Datasheet 2SK1058, 2SK1057, 2SK1056 Datasheet (HIT)

Page 1
2SK1056, 2SK1057, 2SK1058
Silicon N-Channel MOS FET
Application
Low frequency power amplifier
Complementary pair with 2SJ160, 2SJ161 and 2SJ162
Features
Good frequency characteristic
High speed switching
Enhancement-mode
Good complementary characteristics
Equipped with gate protection diodes
Suitable for audio power amplifier
Page 2
2SK1056, 2SK1057, 2SK1058
Outline
TO-3P
D
G
S
1
2
3
1. Gate
2. Source (Flange)
3. Drain
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage 2SK1056 V
DSX
2SK1057 140
2SK1058 160 Gate to source voltage V Drain current I Body to drain diode reverse drain current I Channel dissipation Pch*
GSS
D
DR
1
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. Value at TC = 25°C
120 V
±15 V 7A 7A 100 W
2
Page 3
2SK1056, 2SK1057, 2SK1058
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source 2SK1056 V
(BR)DSX
breakdown voltage 2SK1057 140
2SK1058 160
Gate to source breakdown
V
(BR)GSS
voltage Gate to source cutoff voltage V Drain to source saturation
V
GS(off)
DS(sat)
voltage Forward transfer admittance |yfs| 0.7 1.0 1.4 S ID = 3 A, VDS = 10 V * Input capacitance Ciss 600 pF VGS = –5 V, VDS = 10 V, Output capacitance Coss 350 pF f = 1 MHz Reverse transfer capacitance Crss 10 pF Turn-on time t Turn-off time t
on
off
Note: 1. Pulse test
120 V ID = 10 mA, VGS = –10 V
±15——V I
= ±100 µA, VDS = 0
G
0.15 1.45 V ID = 100 mA, VDS = 10 V ——12V I
= 7 A, VGD = 0 *
D
1
180 ns VDD = 20 V, ID = 4 A, —60—ns
1
3
Page 4
2SK1056, 2SK1057, 2SK1058
Power vs. Temperature Derating
150
100
50
Channel Dissipation Pch (W)
Case Temperature T
Typical Output Characteristics
10
8
(A)
D
6
4
Drain Current I
2
0
0
Drain to Source Voltage V
50 1000
VGS = 10 V 9
8
7
6
5
4
30
(°C)
C
TC = 25°C
Pch = 100 W
3
402010 50
(V)
DS
150
2 1
0
Maximum Safe Operation Area
20
Ta = 25°C
10
ID
(Continuous)
(A)
D
max
5
DC Operation (T
2
PW = 10 ms 1 shot
PW = 100 ms 1 shot
PW = 1 s 1 shot
C
= 25°C)
1.0
Drain Current I
0.5 2SK1056 2SK1057
0.2
5 500
10 20 50
Drain to Source Voltage V
100
DS
Typical Transfer Characteristics
1.0
VDS = 10 V
0.8
= –25°C
(A)
D
0.6
C
T
0.4
Drain Current I
0.2
0
Gate to Source Voltage V
1.2
1.60.80.40 2.0
GS
2SK1058
200
(V)
25
75
(V)
4
Page 5
2SK1056, 2SK1057, 2SK1058
Drain to Source Saturation
Voltage vs. Drain Current
10
VGD = 0
5
25
2
(V)
1.0
(on) DS
V
0.5
0.2
Drain to Source Saturation Voltage
0.1
0.1
1.0
Drain Current I
Input Capacitance vs. Gate
Source Voltage
1000
500
°C 75°C
T
20.50.2 5 (A)
D
= –25°C
C
10
Drain to Source Voltage vs.
Gate to Source Voltage
10
(V)
8
DS
TC = 25°C
6
4
2
Drain to Source Voltage V
0
Gate to Source Voltage V
I
D
6
GS
Forward Transfer Admittance
vs. Frequency
3.0
1.0
0.3
5A
2A
= 1 A
842010
(V)
200
Input Capacitance Ciss (pF)
100
0–2–4
Gate to Source Voltage VGS (V)
VDS = 10 V f = 1 MHz
–6 –8
–10
0.1
0.03
0.01
0.003
Forward Transfer Admittance yfs (S)
10 k 30 k 100 k
TC = 25°C V
= 10 V
DS
I
= 2 A
D
300 k
Frequency f (Hz)
1 M
3 M
10 M
5
Page 6
2SK1056, 2SK1057, 2SK1058
Switching Time vs. Drain Current
500
200
100
50
20
10
Switching Time ton,toff (ns)
5
0.1 0.2 0.5 Drain Current I
Switching Time Test Circuit
Input
PW = 50µs
duty ratio
= 1 %
50
1.0
Output
t
on
t
off
2
(A)
D
RL= 2
5
10
20 V
Waveforms
90 %
Input
10 %
t
on
t
off
10 %
Output
90 %
6
Page 7
1.6
0.5
15.6 ± 0.3
φ3.2 ± 0.2
1.0
2.0
Unit: mm
4.8 ± 0.2
1.5
5.0 ± 0.3
19.9 ± 0.2
14.9 ± 0.2
0.3
1.4 Max
3.6
2.0
0.9
1.0
1.0 ± 0.2
5.45 ± 0.55.45 ± 0.5
18.0 ± 0.5
2.8
0.6 ± 0.2
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-3P — Conforms
5.0 g
Page 8
Cautions
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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
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