Datasheet 2SK168 Datasheet (HIT)

Silicon N-Channel Junction FET
Application
VHF Amplifier, Mixer, Local oscillator
Outline
2SK168
1. Gate
2. Source
3. Drain
3
2
1
2SK168
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Gate to drain voltage V Gate to source voltage V Gate current I Drain current I
GDO
GSS
G
D
Channel power dissipation Pch 200 mW Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Gate to drain breakdown
V
(BR)GDO
voltage Gate cutoff current I Drain current I Gate to source cutoff voltage V
GSS
DSS
GS(off)
Forward transfer admittance |yfs|810—mSV Input capacitance Ciss 6.8 pF V Reverse transfer capacitance Crss 0.1 pF V Power gain PG 27 dB V
Noise figure NF 1.7 dB V
Note: 1. The 2SK168 is grouped by I
DEF
4 to 8 6 to 12 10 to 20
–30 V IG = –100 µA, IS = 0
–10 nA VGS = –0.5 V, VDS = 0
1
*
4 20 mA VDS = 5 V, VGS = 0 — –3.0 V V
as follows.
DSS
–30 V –1 V 10 mA 20 mA
= 5 V, ID = 10 µA
DS
= 5 V, VGS = 0, f = 1 kHz
DS
= 5 V, VGS = 0, f = 1 MHz
DS
= 5 V, VGS = 0, f = 1 MHz
DS
= 5 V, VGS = 0,
DS
f = 100 MHz
= 5 V, VGS = 0,
DS
f = 100 MHz
2
2SK168
Maximum Channel Power
Dissipation Curve
300
200
100
Channel Power Dissipation Pch (mW)
0
50
100 150
Ambient Temperature Ta (°C)
Typical Output Characteristics (2)
10
VGS = 0
8
(mA)
D
6
–0.2 V
Typical Output Characteristics (1)
10
VGS = 0
8
(mA)
D
6
4
Drain Current I
2
0
10 20
Drain to Source Voltage V
Typical Transfer Characteristics
15
VDS = 5 V
10
(mA)
D
–0.2 V
–0.4
–0.6 –0.8
–1.0
Pch = 200 mW
30 40 50
(V)
DS
4
Drain Current I
2
0
12
Drain to Source Voltage V
–0.4 –0.6 –0.8
–1.0
345
(V)
DS
5
Drain Current I
0
–3.0 –2.0
Gate to Source Voltage V
F
E
D
–1.0 0
(V)
GS
3
2SK168
(mS)
fs
Forward Transfer Admittance y
20
(pF)
iss
10
Forward Transfer Admittance vs.
Drain to Source Voltage
15
10
5
0
5
Drain to Source Voltage V
Input Capacitance vs.
Drain to Source Voltage
Ta = –25°C 25°C
75°C
VGS = 0 f = 1 kHz
10 15
DS
V
= 0
GS
f = 1 MHz
(V)
(mS)
fs
Forward Transfer Admittance y
(pF)
rss
1.0
Forward Transfer Admittance vs.
Drain Current
50
20 10
5
2
1.0
0.5
0.5 1.0 20.2 Drain Current I
Reverse Transfer Capacitance vs.
Drain to Source Voltage
5
2
V
= 5 V
DS
f = 1 kHz
10520
(mA)
D
V
= 0
GS
f = 1 MHz
5
Input Capacitance C
2
0.2 0.5 1.00.1
Drain to Source Voltage V
5210
(V)
DS
0.5
0.2
0.1
Reverse Transfer Capacitance C
0.05
0.2 0.5 1.00.1
Drain to Source Voltage V
5210
(V)
DS
4
2SK168
Output Capacitance vs.
Drain to Source Voltage
200
100
(pF)
oss
50
20
10
5
Output Capacitance C
2
0.2 0.5 1.00.1
Drain to Source Voltage V
Power Gain vs. Drain Current
30
E
D
20
V
= 0
GS
f = 1 MHz
5210
(V)
DS
F
Power Gain vs.
Drain to Source Voltage
30
20
10
Power Gain PG (dB)
0
5
Drain to Source Voltage VDS (V)
Noise Figure vs.
Drain to Source Voltage
8
6
VGS = 0 f = 100 MHz
10 15
VGS = 0 f = 100 MHz
VDS = 5 V
10
0
f = 100 MHz V
Variable
GS
468102
Power Gain PG (dB)
Drain Current I
(mA)
D
1412 16
4
2
Noise Figure NF (dB)
0
48
Drain to Source Voltage V
12 16
(V)
DS
5
2SK168
Input and Output Admittance
5
yis = gis+jb yos = gos+jb
2
1.0
VDS = 5 V I
= 10 mA
D
(mS)
(mS)
os
is
0.5
0.2
Input Admittance y
Output Admittance y
0.1
0.05 50
Input and Output Admittance
5
2
(mS)
(mS)
os
is
1.0
0.5
VDS = 5 V
0.2
0.1
0.05
f = 100 MHz
0.5 1.0
Input Admittance y
Output Admittance y
vs. Frequency
is
os
100 200 Frequency f (MHz)
vs. Drain Current
bis×10
yis = gis+jb yos = gos+jb
gos is Negligible Small at This Frequency
2 5 10 20
Drain Current I
(mA)
D
g
is
bis×10 bos×10
g
os
b
os
g
is
is
os
500
50
Transfer Admittance vs.
Frequency
50
VDS = 5 V I
(mS)
(mS)
rs
fs
20
= 10 mA
D
g
fs
10
5
2
yfs = gfs+jb yrs = grs+jb
–b
fs
fs
1.0
Forward Transfer Admittance y
Reverse Transfer Admittance y
0.5 50
100 200 Frequency f (MHz)
Transfer Admittance vs.
Drain Current
50
(mS)
(mS)
rs
fs
20
VDS = 5 V f = 100 MHz
10
5
2
100 g
1.0
Forward Transfer Admittance y
Reverse Transfer Admittance y
0.5
0.5 1.0
yfs = gfs+jb yrs = grs+jb
rs
fs rs
2 5 10 20
Drain Current I
fs
(mA)
D
–10 b
10 g
g
fs
–b
fs
–100 b
rs
rs
500
rs
50
6
2SK168
Power Gain and Noise Figure
Test Circuit
Shield
SG Output
Impedance
50
5.4 3.0
C
1
S.G.
D.U.T.
L
4,700
C
L
1
2
2
1,000
50
V.V
Unit R :
V
DD
C : pF
C1, C2 : 0 to 30 pF Variable Air L1 : 3.5 T 1 mmφ Copper Ribbon, Tin plated 10 mm Inside dia. L2 : 4.5 T 1 mmφ Copper Ribbon, Tin plated 10 mm Inside dia.
7
Unit: mm
0.60 Max
0.45 ± 0.1
4.8 ± 0.3
1.27
2.54
0.7
5.0 ± 0.2
2.3 Max
12.7 Min
3.8 ± 0.3
0.5
Hitachi Code JEDEC EIAJ
(reference value)
Weight
TO-92 (2) Conforms Conforms
0.25 g
Cautions
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3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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