Datasheet 2SJ486 Datasheet (HIT)

Page 1
Features
Low on-resistance
R
= 0.5 typ. (at V
2.5V gate drive devices.
Small package (MPAK).
Outline
2SJ486
Silicon P Channel MOS FET
Low FrequencyPower Switching
= –4V, ID = –100 mA)
GS
ADE-208-512 A
2nd. Edition
MPAK
G
3
1
D
S
2
1. Source
2. Gate
3. Drain
Page 2
2SJ486
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I
DSS
GSS
D
D(pulse)
1
* Channel dissipation Pch 150 mW Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
voltage Gate to source breakdown
V
(BR)GSS
voltage Zero gate voltege drain
I
DSS
current Gate to source leak current I Gate to source cutoff voltage V Static drain to source on state
R
GSS
GS(off)
DS(on)
resistance
R
DS(on)
Forward transfer admittance |yfs| 0.4 0.65 S ID = –100mA
Input capacitance Ciss 45 pF VDS = –10V Output capacitance Coss 76 pF VGS = 0 Reverse transfer capacitance Crss 5.4 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t
d(on)
r
d(off)
f
Notes: 1. Pulse test
2. Marking is “ZU–”.
–30 V ID = –10µA, VGS = 0
±10——V I
–1.0 µAV
——±5.0 µAV –0.5 –1.5 V ID = –10µA, VDS = –5V — 0.5 0.65 ID = –100mA
0.7 1.2 ID = –40mA
120 ns VGS = –4V — 340 ns ID = –150mA — 850 ns RL = 66.6 550 ns
–30 V ±10 V –0.3 A –0.6 A
= ±100µA, VDS = 0
G
DS
GS
V
GS
V
GS
V
DS
= –30 V, VGS = 0
= ±6.5V, VDS = 0
1
= –4V*
= –2.5V*
= –10V*
1
1
2
Page 3
Main Characteristics
2SJ486
200
Power vs. Temperature Derating
150
100
50
Channel Dissipation Pch (mW)
0
50 100 150 200
Ambient Temperature Ta (°C)
Typical Output Characteristics
–1.0
–10 V
–0.8
D
–0.6
–5 V
–4 V
–2.5 V
–2 V
Maximum Safe Operation Area
D
–0.03
–0.01
–1
–0.3
–0.1
Operation in this area is limited by R
DC Operation
DS(on)
1 ms
PW = 10 ms
(1 shot)
Drain Current I (A)
–0.003
–0.001
Ta = 25 °C
–0.1 –0.3 –1 –3 –10 –30 –100
Drain to Source Voltage V (V)
Typical Transfer Characteristics
–1.0
V = –10 V
DS
Pulse Test
–0.8
D
–0.6
Tc = 75 °C
DS
–0.4
Drain Current I (A)
–0.2
0
–0.2 –0.4 –0.6 –0.8 –1.0
Drain to Source Voltage V (V)
Ta = 25°C Pulse Test
V = –1.5 V
GS
DS
–0.4
–0.2
Drain Current I (A)
25 °C
–25 °C
0 –1–2–3–4–5
Gate to Source Voltage V (V)
GS
3
Page 4
2SJ486
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
–0.5
–0.4
DS(on)
V (V)
–0.3
–0.2
–0.1
Drain to Source Saturation Voltage
0
–2 –4 –6 –8 –10
Gate to Source Voltage V (V)
Static Drain to Source on State Resistance
vs. Temperature
2.0
Pulse Test
1.4
DS(on)
R ( )
1.2
V = –2.5 V
0.8
0.4
GS
–4 V
Ta = 25°C Pulse Test
–0.2 A
–0.1 A
GS
–0.1, –0.2 A
–0.1, –0.2 A
Static Drain to Source on State Resistance
10
vs. Drain Current
Ta = 25°C
5
DS(on)
2
R ( )
1
0.5
V = –2.5 V
GS
–4 V
Pulse Test
0.2
Drain to Source On State Resistance
0.1
–0.01 –0.03 –0.1 –0.3 –1 –3 –10
Drain Current I (A)
D
Forward Transfer Admittance vs.
Drain Current
5
V = –10 V
fs
DS
Pulse Test
2
1
0.5
Ta = –25 °C
25 °C
75 °C
0.2
0.1
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
4
Forward Transfer Admittance |y | (S)
0.05 –0.01 –0.1 –1
–0.02 –0.05 –0.2 –0.5
Drain Current I (A)
D
Page 5
Typical Capacitance vs. Drain to Source Voltage
1000
300
100
Coss
30
10
Capacitance C (pF)
3
1
0 –4 –8 –12 –16 –20
Drain to Source Voltage V (V)
V = 0
GS
f = 1 MHz
Ciss
Crss
DS
10000
Switching Characteristics
3000
t
1000
300
d(off)
t
f
t
r
t
d(on)
100
Switching Time t (ns)
30
10
V = –4 V, V = –10 V
GS
DD
PW = 5 µs, duty < 1 %
–0.05 –0.1 –0.2 –0.5 –1
Drain Current I (A)
D
2SJ486
Reverse Drain Current vs.
Source to Drain Voltage
–1.0
–0.8
DR
–0.6
V = 0, 5 V
GS
–5 V
–0.4
–0.2
Reverse Drain Current I (A)
0
–0.4 –0.8 –1.2 –1.6 –2.0
Source to Drain Voltage V (V)
Pulse Test
SD
5
Page 6
2SJ486
Switching Time Test Circuit Waveform
R
L
V
DD
= –10 V
Vout Monitor
Vin
10%
90%
Vin Monitor
Vin –10 V
D.U.T.
50
90%
90%
Vout
td(on)
10%
10%
tr
td(off)
t
f
6
Page 7
Package Dimensions
0.4
0.95
0.95
1.9
+ 0.3
2.8
– 0.1
+ 0.10 – 0.05
+ 0.1
0.65
+ 0.1
0.65
0.3
– 0.3
1.5
– 0.3
+ 0.2
2.8
+ 0.2
1.1
– 0.6
– 0.1
0.16
0 ~ 0.1
+ 0.10 – 0.06
Hitachi Code
EIAJ
JEDEC
2SJ486
Unit: mm
MPAK
SC–59A
TO–236Mod
7
Page 8
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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