Datasheet 2SK1302 Datasheet (HIT)

Page 1
2SK1302
Silicon N-Channel MOS FET
Application
High speed power switching
Features
Low on-resistance
High speed switching
4 V gate drive deviceCan be driven from 5 V source
Suitable for motor drive, DC-DC converter, power switch and solenoid drive
Outline
TO-220AB
G
1
D
S
2
3
1. Gate
2. Drain (Flange)
3. Source
Page 2
2SK1302
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I Channel dissipation Pch*
(BR)DSS
GSS
D
D(pulse)
DR
1
*
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10 µs, duty cycle 1%
2. Value at T
= 25°C
C
100 V ±20 V 20 A 80 A 20 A 50 W
2
Page 3
2SK1302
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Gate to source leak current I Zero gate voltage drain current I Gate to source cutoff voltage V Static drain to source on state
R
GSS
DSS
GS(off)
DS(on)
resistance
Forward transfer admittance |yfs| 10 16 S ID = 10 A, VDS = 10 V * Input capacitance Ciss 1300 pF VDS = 10 V, VGS = 0, Output capacitance Coss 540 pF f = 1 MHz Reverse transfer capacitance Crss 160 pF Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
voltage Body to drain diode reverse
t
rr
recovery time Note: 1. Pulse test
100 V ID = 10 mA, VGS = 0
±20——V I
= ±100 µA, VDS = 0
G
——±10 µAVGS = ±16 V, VDS = 0 — 250 µAVDS = 80 V, VGS = 0
1.0 2.0 V ID = 1 mA, VDS = 10 V — 0.065 0.085 ID = 10 A, VGS = 10 V *
0.085 0.12 ID = 10 A, VGS = 4 V *
12 ns ID = 10 A, VGS = 10 V, — 100 ns RL = 3 300 ns — 150 ns — 1.3 V IF = 20 A, VGS = 0
300 ns IF = 20 A, VGS = 0,
di
/dt = 50 A/µs
F
1
1
1
3
Page 4
2SK1302
Power vs. Temperature Derating
60
40
20
Channel Dissipation Pch (W)
50 1000
Case Temperature T
Typical Output Characteristics
50
10 V
7 V 5 V
40
30
4 V
3.5 V
(°C)
C
Pulse Test
150
100
Maximum Safe Operation Area
30
10
DC Operation (T
(A)
D
3
1
Drain Current I
0.3
Operation in this area
is limited by R
0.1 1
Drain to Source Voltage V
Typical Transfer Characteristics
20
VDS = 10 V
Pulse Test
16
(A)
D
12
10 µs
Ta = 25°C
100 µs
1 ms
PW = 10 ms (1 Shot)
C
= 25°C)
DS (on)
10 1000
DS
300100303
(V)
20
Drain Current ID (A)
10
0
Drain to Source Voltage V
3 V
VGS = 2.5 V
DS
(V)
8
Drain Current I
4
20161284
0
75°C
T
= 25°C
C
–25°C
3
Gate to Source Voltage V
42105
(V)
GS
4
Page 5
2SK1302
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
2.0
1.6
1.2
(V)
(on) DS
0.8
V
0.4
Drain to Source Saturation Voltage
0
6
Gate to Source Voltage V
Static Drain to Source on State
Resistance vs. Temperature
0.20
()
R
0.16
0.12
(on)
0.08
DS
Pulse Test
VGS = 4 V
ID = 20 A
VGS = 10 V
0.04
Static Drain to Source on State
0.5
Pulse Test
ID = 20 A
0.2
0.1
()
0.05
(on)
10 A
DS
R
0.02
5 A
842010
(V)
GS
0.01
0.005
Static Drain to Source on State Resistance
2
Forward Transfer Admittance
50
20
10 A
10
5 A
5
20 A
5 A, 10 A
2
1
Resistance vs. Drain Current
Pulse Test
VGS = 4 V
10 V
50105 200
D
100
(A)
20
Drain Current I
vs. Drain Current
–25°C
T
= 25°C
C
75°C
VDS = 10 V Pulse Test
0
Static Drain to Source on State Resistance
–40
Case Temperature T
80
C
120400
(°C)
160
Forward Transfer Admittance yfs (S)
0.5
0.2
0.5 1.0 Drain Current I
20
10
5
2
(A)
D
5
Page 6
2SK1302
Body to Drain Diode Reverse
Recovery Time
1000
500
(ns)
rr
200
100
50
20
Reverse Recovery Time t
di/dt = 50 A/µs, Ta = 25°C VGS = 0 Pulse Test
10
0.5 1.0 5 Reverse Drain Current I
Dynamic Input Characteristics
100
V
80
DS
VDD = 25 V
50 V
80 V
(V)
DS
60
40
20
Drain to Source Voltage V
VDD = 80 V 50 V 25 V
0
20 60
40
Gate Charge Qg (nc)
V
GS
10220
(A)
DR
ID = 20 A
80
100
Capacitance C (pF)
50
20
(V)
16
GS
12
8
4
Switching Time t (ns)
Gate to Source Voltage V
0
Typical Capacitance vs. Drain to Source Voltage
10000
1000
100
10
01020
Drain to Source Voltage VDS (V)
Switching Characteristics
1000
500
200
100
50
20 10
0.5 1.0 5
Ciss
Coss
Crss
30 40
td
(off)
t
f
t
r
VGS = 10 V VDD = 30 V PW = 2µs, duty < 1 %
t
d (on)
10220
Drain Current I
D
VGS = 0 f = 1 MHz
(A)
50
50
6
Page 7
20
16
(A)
DR
2SK1302
Reverse Drain Current vs.
Source to Drain Voltage
Pulse Test
3
D = 1
1.0
0.5
0.3
0.2
0.1
0.1
0.05
0.02
0.01
0.03
1 Shot Pulse
0.01 10 µ 1 m
Normalized Transient Thermal Impedance γs (t)
100 µ
12
8
4
Reverse Drain Current I
0 0.4 1.2
10 V
5 V
VGS = 0, –5V
0.8
Source to Drain Voltage V
1.6
SD
2.0
(V)
Normalized Transient Thermal Impedance vs. Pulse Width
θch–c (t) = γs (t) · θch–c θch–c = 2.50°C/W, T
P
DM
10 m
100 m
Pulse Width PW (s)
TC = 25°C
= 25°C
C
PW
D =
PW
T
T
110
Switching Time Test Circuit Vin Monitor
50
Vin = 10 V
D.U.T
Vout Monitor
R
L
.
= 30 V
V
.
DD
t
d (on)
Vin
Vout
10 %
10 %
90 % t
r
Wavewforms
t
d (off)
90 %
90 %
10 %
t
f
7
Page 8
11.5 MAX
Unit: mm
2.79 ± 0.218.5 ± 0.57.8 ± 0.5
1.27
2.54 ± 0.5
10.16 ± 0.2
9.5
8.0
φ 3.6
-0.08
1.5 MAX
0.76 ± 0.1
2.54 ± 0.5
+0.2
6.4
–0.1
+0.1
4.44 ± 0.2
1.26 ± 0.15
2.7 MAX
14.0 ± 0.5 15.0 ± 0.3
0.5 ± 0.1
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-220AB Conforms Conforms
1.8 g
Page 9
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