Datasheet 2SK2123 Datasheet (Panasonic)

Power F-MOS FETs

2SK2123

Silicon N-Channel Power F-MOS FET

■ Features

●Avalanche energy capacity guaranteed: EAS > 100mJ

●V

= ±30V guaranteed

GSS

●High-speed switching: t

●No secondary breakdown

■ Applications

●Contactless relay

●Diving circuit for a solenoid

●Driving circuit for a motor

●Control equipment

●Switching power supply

■ Absolute Maximum Ratings (T

Parameter

Drain to Source breakdown voltage
Gate to Source voltage

Drain current

Avalanche energy capacity
Allowable power
dissipation
Channel temperature
Storage temperature

*

L = 8mH, IL = 5A, VDD = 50V, 1 pulse

= 35ns

f

DC
Pulse

TC = 25°C
Ta = 25°C

Symbol

V

DSS

V

GSS

I

D

I

DP

*

EAS

P

D

T

ch

T

stg

= 25°C)

C

Ratings

−55 to +150

450
±30

±5
±15
100

50

2

150

Unit

V
V
A
A

mJ

W

°C
°C

φ3.2±0.1

15.0±0.313.7

–0.2

+0.5

8.0±0.2

4.1±0.2

Solder Dip

7

9.9±0.3

231

3.0±0.2

1.2±0.15

1.45±0.15

0.75±0.1

2.54±0.2

5.08±0.4

unit: mm

4.6±0.2

2.9±0.2

2.6±0.1

0.7±0.1

1: Gate
2: Drain
3: Source

TO-220E Package

■ Electrical Characteristics (T

Parameter

Drain to Source cut-off current
Gate to Source leakage current
Drain to Source breakdown voltage
Gate threshold voltage
Drain to Source ON-resistance
Forward transfer admittance
Diode forward voltage
Input capacitance (Common Source)
Output capacitance (Common Source)
Reverse transfer capacitance (Common Source)
Turn-on time (delay time)
Rise time
Fall time
Turn-off time (delay time)
Thermal resistance between channel and case

C

Symbol

I

DSS

I

GSS

V

DSS

V

th

R

DS(on)

| Yfs |
V

DSF

C

iss

C

oss

C

rss

t

d(on)

t

r

t

f

t

d(off)

R

th(ch-c)

= 25°C)

Conditions

VDS = 360V, VGS = 0
VGS = ±30V, VDS = 0
ID = 1mA, VGS = 0
VDS = 25V, ID = 1mA
VGS = 10V, ID = 3A
VDS = 25V, ID = 3A
IDR = 5A, VGS = 0

VDS = 20V, VGS = 0, f = 1MHz

VGS = 10V, ID = 3A
VDD = 150V, RL = 50Ω

min

450

2

2

typ

1

2.5

700
100

40
25
45
35
80

max

0.1
±1

5

1.3

−1.2

2.5

Unit

mA

µA

V
V

Ω

S

V
pF
pF
pF

ns
ns
ns
ns

°C/W

1

Power F-MOS FETs 2SK2123

Area of safe operation (ASO) PD  Ta EAS  T

100

30

I

DP

10

)

I

A

D

(

D

3

1

0.3

Drain current I

0.1

0.03

0.01
1 10 1003 30 300 1000

Non repetitive pulse
T

1ms
10ms

=25˚C

C

t=100µs

DC

Drain to source voltage VDS (V

ID  V

DS

8

7

VGS=15V

10V

6

)

A

(

D

Drain current I

6.5V

5

4

3

2

1

0

0 102030405060

6V

5.5V

Drain to source voltage VDS (V

T

5V

=25˚C

C

)

50W

4.5V

)

60

)
W

(

50

D

40

30

20

10

Allowable power dissipation P

0

020

(1) TC=Ta
(2) Without heat sink

=2W)

(P

D

(1)

(2)

40 60 80 100 120 140 160

Ambient temperature Ta (˚C

ID  V

GS

10

8

)
A

(

D

6

4

TC=0˚C 150˚C

25˚C

100˚C

Drain current I

2

0

012108264

Gate to source voltage VGS (V

VDS=25V

120

)
mJ

(

100

80

60

40

20

Avalanche energy capacity EAS

0

25 50

)

)

Junction temperature Tj (˚C

6

)

5

V

(

th

4

3

2

1

Gate threshold voltage V

0

0 25 50 75 100 125 150

Case temperature TC (˚C

j

VDD=50V
I

=5A

D

75 100 125 150 175

)

Vth  T

C

VDS=25V

=1mA

I

D

)

VDS  V

40

35

)

V

(

30

DS

25

20

15

10

Drain to source voltage V

5

0

0 5 10 15 20 25 30

Gate to source voltage VGS (V

2

GS

TC=25˚C

10A

5A

2.5A

R

 I

DS(on)

6

)

Ω

(

5

DS(on)

4

3

2

1

Drain to source ON-resistance R

0

0108264

)

Drain current ID (A

T

C

=150˚C

100˚C

25˚C

0˚C

D

VGS=10V

)

3.0

)
S

(

2.5

|

fs

2.0

1.5

1.0

0.5

Forward transfer admittance |Y

0

012345

| Yfs |  I

VDS=25V
T

=25˚C

C

Drain current ID (A

D

)

Power F-MOS FETs 2SK2123

C

, C

, C

iss

oss

10000

)

,

)

pF

(

3000

rss

,C

Common source

(

1000

oss

,C

iss

300

C

)

100

, Output capacitance

)

30

Common source

(

Common source

(

10

3

Input capacitance

Reverse transfer capacitance

1

0 50 100 150 200 250

Drain to source voltage VDS (V

1000

Notes: Rth was measured at Ta=25˚C

)

˚C/W

(

100

(t)

th

10

and under natural convection.

=10V × 0.2A(2W) and without heat sink

(1) P

T

(2) P

=10V × 1.0A(10W) and

T

with a 100 × 100 × 2mm Al heat sink

rss

 V

DS

f=1MHz

=25˚C

T

C

C

C

C

400

350

)
V

(

300

DS

iss

250

200

oss

rss

150

100

Drain to source voltage V

50

)

R

 t

th(t)

VDS, VGS  Q

ID=5A

=25˚C

T

C

V

0

0 102030405060

Gate charge amount Qg (nC

VDS=90V

DS

225V
330V

V

GS

g

)

(1)

(2)

20

15

10

5

0

120

)

)
V

ns

100

(

(

GS

d(off)

80

,t

f

,t

r

,t

d(on)

60

40

20

Gate to source voltage V

Switching time t

0

012345

t

, tr, tf, t

d(on)

d(off)

t

r

t

f

Drain current ID (A

 I

VDD=150V
V
T

t

d(off)

t

d(on)

GS

=25˚C

C

)

D

=10V

1

Thermal resistance R

0.1

–4

10

–3

10

–2

10

–1

10

11010210

Time t (s

)

3

4

10

3