page 4
2SK213, 2SK214, 2SK215, 2SK216
Typical Transfer Characteristics
100
VDS = 20 V
80
(mA)
D
60
40
Drain Current I
20
0
Gate Source Voltage V
25
= –25°C
C
T
1.2
75
500
100
1.60.80.40 2.0 (V)
GS
Forward Transfer Admittance
vs. Frequency
200
100
50
20
10
Forward Transfer Admittance yfs (mS)
Forward Transfer Admittance
vs. Drain Current
5
Drain Current I
TC = 25°C
= 20 V
V
DS
20
D
50
(mA)
1001052 200
10
1.0
0.1
0.05
Forward Transfer Admittance yfs (mS)
5 k
TC = 25°C V
DS
= 10 mA
I
D
10 k
= 20 V
100 k
Frequency f (H
1 M
50 M
10 M
Z)
4
Page 5
11.5 MAX
Unit: mm
2.79 ± 0.218.5 ± 0.57.8 ± 0.5
1.27
2.54 ± 0.5
10.16 ± 0.2
9.5
8.0
φ 3.6
-0.08
1.5 MAX
0.76 ± 0.1
2.54 ± 0.5
+0.2
6.4
–0.1
+0.1
4.44 ± 0.2
1.26 ± 0.15
2.7 MAX
14.0 ± 0.5 15.0 ± 0.3
0.5 ± 0.1
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-220AB Conforms Conforms
1.8 g
Page 6
Cautions
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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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