
Features
• Low on-resistance
R
= 0.11 Ω typ.
DS(on)
• Low drive current
• 4 V gete drive devices
• High speed switching
Outline
2SJ526
Silicon P Channel MOS FET
High Speed Power Switching
ADE-208-579B (Z)
4th. Edition
Jun 1998
TO–220FM
G
D
1. Gate
2. Drain
1
2
3
S
3. Source

2SJ526
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body-drain diode reverse drain current I
Avalenche current I
Avalenche energy E
Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note3
AP
AR
Note1
Note3
Note2
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW ≤ 10µs, duty cycle ≤ 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50 Ω
Electrical Characteristics (Ta = 25°C)
–60 V
±20 V
–12 A
–48 A
–12 A
–12 A
12 mJ
25 W
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
Gate to source breakdown voltage V
Zero gate voltege drain current I
Gate to source leak current I
Gate to source cutoff voltage V
Static drain to source on state R
resistance R
(BR)DSS
(BR)GSS
DSS
GSS
GS(off)
DS(on)
DS(on)
Forward transfer admittance |yfs|58—SI
–60 — — V ID = –10mA, VGS = 0
±20——V I
= ±100µA, VDS = 0
G
— — –10 µAVDS = –60 V, VGS = 0
——±10 µAVGS = ±16V, VDS = 0
–1.0 — –2.0 V ID = –1mA, VDS = –10V
— 0.11 0.15 Ω ID = –6A, VGS = –10V
— 0.16 0.23 Ω ID = –6A, VGS = –4V
= –6A, VDS = –10V
D
Input capacitance Ciss — 580 — pF VDS = –10V
Output capacitance Coss — 300 — pF VGS = 0
Reverse transfer capacitance Crss — 85 — pF f = 1MHz
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Body–drain diode forward voltage V
Body–drain diode reverse
recovery time
t
d(on)
r
d(off)
f
DF
rr
— 10 — ns VGS = –10V, ID = –6A
— 55 — ns RL = 6Ω
—85—ns
—60—ns
— –1.2 — V IF = –12A, VGS = 0
— 60 — ns IF = –12A, VGS = 0
diF/ dt = 50A/µs
Note: 4. Pulse test
Note4
Note4
Note4
2

Main Characteristics
2SJ526
Power vs. Temperature Derating
40
30
20
10
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
–10
–10 V
–5 V
–8
–4 V
–3.5 V
–1000
–300
–100
D
–30
–10
–3
Drain Current I (A)
–1
–0.3
–0.1
Maximum Safe Operation Area
Operation in
this area is
limited by R
Ta = 25 °C
–0.1 –0.3 –1 –3 –10
Drain to Source Voltage V (V)
Typical Transfer Characteristics
–10
V = –10 V
DS
Pulse Test
–8
10 µs
100 µs
1 ms
PW = 10 ms
(1 shot)
DC Operation
DS(on)
–30 –100
DS
D
–6
–4
Drain Current I (A)
–2
0
–2 –4 –6 –8 –10
Drain to Source Voltage V (V)
Pulse Test
–3 V
–2.5 V
V = –2 V
GS
DS
D
–6
–4
25 °CTc = 75 °C
Drain Current I (A)
–2
–25 °C
0 –1–2–3–4–5
Gate to Source Voltage V (V)
GS
3

2SJ526
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
–1.0
Pulse Test
–0.8
DS(on)
V (V)
–0.6
I = –5 A
D
–0.4
–0.2
Drain to Source Saturation Voltage
0
–4 –8 –12 –16 –20
Gate to Source Voltage V (V)
Static Drain to Source on State Resistance
vs. Temperature
0.5
Ω
Pulse Test
0.4
DS(on)
R ( )
0.3
0.2
V = –4 V
GS
I = –5 A
D
–5 A
0.1
–10 V
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
–2 A
–1 A
GS
–2 A
–1 A
–1, –2 A
Static Drain to Source on State Resistance
vs. Drain Current
1
0.5
0.2
DS(on)
R ( )Ω
0.1
V = –4 V
GS
–10 V
0.05
0.02
Drain to Source On State Resistance
0.01
–0.1 –0.3 –1 –3 –10 –30 –100
Drain Current I (A)
Pulse Test
D
Forward Transfer Admittance vs.
Drain Current
20
fs
10
Ta = –25 °C
5
2
75 °C
1
0.5
V = –10 V
DS
Forward Transfer Admittance |y | (S)
0.1
–0.1 –1 –10
–0.2 –0.5 –2 –5
Drain Current I (A)
Pulse Test
D
25 °C
4

2SJ526
Body–Drain Diode Reverse
500
Recovery Time
200
100
50
20
10
Reverse Recovery Time trr (ns)
5
–0.1 –0.2 –1 –5 –10
di / dt = 50 A / µs
V = 0, Ta = 25 °C
GS
–0.5 –2
Reverse Drain Current I (A)
Dynamic Input Characteristics
0
I = –10 A
D
DS
–20
V = –10 V
DD
–25 V
–50 V
–40
V
DS
V
GS
–60
V = –50 V
DD
–80
–25 V
–10 V
Drain to Source Voltage V (V)
0
81624
32
Gate Charge Qg (nc)
DR
2000
1000
500
200
100
50
Capacitance C (pF)
20
10
0 –10 –20 –30 –40 –50
Drain to Source Voltage V (V)
0
–4
GS
1000
300
Switching Characteristics
100
–8
30
–12
10
–16
Switching Time t (ns)
3
Gate to Source Voltage V (V)
–20–100
40
1
–0.1 –0.2 –0.5 –1 –2 –5
Typical Capacitance vs.
Drain to Source Voltage
V = 0
GS
f = 1 MHz
Ciss
Crss
Coss
DS
V = –10 V, V = –30 V
GS
DD
Pw = 5 µs, duty < 1 %
t
d(off)
t
f
t
r
t
d(on)
Drain Current I (A)
D
–10
5

2SJ526
Reverse Drain Current vs.
Source to Drain Voltage
–10
–8
DR
–6
–10 V
V = 0, 5 V
–4
–5 V
GS
–2
Reverse Drain Current I (A)
0
–0.4 –0.8 –1.2 –1.6 –2.0
Source to Drain Voltage V (V)
Avalanche Test Circuit Avalanche Waveform
V
DS
Monitor
Rg
Vin
–15 V
50Ω
Pulse Test
SD
L
I
AP
Monitor
D. U. T
Maximum Avalanche Energy vs.
Channel Temperature Derating
20
AR
16
12
8
4
0
Repetitive Avalanche Energy E (mJ)
25 50 75 100 125 150
Channel Temperature Tch (°C)
1
E = • L • I •
AR
2
I
AP
V
DD
I
D
V
DD
0
AP
2
I = –12 A
AP
V = –25 V
DD
duty < 0.1 %
Rg > 50
Ω
V
DSS
V – V
DSS DD
V
DS
V
(BR)DSS
6

2SJ526
3
Normalized Transient Thermal Impedance vs. Pulse Width
s (t)
1
γ
D = 1
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.01
10 µ
0.02
0.01
1shot pulse
100 µ 1 m 10 m
Pulse Width PW (S)
Tc = 25°C
θ γ θ
ch – c(t) = s (t) • ch – c
θ
ch – c = 5.0°C/W, Tc = 25°C
P
DM
PW
T
D =
100 m 1 10
PW
T
Switching Time Test Circuit Waveform
Vin Monitor
Vin
–10 V
D.U.T.
50Ω
Vout
Monitor
R
L
V
DD
= –30 V
Vin
Vout
10%
90%
10%
td(on)
90%
90%
10%
tr
td(off)
t
f
7

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for maximum rating, operating supply voltage range, heat radiation characteristics, installation
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failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
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