Datasheet 2SK1628, 2SK1629 Datasheet (HIT)

Page 1
2SK1628, 2SK1629
Silicon N-Channel MOS FET
Application
High speed power switching
Features
Low on-resistance
High speed switching
Low drive current
Suitable for switching regulator and DC-DC converter
Outline
TO-3PL
G
D
1
2
3
1. Gate
2. Drain
S
3. Source
Page 2
2SK1628, 2SK1629
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage 2SK1628 V
DSS
2SK1629 500 Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I Channel dissipation Pch*
GSS
D
D(pulse)
DR
1
*
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note 1. PW 10 µs, duty cycle 1%
2. Value at T
= 25°C
C
450 V
±30 V 30 A 120 A 30 A 200 W
2
Page 3
2SK1628, 2SK1629
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions Drain to source 2SK1628 V
(BR)DSS
breakdown voltage 2SK1629 500 Gate to source breakdown
V
(BR)GSS
voltage Gate to source leak current I Zero gate voltage 2SK1628 I
GSS
DSS
drain current 2SK1629 VDS = 400 V, VGS = 0 Gate to source cutoff voltage V Static Drain to source 2SK1628 R
GS(off)
DS(on)
on state resistance 2SK1629 0.22 0.27 Forward transfer admittance |yfs| 12 20 S ID = 15 A, VDS = 10 V * Input capacitance Ciss 2800 pF VDS = 10 V, VGS = 0, Output capacitance Coss 780 pF f = 1 MHz Reverse transfer capacitance Crss 90 pF Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
voltage Body to drain diode reverse
t
rr
recovery time Note 1. Pulse test
450 V ID = 10 mA, VGS = 0
±30——V I
= ±100 µA, VDS = 0
G
——±10 µAVGS = ±25 V, VDS = 0 — 250 µAVDS = 360 V, VGS = 0
2.0 3.0 V ID = 1 mA, VDS = 10 V — 0.20 0.25 ID = 15 A, VGS = 10 V *
32 ns ID = 15 A, VGS = 10 V, — 140 ns RL = 2 200 ns — 100 ns — 1.1 V IF = 30 A, VGS = 0
600 ns IF = 30 A, VGS = 0,
di
/dt = 100 A/µs
F
1
1
See characteristics curves of 2SK1169, 2SK1170
3
Page 4
2SK1628, 2SK1629
300
Power vs. Temperature Derating
200
100
Channel Dissipation Pch (W)
0 50 100 150
Case Temperature T
Normalized Transient Thermal Impedance vs. Pulse Width
(t)
3
S
D = 1
1
0.5
(°C)
C
Maximum Safe Operation Area
500 200
100
(A)
50
D
20
Operation in this area
10
is limited by R
5
Drain Current I
2
Ta = 25°C
1
0.5 1 3 30 300
DS (on)
PW = 10 ms (1 Shot)
DC Operation (T
C
= 25°C)
2SK1628 2SK1629
10 100 1,000
Drain to Source Voltage V
1 ms
10 µs
100 µs
DS
T
(V)
= 25°C
C
Normalized Transient Thermal Impedance γ
0.3
0.1
0.03
0.01 10 µ
0.2
0.1
0.05
0.02
0.01
1 Shot Pulse
100 µ 10 m 100 m 1 101 m
Pulse Width PW (s)
θch–c (t) = γS (t) · θch–c θch–c = 0.625°C/W, T
T
°C/W
PW
P
DM
= 25°C
C
D =
PW
T
4
Page 5
Unit: mm
6.0 ± 0.2
26.0 ± 0.3
20.0 ± 0.6
2.5 ± 0.3
5.45 ± 0.5
20.0 ± 0.3 φ3.3 ± 0.2
1.4
3.0
2.2
+0.25
1.2
–0.1
5.45 ± 0.5
1.0
3.8
7.4
0.6
+0.25 –0.1
5.0 ± 0.2
2.8 ± 0.2
Hitachi Code JEDEC EIAJ
(reference value)
Weight
TO-3PL — —
9.9 g
Page 6
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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