The 2SJ463A is a switching device which can be driven directly
by a 2.5 V power source.
The 2SJ463A has excellent switching characteristics, and is
suitable for use as a high-speed switching device in digital circuits.
FEATURES
• Can be driven by a 2.5 V power source.
• Low Gate Cut-off Voltage.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Drain to Source VoltageVDSS–30V
Gate to Source VoltageV
Drain Current (DC)ID(DC)+0.1A
Drain Current (pulse)ID(pulse)+0.4
Total Power DissipationP
Channel TemperatureTch150°C
Storage TemperatureTstg–55 to +150°C
µ
Note PW ≤ 10
s, Duty Cycle ≤ 1 %
GSS+20V
Note
T150mW
A
Package Drawings (unit: mm)
Equivalent Circuit
Drain
Gate
Electrode
Connection
1. Source
2. Gate
3. Drain
Internal Diode
Document No. D11198EJ1V0DS00 (1st edition)
Date Published September 1996 P
Printed in Japan
The diode connected between the gate and source of the transistor serves as a protector against ESD. When this
device is actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage
may be applied to this device.
CHARACTERISTIC SYMBOLMIN.TYP.MAX.UNITTEST CONDITIONS
Drain Cut-off CurrentIDSS–1
Gate Leakage CurrentIGSS+10
Gate Cut-off VoltageVGS(off)–1.0–1.4–1.7VVDS = –3 V, ID = –10 µA
Forward Transfer Admittance| y fs |20mSVDS = –3 V, ID = –10 mA
Drain to Source On-StateRDS(on)12360ΩVGS = –2.5 V, ID = –1 mA
Resistance
Drain to Source On-StateRDS(on)21123ΩVGS = –4 V, ID = –10 mA
Resistance
Drain to Source On-StateRDS(on)3613ΩVGS = –10 V, ID = –10 mA
Resistance
Input CapacitanceCiss5pFVDS = –3 V
Output CapacitanceCoss15pFVGS = 0
Reverse Transfer CapacitanceCrss1.3pFf = 1 MHz
Turn-on Delay Timetd(on)140nsVDD = –3 V, ID = –10 mA
Rise Timetr330nsVGS(on) = –4 V, RG = 10 Ω
Turn-off Delay Timetd(off)220nsRL = 300 Ω
Fall Timetf320ns
µ
AVDS = –30 V, VGS = 0
µ
AVGS = +20 V, VDS = 0
2SJ463A
2
Page 3
2SJ463A
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
100
80
60
40
dT - Derating Factor - %
20
0
0 30 60 90 120 150
T
A
- Ambient Temperature - °C
TRANSFER CHARACTERISTICS
–100
V
DS
= –3 V
–10
TA = 125 °C
–1
TA = 75 °C
TA = 25 °C
–0.1
- Drain Current - mA
D
I
–0.01
TA = –25 °C
–0.001
0 –0.8 –1.6 –2.4 –3.2 –4.0
V
GS
- Gate to Source Voltage - V
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
–100
–80
–60
–40
- Drain Current - mA
D
I
–20
0
0 –1 –2 –3 –4 –5
V
GS
= –10 V
V
GS
= –6 V
V
GS
= –4 V
V
DS
- Drain to Source Voltage - V
V
V
GS
GS
= –3 V
= –2.5 V
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
1000
V
DS
= –3 V
100
TA = –25 °C
TA = 25 °C
10
TA = 75 °C
TA = 125 °C
I - Forward Transfer Admittance - mS
fs
Iy
1
–0.1 –1 –10 –100 –1000
D
- Drain Current - mA
I
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
60
V
GS
= –2.5 V
50
40
TA = 125 °C
TA = 75 °C
30
20
TA = 25 °C
10
- Drain to Source On-State Resistance - Ω
0
DS(on)
–0.1 –1 –10 –100 –1000
R
TA = –25 °C
ID - Drain Current - mA
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
60
V
GS
= –4 V
50
40
30
TA = 125 °C
20
TA = 75 °C
10
- Drain to Source On-State Resistance - Ω
0
DS(on)
–0.1 –1 –10 –100 –1000
R
I
D
- Drain Current - mA
TA = 25 °C
TA = –25 °C
3
Page 4
2SJ463A
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
60
GS
=
–10 V
V
50
40
30
T
A
=
T
A
=
20
25 °C
T
A
=
–25 °C
75 °C
T
A
=
125 °C
10
- Drain to Source On-Stage Resistance - Ω
0
DS(on)
–0.1 –1 –10 –100 –1000
R
I
D
- Drain Current - mA
CAPACITANCE vs.
DRAIN TO SOURCE VOLTAGE
100
V
GS
= 0
f = 1 MHz
C
oss
10
- Capacitance - pF
rss
,C
oss
,C
iss
C
C
iss
C
rss
1
–1 –10 –100
V
DS
- Drain to Source Voltage - V
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
60
50
I
D
=
40
30
I
D
I
D
–1 mA
=
–10 mA
=
–100 mA
20
10
- Drain to Source On-State Resistance - Ω
0
DS(on)
R
0 –2 –4 –6 –8 –10
V
GS
- Gate to Source Voltage - V
SWITCHING CHARACTERISTICS
1000
t
r
t
f
t
d(on)
100
- Switching Time - ns
f
,t
d(off)
,t
r
,t
V
DD
d(on)
t
= –3 V
GS(on)
= –
in
= 10 Ω
4 V
V
R
10
–10 –100 –1000
t
d(off)
ID - Drain Current - mA
SOURCE TO DRAIN DIODE
FORWARD VOLTAGE
–1000
–100
–10
–1
- Reverse Drain Current - mA
D
I
–0.1
–0.2 –0.4 –0.6 –0.8 –1.0 –1.2
SD
- Source to Drain Voltage - V
V
4
Page 5
2SJ463A
REFERENCE
Document NameDocument No.
NEC semiconductor device reliability/quality control systemTEI-1202
Quality grade on NEC semiconductor devicesC11531E
Semiconductor device mounting technology manualC10535E
Guide to quality assurance for semiconductor devicesMEI-1202
Semiconductor selection guideX10679E
5
Page 6
[MEMO]
2SJ463A
6
Page 7
[MEMO]
2SJ463A
7
Page 8
2SJ463A
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard:Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific:Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.