Datasheet 2SJ78, 2SJ77, 2SJ76 Datasheet (HIT)

Page 1
2SJ76, 2SJ77, 2SJ78, 2SJ79
Silicon P-Channel MOS FET
Application
High frequency and low frequency power amplifier, high speed power switching
Complementary pair with 2SK213, 2SK214, 2SK215, 2SK216
Features
Suitable for direct mounting
High forward transfer admittance
Enhancement-mode
Outline
TO-220AB
G
1
D
S
2
3
1. Gate
2. Source (Flange)
3. Drain
Page 2
2SJ76, 2SJ77, 2SJ78, 2SJ79
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage 2SJ76 V
DSX
2SJ77 –160 2SJ78 –180
2SJ79 –200 Gate to source voltage V Drain current I Body to drain diode reverse drain current I
GSS
D
DR
Channel dissipation Pch 1.75 W
1
Pch* Channel temperature Tch 150 °C Storage temperature Tstg –45 to +150 °C
Note: 1. Value at TC = 25°C
Electrical Characteristics (Ta = 25°C)
–140 V
±15 V –500 mA –500 mA
30 W
Item Symbol Min Typ Max Unit Test conditions
Drain to source 2SJ76 V
(BR)DSX
–140 V VGS = 2 V, ID = –1 mA
breakdown voltage 2SJ77 –160 V
2SJ78 –180 V 2SJ79 –200 V
Gate to source breakdown
V
(BR)GSS
±15——V I
= ±10 µA, VDS = 0
G
voltage Gate to source voltage V Drain to source saturation
V
GS(on)
DS(sat)
–0.2 –1.5 V ID = –10 mA, VDS = –10 V* — –2.0 V ID = –10 mA, VGD = 0 *
1
voltage Forward transfer admittance |yfs|2035—mSI
= –10 mA, VDS = –20 V*
D
Input capacitance Ciss 120 pF VDS = –10 V, ID = –10 mA, Reverse transfer capacitance Crss 4.8 pF f = 1 MHz
Note: 1. Pulse test
1
1
2
Page 3
2SJ76, 2SJ77, 2SJ78, 2SJ79
Power vs. Temperature Derating
60
40
20
Channel Dissipation Pch (W)
0 50 100 150
Case Temperature T
(°C)
C
Typical Output Characteristics
–50
TC = 25°C
–1.0
–0.9
–40
–0.8
(mA)
D
–30
–20
–0.7 –0.6
–0.5
Drain Current I
–10
–20 –60 –800
Drain to Source Voltage V
–40 –100
–0.4 –0.3
–0.2
VGS = –0.1 V
DS
(V)
Typical Output Characteristics
–500
TC = 25°C
–400
(mA)
D
–300
–200
Drain Current I
–100
Drain to Source Voltage V
Typical Transfer Characteristics
–500
V
DS
–400
(mA)
D
–300
–200
Drain Current I
–100
Gate to Source Voltage V
–4.5
VGS = –0.5 V
–8 –20
–4 –12 –160
= –20 V
= –25°C
C
T
–1 –3 –40
–2 –5
–4.0 –3.5
–3.0 –2.5 –2.0
–1.5 –1.0
25
75
DS
GS
(V)
(V)
Page 4
2SJ76, 2SJ77, 2SJ78, 2SJ79
Typical Transfer Characteristics
–100
V
DS
–80
(mA)
D
–60
–40
Drain Current I
–20
Gate to Source Voltage V
= –20 V
= –25°C
C
T
–0.8 –2.0
–0.4 –1.2 –1.60
25
500
100
75
(V)
GS
Forward Transfer Admittance
vs. Frequency
200
100
50
20
10
Forward Transfer Admittance yfs (mS)
Forward Transfer Admittance
vs. Drain Current
5
2
–2
–10 –200
–5 –20 –100
Drain Current ID (mA)
TC = 25°C V
= –20 V
DS
–50
10
1.0
TC = 25°C
= –20 V
V
DS
I
= –10 mA
D
0.1
0.05
Forward Transfer Admittance yfs (mS)
5 k
10 k 1 M 10 M
100 k 50 M
Frequency f (Hz)
Page 5
11.5 MAX
Unit: mm
2.79 ± 0.218.5 ± 0.57.8 ± 0.5
1.27
2.54 ± 0.5
10.16 ± 0.2
9.5
8.0
φ 3.6
-0.08
1.5 MAX
0.76 ± 0.1
2.54 ± 0.5
+0.2
6.4
–0.1
+0.1
4.44 ± 0.2
1.26 ± 0.15
2.7 MAX
14.0 ± 0.5 15.0 ± 0.3
0.5 ± 0.1
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-220AB Conforms Conforms
1.8 g
Page 6
Cautions
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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
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