The 2SK2110 is a N-channel MOS FET of a vertical type and
is a switching element that can be directly driven by the output of
an IC operating at 5 V.
This product has a low ON resistance and superb switching
characteristics and is ideal for driving the actuators, such as
motors and DC/DC converters.
FEATURES
• Low ON resistance
RDS(on) = 1.5 Ω MAX. @VGS = 4.0 V, ID = 0.3 A
• High switching speed
on + toff < 100 ns
t
• Low parasitic capacitance
ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C)
PACKAGE DIMENSIONS (in mm)
4.5 ± 0.1
2.5 ± 0.1
4.0 ± 0.25
1.5 ± 0.1
+0.03
0.41
–0.05
0.42
±0.06
0.8 MIN.
1.6 ± 0.2
S
1.5
3.0
D
0.47
±0.06
G
0.42
±0.06
EQUIVALENT CIRCUIT
PARAMETERSYMBOLTEST CONDITIONSRATINGUNIT
Drain to Source VoltageVDSSVGS = 0100V
Gate to Source VoltageVGSSVDS = 0±20V
Drain Current (DC)ID(DC)±0.5A
Drain Current (Pulse)ID(pulse)PW ≤ 10 ms,±1.0A
Total Power DissipationPT16 cm2 × 0.7 mm, ceramic substrate used2.0W
Channel TemperatureTch150˚C
Storage TemperatureTstg–55 to +150˚C
Document No. D11230EJ2V0DS00 (2nd edition)
Date Published June 1996 P
Printed in Japan
Duty cycle ≤ 50 %
1996
Page 2
ELECTRICAL CHARACTERISTICS (TA = 25 ˚C)
PARAMETERSYMBOLTEST CONDITIONSMIN.TYP.MAX.UNIT
Drain Cut-Off CurrentIDSSVDS = 100 V, VGS = 01.0
Gate Leakage CurrentIGSSVGS = ±20 V, VDS = 0±10
Gate Cut-Off VoltageVGS(off)VDS = 10 V, ID = 1 mA0.81.52.0V
Forward Transfer Admittance|yfs|VDS = 10 V, ID = 0.3 A0.4S
Drain to Source On-State Resistance
Drain to Source On-State Resistance
Input CapacitanceCissVDS = 10 V, VGS = 0,100pF
Output CapacitanceCoss
Reverse Transfer CapacitanceCrss10pF
Turn-On Delay Timetd(on)VDD = 25 V, ID = 0.3 A2ns
Rise Timetr
Turn-Off Delay Timetd(off)
Fall Timetf13ns
RDS(on)1VGS = 4.0 V, ID =0.3 A0.951.5Ω
RDS(on)2VGS = 10 V, ID = 0.3 A0.821.2Ω
f = 1.0 MHz
VGS(on) = 10 V, RG = 10 Ω
RL = 83 Ω
38pF
1.3ns
38ns
2SK2110
µ
A
µ
A
2
Page 3
TYPICAL CHARACTERISTICS (TA = 25 ˚C)
2SK2110
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
100
80
60
40
20
dT - Derating Factor - %
0306090120150
T
A
- Ambient Temperature - ˚C
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
1.0
3.0 V
2.5 V
0.8
0.6
10 V
4.5 V
4.0 V
3.5 V
0.4
- Drain Current - A
D
I
0.2
VGS = 2.0 V
FORWARD BIAS SAFE OPERATING AREA
10
5
2
1
0.5
- Drain Current - A
D
I
0.2
0.1
1
252050100
V
DS
TRANSFER CHARACTERISTICS
1
VDS = 10 V
0.1
0.01
- Drain Current - A
D
0.001
I
1 ms
10 ms
PW = 100 ms
DC
10
- Drain to Source Voltage - V
TA = 75 ˚C
25 ˚C
–25 ˚C
00.40.81.21.62.0
V
DS
- Drain to Source Voltage - V
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
10
DS
= 10 V
V
1
A
= –25 ˚C
T
25 ˚C
75 ˚C
0.1
| - Forward Transfer Admittance - S
fs
0.01
|y
0.0010.010.11
I
D
- Drain Current - A
0.0001
0.511.522.53
V
GS
- Gate to Source Voltage - V
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. DRAIN CURRENT
1.5
TA = 75 ˚C
1
25 ˚C
–25 ˚C
0.5
- Drain to Source On-State Resistance - Ω
0
0.010.1110
DS(on)
R
I
D
- Drain Current - A
VGS = 4 V
3
Page 4
2SK2110
DRAIN TO SOURCE ON-STATERESISTANCE
vs. DRAIN CURRENT
1.5
TA = 75 ˚C
1
25 ˚C
–25 ˚C
0.5
0
0.010.1110
RDS(on) - Drain to Source On-State Resistance - Ω
I
D - Drain Current - A
VGS = 10 V
CAPACITANCE vs.
DRAIN TO SOURCE VOLTAGE
500
VGS = 0
f = 1 MHz
200
100
50
Ciss
Coss
20
10
Ciss, Coss, Crss - Capacitance - pF
5
0.10.510100
V
DS - Drain to Source Voltage - V
Crss
20500.2125
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. GATE TO SOURCE VOLTAGE
1.5
ID = 0.3 A
1
0.5
051020
RDS(on) - Drain to Source On-State Resistance - Ω
V
GS - Gate to Source Voltage - V
15
SWITCHING CHARACTERISTICS
50
td(off)
20
tf
10
tr
5
2
td(on), tr, td(off), tf - Switching Time - ns
1
0.050.215
0.10.52
I
D - Drain Current - A
td(on)
VDD = 25 V
VGS(on) = 10 V
SOURCE TO DRAIN DIODE
FORWARD VOLTAGE
1
0.1
0.01
0.001
ISD - Diode Forward Current - A
0.0001
0.20.40.71
V
SD - Source to Drain Voltage - V
4
0.8
0.90.30.5 0.6
Page 5
2SK2110
REFERENCE
Document NameDocument No.
NEC semiconductor device reliability/quality control systemTEI-1202
Quality grade on NEC semiconductor devicesIEI-1209
Semiconductor device mounting technology manualC10535E
Guide to quality assurance for semiconductor devicesMEI-1202
Semiconductor selection guideX10679E
5
Page 6
2SK2110
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program“ for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard:Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific:Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact NEC Sales Representative in advance.
Anti-radioactive design is not implemented in this product.
M4 94.11
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