Datasheet 2SH31 Datasheet (HIT)

Page 1
Features
High speed switching
Outline
2SH31
Silicon N Channel IGBT
High Speed Power Switching
ADE-208-793(Z)
1st. Edition
May 1999
TO–3P
C
G
E
1
2
3
1. Gate
2. Collector (Flange)
3. Emitter
Page 2
2SH31
C
G
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Collector to Emitter voltage V Gate to Emitter voltage V Collector current I
CES
GES
C
Collector peak current ic(peak) 150 A Collector dissipation P
C
Note1
Channel temperature Tj 150 °C Storage temperature Tstg 55 to +150 °C
Note: 1. Value at Tc = 25°C
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Zero gate voltage collector
I
CES
current Gate to emitter leak current I Gate to emitter cutoff voltage V Collector to emitter saturation
V
GES
GE(off)
CE(sat)
voltage Input capacitance Cies 4100 pF V
Switching time t
r
t
on
t
f
t
off
100 µAV
±1 µAV
6.0 8.0 V IC = 75mA, VCE = 10V 2.1 2.6 V IC = 75A, VGE = 15V
400 ns IC = 75A  600 ns RL = 4 Ω  300 600 ns VGS = ±15V  800 1600 ns Rg = 50
600 V ±20 V 75 A
150 W
CE
GE
E
f = 1MHz
= 600V, VGE = 0
= ± 20 V, VCE = 0
= 10V, V
E
= 0
2
Page 3
Main Characteristics
2SH31
Power vs. Temperature Derating
200
150
100
50
Channel Dissipation Pch (W)
0
200 100
50
C
50 100 150 200
Case Temperature Tc (°C)
Reverse Bias SOA
1000
300 100
0.3
0.1
Collector Current I (A)
0.03
0.01
100
Maximum Safe Operation Area
30 10
PW = 10 ms (1shot)
3 1
Ta = 25 °C
0.1 0.3 1 3 10 30 100 Collector to Emitter Voltage V (V)
Typical Output Characteristics
15 V
80
DC Operation (Tc = 25°C)
11 V
100 µs
1 ms
3001000
CE
Pulse Test
10 V
20 10
5
Collector Current I (A)
2
Tc = 25 °C
1
0
200 400 600 800
Collector to Emitter Voltage V (V)
CE
60
40
20
Collector Current I (A)
0
246810
Collector to Emitter Voltage V (V)
V = 8 V
9 V
GE
CE
3
Page 4
2SH31
Collector Current I (A)
Typical Transfer Characteristics
100
V = 10 V
CE
Pulse Test
80
C
60
40
Tc = 75°C
20
0
4 8 12 16 20
Gate to Emitter Voltage V (V)
–25°C
25°C
GE
Collector to Emitter Saturation Voltage
vs. Gate to Emitter Voltage
5
Pulse Test
4
CE(sat)
V (V)
3
I = 75 A
C
2
50 A
1
Collector to Emitter Saturation Voltage
0
48
12
Gate to Emitter Voltage V (V)
25 A
16 20
GE
Collecot to Emitter Saturation Voltage
vs. Collector Current
10
5
CE(sat)
V (V)
2
–25°C
25°C
1
Tc = 75°C
0.5
0.2
V = 15 V
GE
Collector to Emitter Saturation Voltage
Pulse Test
1 5 20 10021050
Collector Current I (A)
C
Typical Capacitance vs.
Collecotor to Emitter Voltage
100000
30000 10000
3000 1000
Capacitance C (pF)
300 100
50
01020304050 Collector to Emitter Voltage V (V)
V = 0
GE
f = 1 MHz
Cies
Coes
Cres
CE
4
Page 5
2SH31
Dynamic Input Characteristics
1000
V = 200 V
CE
800
CC
300 V 400 V
600
400
200
Collector to Emitter Voltage V (V)
V
CE
V = 400 V
CC
300 V 200 V
0
80 160 240 320 400
I = 75 A
C
Gate Charge Qg (nc)
Switching Characteristics
10000
3000
I = 75 A, R = 4
C
V = ±15 V
GE
L
t
d(off)
1000
300
Switching Characteristics
GE
1000
500
200
t
d(off)
t
f
t
d(on)
20
V
GE
16
12
100
8
50
t
r
Switching Time t (ns)
4
0
20
Gate to Emitter Voltage V (V)
10
12 5
V = 300V, V = ±15 V
CC
Rg = 50 , Ta = 25°C
10
Collector Current I (A)
GE
20 50 100
C
Switching Characteristics
1000
t
t
500
200
t
f
100
d(off)
t
d(on)
f
t
r
100
t
r
Switching Time t (ns)
30
t
d(on)
10
1 3 10 30 100 300 1000
Gate Resistance Rg ( )
50
Switching Time t (ns)
20
10
I = 75 A, R = 4
C
V = ±15 V, Rg = 50
GE
L
25 50 75 100 125
Case Temperature Tc (°C)
5
Page 6
2SH31
Normalized Transient Thermal Impedance vs. Pulse Width
3
s (t)
1
γ
D = 1
0.5
0.3
0.2
θ γ θ
0.1
0.1
ch – c(t) = s (t) • ch – c
θ
ch – c = 0.83 °C/W, Tc = 25 °C
0.05
P
0.03
Normalized Transient Thermal Impedance
0.02
0.01
DM
1shot pulse
0.01 10 µ
100 µ 1 m 10 m
100 m 1 10
Pulse Width PW (S)
Switching Time Test Circuit Waveform
10%
0
Vin
Ic Monitor
V
CE
90%
PW
T
Tc = 25°C
PW
D =
T
90%
Vin Monitor
Rg
V
CE
Monitor
D.U.T.
R
L
V
CC
td(on)
ton
10%
tr
90%
Vin ± 15 V
Ic
td(off)
10%
tf
toff
6
Page 7
Package Dimensions
16.0 max
0.5 typ
φ
3.2 ± 0.2
1.0 typ
2SH31
Unit: mm
5.0 max
1.5 typ
5.0 ± 0.3
1.6 typ
1.4 max
3.6 typ
5.45 ± 0.2 5.45 ± 0.2
2.0 typ
2.0 typ
1.0 ± 0.2
0.9 typ
1.0 typ
14.9 ± 0.2
20.1 max18.0 ± 0.5
0.3 typ
2.8 typ
0.6 ± 0.2
Hitachi Code
EIAJ
JEDEC
TO–3P SC–65
7
Page 8
2SH31
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.
8
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