Datasheet 2SJ504 Datasheet (HIT)

Page 1
Features
Low on-resistance
R
= 0.042typ.
Low drive current.
4V gate drive devices.
High speed switching.
Outline
2SJ504
Silicon P Channel MOS FET
High Speed Power Switching
ADE-208-546
Target specification 1st. Edition
G
TO–220FM
D
S
1. Gate
2. Drain
1
2
3
3. Source
Page 2
2SJ504
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I Avalanche current IAP* Avalanche energy EAR* Channel dissipation Pch*
DSS
GSS
D
D(pulse)
DR
1
*
3
3
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
3. Value at Ta = 25°C, Rg 50 , L=100µH
–60 V ±20 V –20 A –80 A –20 A –20 A 34 mJ 30 W
2
Page 3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Zero gate voltege drain
I
DSS
current Gate to source leak current I Gate to source cutoff voltage V Static drain to source on state R resistance R
GSS
GS(off)
DS(on)
DS(on)
Forward transfer admittance |yfs| 1016—S I Input capacitance Ciss 1750 pF VDS = –10V Output capacitance Coss 800 pF VGS = 0 Reverse transfer capacitance Crss 180 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
voltage Body to drain diode reverse
t
rr
recovery time Note: 1. Pulse test
–60 V ID = –10mA, VGS = 0
±20——V I
–10 µAV
——±10 µAV
= ±100µA, VDS = 0
G
= –60 V, VGS = 0
DS
= ±16V, VDS = 0
GS
–1.0 –2.0 V ID = –1mA, VDS = –10V — 0.042 0.055 ID = –10A, VGS = –10V* — 0.065 0.095 ID = –10A, VGS = –4V*
= 10A, VDS = 10V*
D
16 ns VGS = –10V, ID = –10A — 100 ns RL = 3 230 ns — 140 ns — –1.0 V IF = –20A, VGS = 0
100 ns IF = –20A, VGS = 0
diF/ dt = 50A/µs
2SJ504
1
1
1
3
Page 4
2SJ504
Main Characteristics
Power vs. Temperature Derating
40
30
20
10
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
D
–50
–40
–10 V –8 V
–4.5 V
–6 V
–5 V
–30
–20
Pulse Test
–4 V
–3.5 V
–1000
Maximum Safe Operation Area
–300 –100
D
–30 –10
–3
Drain Current I (A)
–0.3 –0.1
this area is limited by R
Ta = 25 °C
DS(on)
Operation in
–1
–0.1 –0.3 –1 –3 –10
Drain to Source Voltage V (V)
Typical Transfer Characteristics
–50
V = –10 V
DS
Pulse Test
–40
D
–30
–20
PW = 10 ms (1 shot)
DC Operation (Tc = 25 °C)
100 µs
1 ms
–30 –100
DS
Tc = –25 °C
25 °C
10 µs
Drain Current I (A)
–10
0
–2 –4 –6 –8 –10
Drain to Source Voltage V (V)
4
–3 V
V = –2.5 V
GS
DS
–10
Drain Current I (A)
75 °C
0 –1–2–3–4–5
Gate to Source Voltage V (V)
GS
Page 5
2SJ504
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
–2.0
Pulse Test
–1.6
DS(on)
V (V)
–1.2
I = –20 A
–0.8
–0.4
D
–10 A
–5 A
Drain to Source Saturation Voltage
0
–4 –8 –12 –16 –20
Gate to Source Voltage V (V)
–2 A
GS
Static Drain to Source on State Resistance
vs. Temperature
0.2
Pulse Test
0.16
DS(on)
R ( )
0.12
0.08
V = –4 V
GS
0.04
I = –20 A
D
–10 A
–5, –10 A
–10 V
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
–5 A
–20 A
Static Drain to Source on State Resistance
1
vs. Drain Current
0.5
0.2
DS(on)
R ( )
0.1 V = –4 V
GS
0.05
0.02
Drain to Source On State Resistance
0.01
–5
–1 –2
–10 –20
Drain Current I (A)
Pulse Test
D
Forward Transfer Admittance vs.
Drain Current
100
fs
30
Tc = –25 °C
10
3
25 °C
75 °C
1
0.3
Forward Transfer Admittance |y | (S)
0.1
–0.1 –1 –10 –100
–0.3
Drain Current I (A)
V = –10 V
DS
Pulse Test
–3 –30
D
–10 V
–50
–100
5
Page 6
2SJ504
Body to Drain Diode Reverse
Recovery Time
1000
Pulse Test
500
200
100
50
20
Reverse Recovery Time trr (ns)
di / dt = 50 A / µs V = 0, Ta = 25 °C
GS
10
–0.1 –0.3 –1 –3 –10 –30 –100
Reverse Drain Current I (A)
DR
Typical Capacitance vs. Drain to Source Voltage
10000
3000
1000
300
100
Capacitance C (pF)
30
V = 0
GS
f = 1 MHz
10
0 –10 –20 –30 –40 –50
Drain to Source Voltage V (V)
Ciss
Coss
Crss
DS
Dynamic Input Characteristics
0
V = –10 V
DD
–25 V
DS
–20
–40
–60
V
DS
–50 V
V = –10 V
DD
V
GS
–25 V
–80
Drain to Source Voltage V (V)
I = –20 A
D
0
16 32 48
–50 V
Gate Charge Qg (nc)
64
80
Switching Characteristics
GS
1000
500
0
–4
200
–8
100
–12
–16
50
Switching Time t (ns)
20
Gate to Source Voltage V (V)
–20–100
10
–0.1 –0.3
Drain Current I (A)
V = –10 V, V = –30 V
GS
DD
PW = 10 µs, duty < 1 %
td(off)
tf
tr
td(on)
–1 –10 –30
–3
D
–100
6
Page 7
2SJ504
Reverse Drain Current vs.
Source to Drain Voltage
–50
–40
DR
–10 V
–30
–5 V
–20
–10
Reverse Drain Current I (A)
0
–0.4 –0.8 –1.2 –1.6 –2.0
Source to Drain Voltage V (V)
V = 0, 5 V
GS
Pulse Test
SD
Maximun Avalanche Energy vs.
Channel Temperature Derating
50
I = –20 A
AP
V = –25 V
AR
40
DD
duty < 0.1 % Rg > 50
30
20
10
0
Repetive Avalanche Energy E (mJ)
25 50 75 100 125 150
Channel Temperature Tch (°C)
Vin –15 V
V
DS
Monitor
Rg
50
Avalanche Test Circuit and Waveform
E = • L • I •
L
I
AP
AR
Monitor
I
AP
D. U. T
V
DD
V
DD
0
V
1 2
I
D
AP
2
DSS
V – V
DSS DD
V
DS
V
(BR)DSS
7
Page 8
2SJ504
3
Normalized Transient Thermal Impedance vs. Pulse Width
s (t)
1
γ
D = 1
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.01 10 µ
0.02
0.01
1shot pulse
100 µ 1 m 10 m
θ γ θ
ch – c(t) = s (t) • ch – c
θ
ch – c = 4.17°C/W, Tc = 25°C
P
DM
Pulse Width PW (S)
Tc = 25°C
PW
D =
T
PW T
100 m 1 10
Switching Time Test Circuit Waveforms
R
Vout Monitor
L
Vin
10%
Vin Monitor
D.U.T.
90%
V
Vin –10 V
50
DD
= –30 V
Vout
td(on)
10%
90%
tr
td(off)
90%
10%
t
f
8
Page 9
Package Dimensions
2SJ504
Unit: mm
1.2 ± 0.2
1.4 ± 0.2
0.7 ± 0.1
2.54 ± 0.5
10.0 ± 0.3
7.0 ± 0.3
φ
3.2 ± 0.2
12.0 ± 0.3
2.0 ± 0.3
5.0 ± 0.3
2.54 ± 0.5
4.45 ± 0.3
2.7
0.6
2.8 ± 0.2
2.5 ± 0.2
17.0 ± 0.3
14.0 ± 1.0
0.5 ± 0.1 Hitachi Code
EIAJ
JEDEC
TO–220FM
SC–67
9
Page 10
Cautions
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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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