Datasheet 2SK2110 Datasheet (NEC)

Page 1
DATA SHEET
Source (S)
Internal diode
Gate protection diode
Gate (G)
Drain (D)
PIN CONNECTIONS
S: Source D: Drain G: Gate
Marking: NT
MOS FIELD EFFECT TRANSISTOR
N-CHANNEL MOS FET
FOR HIGH-SPEED SWITCHING
2SK2110
The 2SK2110 is a N-channel MOS FET of a vertical type and is a switching element that can be directly driven by the output of an IC operating at 5 V.
This product has a low ON resistance and superb switching characteristics and is ideal for driving the actuators, such as motors and DC/DC converters.

FEATURES

• Low ON resistance
RDS(on) = 1.5 MAX. @VGS = 4.0 V, ID = 0.3 A
• High switching speed
on + toff < 100 ns
t
• Low parasitic capacitance
ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C)
PACKAGE DIMENSIONS (in mm)
4.5 ± 0.1
2.5 ± 0.1
4.0 ± 0.25
1.5 ± 0.1
+0.03
–0.05
0.8 MIN.
1.6 ± 0.2
S
1.5
3.0
D
G
0.42 ±0.06

EQUIVALENT CIRCUIT

PARAMETER SYMBOL TEST CONDITIONS RATING UNIT Drain to Source Voltage VDSS VGS = 0 100 V Gate to Source Voltage VGSS VDS = 0 ±20 V Drain Current (DC) ID(DC) ±0.5 A Drain Current (Pulse) ID(pulse) PW 10 ms, ±1.0 A
Total Power Dissipation PT 16 cm2 × 0.7 mm, ceramic substrate used 2.0 W Channel Temperature Tch 150 ˚C Storage Temperature Tstg –55 to +150 ˚C
Document No. D11230EJ2V0DS00 (2nd edition) Date Published June 1996 P Printed in Japan
Duty cycle 50 %
1996
Page 2
ELECTRICAL CHARACTERISTICS (TA = 25 ˚C)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Drain Cut-Off Current IDSS VDS = 100 V, VGS = 0 1.0 Gate Leakage Current IGSS VGS = ±20 V, VDS = 0 ±10 Gate Cut-Off Voltage VGS(off) VDS = 10 V, ID = 1 mA 0.8 1.5 2.0 V Forward Transfer Admittance |yfs|VDS = 10 V, ID = 0.3 A 0.4 S Drain to Source On-State Resistance Drain to Source On-State Resistance Input Capacitance Ciss VDS = 10 V, VGS = 0, 100 pF Output Capacitance Coss Reverse Transfer Capacitance Crss 10 pF Turn-On Delay Time td(on) VDD = 25 V, ID = 0.3 A 2 ns Rise Time tr Turn-Off Delay Time td(off) Fall Time tf 13 ns
RDS(on)1 VGS = 4.0 V, ID =0.3 A 0.95 1.5 RDS(on)2 VGS = 10 V, ID = 0.3 A 0.82 1.2
f = 1.0 MHz
VGS(on) = 10 V, RG = 10 RL = 83
38 pF
1.3 ns 38 ns
2SK2110
µ
A
µ
A
2
Page 3
TYPICAL CHARACTERISTICS (TA = 25 ˚C)
2SK2110
DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA
100
80
60
40
20
dT - Derating Factor - %
0 30 60 90 120 150
T
A
- Ambient Temperature - ˚C
DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE
1.0
3.0 V
2.5 V
0.8
0.6
10 V
4.5 V
4.0 V
3.5 V
0.4
- Drain Current - A
D
I
0.2
VGS = 2.0 V
FORWARD BIAS SAFE OPERATING AREA
10
5
2
1
0.5
- Drain Current - A
D
I
0.2
0.1 1
2 5 20 50 100
V
DS
TRANSFER CHARACTERISTICS
1
VDS = 10 V
0.1
0.01
- Drain Current - A
D
0.001
I
1 ms
10 ms
PW = 100 ms
DC
10
- Drain to Source Voltage - V
TA = 75 ˚C
25 ˚C
–25 ˚C
0 0.4 0.8 1.2 1.6 2.0
V
DS
- Drain to Source Voltage - V
FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT
10
DS
= 10 V
V
1
A
= –25 ˚C
T
25 ˚C 75 ˚C
0.1
| - Forward Transfer Admittance - S
fs
0.01
|y
0.001 0.01 0.1 1 I
D
- Drain Current - A
0.0001
0.5 1 1.5 2 2.5 3 V
GS
- Gate to Source Voltage - V
DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT
1.5 TA = 75 ˚C
1
25 ˚C
–25 ˚C
0.5
- Drain to Source On-State Resistance -
0
0.01 0.1 1 10
DS(on)
R
I
D
- Drain Current - A
VGS = 4 V
3
Page 4
2SK2110
DRAIN TO SOURCE ON-STATERESISTANCE vs. DRAIN CURRENT
1.5
TA = 75 ˚C
1
25 ˚C
–25 ˚C
0.5
0
0.01 0.1 1 10
RDS(on) - Drain to Source On-State Resistance -
I
D - Drain Current - A
VGS = 10 V
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
500
VGS = 0 f = 1 MHz
200
100
50
Ciss
Coss
20
10
Ciss, Coss, Crss - Capacitance - pF
5
0.1 0.5 10 100 V
DS - Drain to Source Voltage - V
Crss
20 500.2 1 2 5
DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE
1.5 ID = 0.3 A
1
0.5
0 5 10 20
RDS(on) - Drain to Source On-State Resistance -
V
GS - Gate to Source Voltage - V
15
SWITCHING CHARACTERISTICS
50
td(off)
20
tf
10
tr
5
2
td(on), tr, td(off), tf - Switching Time - ns
1
0.05 0.2 1 5
0.1 0.5 2 I
D - Drain Current - A
td(on)
VDD = 25 V VGS(on) = 10 V
SOURCE TO DRAIN DIODE FORWARD VOLTAGE
1
0.1
0.01
0.001
ISD - Diode Forward Current - A
0.0001
0.2 0.4 0.7 1 V
SD - Source to Drain Voltage - V
4
0.8
0.90.3 0.5 0.6
Page 5
2SK2110

REFERENCE

Document Name Document No. NEC semiconductor device reliability/quality control system TEI-1202 Quality grade on NEC semiconductor devices IEI-1209 Semiconductor device mounting technology manual C10535E Guide to quality assurance for semiconductor devices MEI-1202 Semiconductor selection guide X10679E
5
Page 6
2SK2110
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application.
Standard:Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots
Special:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support)
Specific:Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product.
M4 94.11
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