Datasheet 2SC4046 Datasheet (HIT)

Page 1
Application
High voltage amplifier
Outline
2SC4046
Silicon NPN Epitaxial
1. Emitter
2. Collector
1
2
3
3. Base
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Collector to base voltage V Collector to emitter voltage V Emitter to base voltage V Collector current I Collector power dissipation PC* Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. Value at TC = 25°C
CBO
CEO
EBO
C
1
120 V 120 V 5V
0.2 A 8W
Page 2
2SC4046
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Collector to base breakdown
V
(BR)CBO
voltage Collector to emitter breakdown
V
(BR)CEO
voltage Emitter to base breakdown
V
(BR)EBO
voltage Collector cutoff current I
CBO
DC current transfer ratio hFE* Base to emitter voltage V Collector to emitter saturation
V
BE
CE(sat)
voltage Gain bandwidth product f
T
Collector output capacitance Cob 3.5 pF VCB = 30 V, f = 1 MHz, IE = 0 Note: 1. The 2SC4046 is grouped by hFE as follows.
Grade D E
h
FE
250 to 500 400 to 800
120 V IC = 10 µA, IE = 0
120 V IC = 1 mA, RBE =
5——VI
= 10 µA, IC = 0
E
——10µAVCB = 80 V, IE = 0
1
250 800 VCE = 5 V, IC = 10 mA — 1.0 V — 1.0 V IC = 200 mA, IB = 20 mA
350 MHz VCE = 10 V, IC = 50 mA
Maximum Collector Dissipation Curve
12
10
8
6
4
2
Collector power dissipation Pc (W)
0 50 150100
Case Temperature T
C
(°C)
Area of Safe Operation
1.0
Single Pulse Ta = 25°C
(A)
C
DC Operation
= 25°C
T
C
0.1
Collector Current I
0.01 1 10 100 1,000
Collector to emitter Voltage V
PW = 1 ms
(25 V, 0.4 A)
(80 V, 0.125 A)
(80 V, 0.1 A)
(120 V, 0.055 A) (120 V, 0.05 A)
CE
(V)
2
Page 3
100
80
(mA)
C
60
Typical Output Characteristics
120
100
80
1,000
FE
100
2SC4046
DC Current Transfer Ratio vs.
Collector Current
Ta = 75°C
25–25
40
20
Collector Current I
0
4 8 12 18
Collector to emitter Voltage V
Base to Emitter Voltage
10
(V)
1.0
BE
V
Base to emitter voltage
25
0.1 1 10 100 1,000
Collector current I
60 40
20 µA
IB = 0
vs. Collector Current
VCE = 10 V Pulse Test
Ta = –25°C
75
(mA)
C
CE
(V)
20
10
DC current transfer ratio h
VCE = 10 V Pulse Test
1 10 100 1,000
Collector current I
(mA)
C
Collector to Emitter Saturation
Voltage vs. Collector Current
10
IC/IB = 10 Pulse Test
1.0
(V)
CE (sat)
V
0.1
Ta = 75°C
25
–25
Collector to emitter saturation voltage
0.01 1 10 100 1,000
Collector current I
(mA)
C
3
Page 4
2SC4046
Gain Bandwidth Product vs.
Collector Current
1,000
(MHz)
T
V
CE
= 20 V
100
Pulse Test
10
Gain bandwidth product f
1
1 2 5 10 20 50 100
Collector current I
(mA)
C
Collector Output Capacitance vs.
Collector to Base Voltage
100
(pF)
50
ob
5
10
20
10
f = 1 MHz I
= 0
E
5
2
Collector output capacitance C
1
1 2 5 10 20 50 100
Collector to base voltage V
CB
(V)
4
Page 5
Unit: mm
2.3 ± 0.3
0.8
2.29 ± 0.5
8.0 ± 0.5
120°
120°
φ
120°
3.7 ± 0.7
1.1
2.29 ± 0.5
3.1
11.0 ± 0.5
15.6 ± 0.5
+0.15 –0.1
0.55
2.7 ± 0.4
1.2
Hitachi Code JEDEC EIAJ
(reference value)
Weight
TO-126 Mod — —
0.67 g
Page 6
Cautions
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2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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