Datasheet 2SC4536 Datasheet (NEC) [ru]

Page 1
DATA SHEET
NPN SILICON RF TRANSISTOR
2SC4536
HIGH-FREQUENCY LOW-NOISE AMPLIFICATION
3-PIN POWER MINIMOLD
DESCRIPTION
The 2SC4536 is designed for use in middle power, low distortion low noise figure RF amplifier. It features excellent linearity and large dynamic range, which make it suitable for CATV, telecommunication, and other use, it employs plastic surface mount type package (SOT-89).
FEATURES
• Low distortion: IM2 = 59.0 dBc TYP., IM3 = 82.0 dBc TYP. @ VCE = 10 V, IC = 50 mA
• Low noise: NF = 2.0 dB TYP. @ VCE = 10 V, IC = 50 mA, f = 1 GHz
tot
• Large P
• Small package : 3-pin power minimold package
tot
: P
= 2.0 W (Mounted on double-sided copper-clad 16 cm2 × 0.7 mm (t) ceramic substrate)
ORDERING INFORMATION
Part Number Quantity Supplying Form 2SC4536 25 pcs (Non reel) • 12 mm wide embossed taping 2SC4536-T1 1 kpcs/reel • Collector face the perforat i on side of the tape
Remark
To order evaluation samples, contact your nearby sales office. The unit sample quantity is 25 pcs.
ABSOLUTE MAXIMUM RATINGS (TA = +25°°°°C)
Parameter Symbol Ratings Unit Collector to Base Voltage V Collector to Emitter Voltage V Emitter to Base Voltage V Collector Current I Total Power Dissipation Junction Temperature T Storage Temperature T
CBO
CEO
EBO
C
Note
tot
P
j
stg
30 V 15 V
3.0 V
250 mA
2.0 W
150
65 to +150
°
C
°
C
2
Mounted on double-sided copper-clad 16 cm
Note
× 0.7 mm (t) ceramic substrate
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information.
Document No. PU10338EJ01V0DS (1st edition) (Previous No. P10369EJ2V1DS00) Date Published May 2003 CP(K) Printed in Japan
The mark
••••
shows major revised points.
NEC Compound Semiconductor Devices 1994, 2003

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ELECTRICAL CHARACTERISTICS (TA = +25°°°°C)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
DC Characteristics
h
NF NF
CBO
VCB = 20 V, IE = 0 mA 5.0
EBO
VEB = 2 V, IC = 0 mA 5.0
Note 1
FE
VCE = 10 V, IC = 50 mA 60 200
2
21e
S
VCE = 10 V, IC = 50 mA, f = 1 GHz 5.5 7.2 dB
Note 2
VCE = 10 V, IC = 50 mA, f = 500 MHz 1.5 dB
Note 2
VCE = 10 V, IC = 50 mA, f = 1 GHz 2.0 dB VCE = 10 V, IC = 50 mA, RS = RL = 75 Ω,
2
O
V
= 105 dBµV/75 Ω, f1 = 190 MHz,
2
f
= 90 MHz, f = f1 − f
VCE = 10 V, IC = 50 mA, RS = RL = 75 Ω,
3
O
V
= 105 dBµV/75 Ω, f1 = 190 MHz,
2
f
= 200 MHz, f = 2 × f1 − f
Collector Cut-off Current I Emitter Cut-off Current I DC Current Gain RF Characteristics Insertion Power Gain Noise Figure (1) Noise Figure (2) 2nd Order Intermoduration Distorti on IM
3rd Order Intermoduration Distorti on IM
2SC4536
µ
A
µ
A
59.0 dBc
2
82.0 dBc
2
Notes 1.
Pulse measurement: PW ≤ 350 RS = RL = 50 Ω, tuned
2.
hFE CLASSIFICATION
Rank QR QS
Marking QR QS
hFE Value 60 to 120 100 to 200
s, Duty Cycle ≤ 2%
µ
2
Data Sheet PU10338EJ01V0DS
Page 3
TYPICAL CHARACTERISTICS (TA = +25°°°°C)
2SC4536
TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE
2 500
2 000
(mW)
tot
Ceramic Substrate
2
× 0.7 mm (t)
16 cm R
th (j-a)
62.5˚C/W
1 500
1 000
Free Air
th (j-a)
312.5˚C/W
R
500
400
Total Power Dissipation P
0
25 50 75 100 125 150
Ambient Temperature TA (˚C)
COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE
100
80
(mA)
C
IB = 0.6 mA
0.5 mA
0.4 mA
REVERSE TRANSFER CAPACITANCE
vs. COLLECTOR TO BASE VOLTAGE
5
(pF)
re
2
1
0.5
Reverse Transfer Capacitance C
0.2 1 5 10 30
Collector to Base Voltage VCB (V)
f = 1 MHz I
E
= 0 mA
DC CURRENT GAIN vs. COLLECTOR CURRENT
300
FE
100
VCE = 10 V
60
40
Collector Current I
20
0
Collector to Emitter Voltage VCE (V)
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
10
5
(GHz)
T
2
1
0.5
Gain Bandwidth Product f
0.2
Collector Current IC (mA)
0.3 mA
0.2 mA
0.1 mA
10 20
V
CE
= 10 V
100 3001055030
50 30
DC Current Gain h
10
Collector Current IC (mA)
INSERTION POWER GAIN, MAXIMUM POWER GAIN, MAG vs. FREQUENCY
G
20
(dB)
(dB)
2
|
max (u)
21e
10
Insertion Power Gain |S
0
Maximum Power Gain G
Maximum Available Power Gain MAG (dB)
0.1 0.2 0.3 0.5 1 2 3
max (u)
2
|S
21e
|
Frequency f (GHz)
1000.1 1 10 1 000
CE
= 10 V
V
C
= 50 mA
I
MAG
Data Sheet PU10338EJ01V0DS
3
Page 4
2SC4536
INSERTION POWER GAIN, MAXIMUM POWER
GAIN, MAG vs. COLLECTOR CURRENT
10
8
(dB)
2
max (u) (dB)
6
4
2
0
Maximum Available Power Gain MAG (dB)
Insertion Power Gain |S21e|
Maximum Power Gain G
10 10030 50 300
Collector Current I
MAG
Gmax (u)
|S21e|
VCE = 10 V f = 1 GHz
C (mA)
IM3, IM2+, IM2– vs. COLLECTOR CURRENT
80
2+ (dBc)
2– (dBc)
VCE = 10 V
70
IM3
NOISE FIGURE vs. COLLECTOR CURRENT
5
4
2
3
2
Noise Figure NF (dB)
1
0
5 10 20 50 100 200
Collector Current I
VCE = 10 V f = 1 GHz
C (mA)
60
50
40
30
IM
3 :VO = 110 dB V/75 Ω 2 tone each
f = 2 × 190 – 200 MHz
2+ :VO = 105 dB V/75 2 tone each
IM
f = 90 + 100 MHz
IM
2– :VO = 105 dB V/75 Ω 2 tone each
f = 190 – 90 MHz
IM2+ IM2–
µ µ µ
10 30 50 100 300
2nd Order Intermodulation Distortion (–) IM
2nd Order Intermodulation Distortion (+) IM
3rd Order Intermodulation Distortion IM3 (dBc)
Remark
The graphs indicate nominal characteristics.
Collector Current I
C (mA)
S-PARAMETERS
S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form
(S2P) that enables direct import to a microwave circuit simulator without keyboard input.
Click here to download S-parameters. [RF and Microwave] [Device Parameters] URL http://www.csd-nec.com/
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Data Sheet PU10338EJ01V0DS
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PACKAGE DIMENSIONS 3-PIN POWER MINIMOLD (UNIT: mm)
2SC4536
4.5±0.1
0.8 MIN.
1.6±0.2
C
EB
0.47±0.06
1.5
3.0
2.5±0.1
0.42±0.060.42±0.06
PIN CONNECTIONS
E : Emitter C: Collector (Fin) B : Base
(IEC : SOT-89)
1.5±0.1
4.0±0.25
0.41
+0.03
–0.06
Data Sheet PU10338EJ01V0DS
5
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2SC4536
The information in this document is current as of May, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information.
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M8E 00. 4 - 0110
6
Data Sheet PU10338EJ01V0DS
Page 7
2SC4536
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 E-mail: salesinfo@csd-nec.com
NEC Compound Semiconductor Devices Hong Kong Limited
Hong Kong Head Office Taipei Branch Office Korea Branch Office
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0302-1
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