
Silicon N-Channel Junction FET
Application
VHF Amplifier, Mixer, Local oscillator
Outline
TO-92 (2)
2SK168
1. Gate
2. Source
3. Drain
3
2
1

2SK168
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Gate to drain voltage V
Gate to source voltage V
Gate current I
Drain current I
GDO
GSS
G
D
Channel power dissipation Pch 200 mW
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Gate to drain breakdown
V
(BR)GDO
voltage
Gate cutoff current I
Drain current I
Gate to source cutoff voltage V
GSS
DSS
GS(off)
Forward transfer admittance |yfs|810—mSV
Input capacitance Ciss — 6.8 — pF V
Reverse transfer capacitance Crss — 0.1 — pF V
Power gain PG — 27 — dB V
Noise figure NF — 1.7 — dB V
Note: 1. The 2SK168 is grouped by I
DEF
4 to 8 6 to 12 10 to 20
–30 — — V IG = –100 µA, IS = 0
— — –10 nA VGS = –0.5 V, VDS = 0
1
*
4 — 20 mA VDS = 5 V, VGS = 0
— — –3.0 V V
as follows.
DSS
–30 V
–1 V
10 mA
20 mA
= 5 V, ID = 10 µA
DS
= 5 V, VGS = 0, f = 1 kHz
DS
= 5 V, VGS = 0, f = 1 MHz
DS
= 5 V, VGS = 0, f = 1 MHz
DS
= 5 V, VGS = 0,
DS
f = 100 MHz
= 5 V, VGS = 0,
DS
f = 100 MHz
2

2SK168
Maximum Channel Power
Dissipation Curve
300
200
100
Channel Power Dissipation Pch (mW)
0
50
100 150
Ambient Temperature Ta (°C)
Typical Output Characteristics (2)
10
VGS = 0
8
(mA)
D
6
–0.2 V
Typical Output Characteristics (1)
10
VGS = 0
8
(mA)
D
6
4
Drain Current I
2
0
10 20
Drain to Source Voltage V
Typical Transfer Characteristics
15
VDS = 5 V
10
(mA)
D
–0.2 V
–0.4
–0.6
–0.8
–1.0
Pch = 200 mW
30 40 50
(V)
DS
4
Drain Current I
2
0
12
Drain to Source Voltage V
–0.4
–0.6
–0.8
–1.0
345
(V)
DS
5
Drain Current I
0
–3.0 –2.0
Gate to Source Voltage V
F
E
D
–1.0 0
(V)
GS
3

2SK168
(mS)
fs
Forward Transfer Admittance y
20
(pF)
iss
10
Forward Transfer Admittance vs.
Drain to Source Voltage
15
10
5
0
5
Drain to Source Voltage V
Input Capacitance vs.
Drain to Source Voltage
Ta = –25°C
25°C
75°C
VGS = 0
f = 1 kHz
10 15
DS
V
= 0
GS
f = 1 MHz
(V)
(mS)
fs
Forward Transfer Admittance y
(pF)
rss
1.0
Forward Transfer Admittance vs.
Drain Current
50
20
10
5
2
1.0
0.5
0.5 1.0 20.2
Drain Current I
Reverse Transfer Capacitance vs.
Drain to Source Voltage
5
2
V
= 5 V
DS
f = 1 kHz
10520
(mA)
D
V
= 0
GS
f = 1 MHz
5
Input Capacitance C
2
0.2 0.5 1.00.1
Drain to Source Voltage V
5210
(V)
DS
0.5
0.2
0.1
Reverse Transfer Capacitance C
0.05
0.2 0.5 1.00.1
Drain to Source Voltage V
5210
(V)
DS
4

2SK168
Output Capacitance vs.
Drain to Source Voltage
200
100
(pF)
oss
50
20
10
5
Output Capacitance C
2
0.2 0.5 1.00.1
Drain to Source Voltage V
Power Gain vs. Drain Current
30
E
D
20
V
= 0
GS
f = 1 MHz
5210
(V)
DS
F
Power Gain vs.
Drain to Source Voltage
30
20
10
Power Gain PG (dB)
0
5
Drain to Source Voltage VDS (V)
Noise Figure vs.
Drain to Source Voltage
8
6
VGS = 0
f = 100 MHz
10 15
VGS = 0
f = 100 MHz
VDS = 5 V
10
0
f = 100 MHz
V
Variable
GS
468102
Power Gain PG (dB)
Drain Current I
(mA)
D
1412 16
4
2
Noise Figure NF (dB)
0
48
Drain to Source Voltage V
12 16
(V)
DS
5

2SK168
Input and Output Admittance
5
yis = gis+jb
yos = gos+jb
2
1.0
VDS = 5 V
I
= 10 mA
D
(mS)
(mS)
os
is
0.5
0.2
Input Admittance y
Output Admittance y
0.1
0.05
50
Input and Output Admittance
5
2
(mS)
(mS)
os
is
1.0
0.5
VDS = 5 V
0.2
0.1
0.05
f = 100 MHz
0.5 1.0
Input Admittance y
Output Admittance y
vs. Frequency
is
os
100 200
Frequency f (MHz)
vs. Drain Current
bis×10
yis = gis+jb
yos = gos+jb
gos is Negligible
Small at This Frequency
2 5 10 20
Drain Current I
(mA)
D
g
is
bis×10
bos×10
g
os
b
os
g
is
is
os
500
50
Transfer Admittance vs.
Frequency
50
VDS = 5 V
I
(mS)
(mS)
rs
fs
20
= 10 mA
D
g
fs
10
5
2
yfs = gfs+jb
yrs = grs+jb
–b
fs
fs
1.0
Forward Transfer Admittance y
Reverse Transfer Admittance y
0.5
50
100 200
Frequency f (MHz)
Transfer Admittance vs.
Drain Current
50
(mS)
(mS)
rs
fs
20
VDS = 5 V
f = 100 MHz
10
5
2
100 g
1.0
Forward Transfer Admittance y
Reverse Transfer Admittance y
0.5
0.5 1.0
yfs = gfs+jb
yrs = grs+jb
rs
fs
rs
2 5 10 20
Drain Current I
fs
(mA)
D
–10 b
10 g
g
fs
–b
fs
–100 b
rs
rs
500
rs
50
6

2SK168
Power Gain and Noise Figure
Test Circuit
Shield
SG Output
Impedance
50
5.4 3.0
C
1
S.G.
D.U.T.
L
4,700
C
L
1
2
2
1,000
50
V.V
Unit R : Ω
V
DD
C : pF
C1, C2 : 0 to 30 pF Variable Air
L1 : 3.5 T 1 mmφ Copper Ribbon, Tin plated 10 mm Inside dia.
L2 : 4.5 T 1 mmφ Copper Ribbon, Tin plated 10 mm Inside dia.
7

Unit: mm
0.60 Max
0.45 ± 0.1
4.8 ± 0.3
1.27
2.54
0.7
5.0 ± 0.2
2.3 Max
12.7 Min
3.8 ± 0.3
0.5
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
TO-92 (2)
Conforms
Conforms
0.25 g

Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe : http://www.hitachi-eu.com/hel/ecg
Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX