ItemSymbol2SC3127*
Collector to base voltageV
Collector to emitter voltageV
Emitter to base voltageV
Collector currentI
Collector power dissipationP
CBO
CEO
EBO
C
C
202020V
121212V
333V
505050mA
150350600mW
1
2SC31282SC3510Unit
Junction temperatureTj150150150°C
Storage temperatureTstg–55 to +150–55 to +150–55 to +150°C
2
Page 3
2SC3127, 2SC3128, 2SC3510
Electrical Characteristics (Ta = 25°C)
ItemSymbol MinTypMaxUnitTest conditions
Collector to base breakdown
V
(BR)CBO
20——V I
voltage
Collector to emitter breakdown
V
(BR)CEO
12——V I
voltage
Emitter cutoff currentI
Collector cutoff currentI
DC current transfer ratioh
EBO
CBO
FE
——10µAVEB = 3 V, IC = 0
——0.5µAVCB = 12 V, IE = 0
3090200VCE = 5 V, IC = 20 mA
Collector output capacitanceCob—0.91.5pFVCB = 5 V, IE = 0, f = 1 MHz
Gain bandwidth productf
T
3.54.5—GHzVCE = 5 V, IC = 20 mA
Power gainPG—10.5—dBVCE = 5 V, IC = 20 mA,
Noise figureNF—2.2—dBVCE = 5 V, IC = 5 mA,
DC Current Transfer Ratio vs.
Maximum Collector Dissipation Curve
600
2SC3510
FE
200
160
VCE = 5 V
= 10 µA, IE = 0
C
= 1 mA, RBE = ∞
C
f = 900 MHz
f = 900 MHz
Collector Current
400
2SC3128
200
2SC3127
Collector Power Dissipation Pc (mW)
050100150200
Ambient Temperature Ta (°C)
120
80
40
DC Current Transfer Ratio h
0
125102050100
Collector Current I
(mA)
C
3
Page 4
2SC3127, 2SC3128, 2SC3510
Gain Bandwidth Product vs.
Collector Current
5.0
4.0
(GHz)
T
3.0
2.0
1.0
VCE = 5 V
f = 500 MHz
Gain Bandwidth Product f
0
12 51020 50
Collector Current I
(mA)
C
Reverse Transfer Capacitance vs.
Collector to Base Voltage
2.0
(pF)
re
f = 1 MHz
Emitter Common
1.6
1.2
0.8
Collector Output Capacitance vs.
Collector to Base Voltage
2.0
(pF)
ob
1.6
f = 1 MHz
= 0
I
E
1.2
0.8
0.4
Collector Output Capacitance C
0
12 51020 50
Collector to Base Voltage VCB (V)
Power Gain and Noise Figure vs.
Collector Current
20
16
PG
12
VCE = 5 V
f = 500 MHz
8
0.4
Reverse Transfer Capacitance C
0
12 51020 50
Collector to Base Voltage VCB (V)
Power Gain PG (dB)
Noise Figure NF (dB)
4
NF
0
0 1020304050
Collector Current IC (mA)
4
Page 5
Power Gain and Noise Figure vs.
Collector Current
12
2SC3127, 2SC3128, 2SC3510
2nd I.M. Distortion vs. Collector Current
70
10
8
PG
VCE = 5 V
f = 900 MHz
6
Power Gain PG (dB)
Noise Figure NF (dB)
4
NF
2
0 1020304050
Collector Current IC (mA)
2nd I.M. Distortion vs. Collector Current
70
60
50
40
30
2nd I.M. Distortion 2nd I.M.D. (dB)
VCC = 12 V
f
= 600 MHz, f2 = 650 MHz
1
= 100 dBµ
V
out
f
= 1,250 MHz
2nd
20
0 1020304050
Collector Current IC (mA)
60
50
40
30
2nd I.M. Distortion 2nd I.M.D. (dB)
VCC = 12 V
= 210 MHz, f2 = 200 MHz
f
1
V
= 100 dBµ
out
f
= 410 MHz
2nd
20
0 1020304050
Collector Current IC (mA)
3rd I.M. Distortion vs. Collector Current
80
f = 190 MHz
70
f = 220 MHz
60
50
40
3rd I.M. Distortion 3rd I.M.D. (dB)
VCC = 12 V
f
= 210 MHz, f2 = 200 MHz
1
V
= 100 dBµ
out
f
= 190 MHz, 220 MHz
3rd
30
0 1020304050
Collector Current IC (mA)
5
Page 6
2SC3127, 2SC3128, 2SC3510
3rd I.M. Distortion vs. Collector Current
70
60
f = 550 MHz
3rd I.M. Distortion 3rd I.M.D. (dB)
10
8
6
4
Noise Figure NF (dB)
2
50
f = 700 MHz
40
30
VCC = 12 V
= 600 MHz, f2 = 650 MHz
f
1
V
= 100 dBµ
out
f
= 550 MHz, 700 MHz
3rd
20
0 1020304050
Collector Current IC (mA)
Noise Figure vs. Frequency
Post AMP. NF
NF
VCC = 12 V
= 20 mA
I
C
0
400500600700800900
Frequency f (MHz)
6
Page 7
10
8
6
4
Power Gain PG (dB)
2
2SC3127, 2SC3128, 2SC3510
Power Gain vs. Frequency
VCC = 12 V, IC = 20 mA
Input Power Level
–50 dBm
0
10
8
6
4
Power Gain PG (dB)
2
0
Frequency f (MHz)
Power Gain vs. Frequency
= 30 mA
I
C
VCC = 12 V
Input Power Level
–50 dBm
Frequency f (MHz)
1,000750500250
IC = 20 mA
IC = 10 mA
IC = 5 mA
1,000750500250
7
Page 8
2SC3127, 2SC3128, 2SC3510
0
Input and Output Reflection Coefficient vs. Frequency
–5
–10
11&S22 (dB)
S
–15
Input and Output Reflection Coefficient
–20
Input
50 p
50 p
Rg = 50 Ω
L
L
1
2
2.4 k
2,200 p
S
22
S11
VCC = 12 V, IC = 20 mA
Input Power Level
–50 dBm
Frequency f (MHz)
Vhf to Uhf Wide Band Amp. Circuit
47050 p
5 p
110
1.2 p
4,400 p
T
1
4,400 p
1,200 p
2.5 p
1,0007505002500
Output
RL = 50 Ω
V
BB
Parts Spcecification
L
: Inside dia φ3.0 mm, φ0.4 mm Polyurethane Coated Copper wire 12 Turns.
1
: Inside dia φ3.5 mm, φ0.5 mm Polyurethane Coated Copper wire 9 Turns.
L
2
T
: Balance wind used Ferrite Core
1
Outside dia φ4.0 mm, Inside dia φ2.0 mm
φ0.1 mm Polyurethane Coated Copper wire 3 Turns.
Ratio Input to Output is 2 : 1
8
V
CC
Unit R : Ω
C : F
Page 9
Package Dimensions
2SC3127, 2SC3128, 2SC3510
As of January, 2001
Unit: mm
0.4
+ 0.10
– 0.05
0.95
0.95
1.9 ± 0.2
2.95 ± 0.2
0.65
+ 0.2
1.5 ± 0.15
0.65
0.3
+ 0.2
– 0.6
2.8
– 0.1
1.1
+ 0.10
0.16
– 0.06
0 – 0.1
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
MPAK
—
Conforms
0.011 g
9
Page 10
2SC3127, 2SC3128, 2SC3510
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 585160
Hitachi Asia Ltd.
Hitachi Tower
16 Collyer Quay #20-00,
Singapore 049318
Tel : <65>-538-6533/538-8577
Fax : <65>-538-6933/538-3877
URL : http://www.hitachi.com.sg
Hitachi Asia Ltd.
(Taipei Branch Office)
4/F, No. 167, Tun Hwa North Road,
Hung-Kuo Building,
Taipei (105), Taiwan
Tel : <886>-(2)-2718-3666
Fax : <886>-(2)-2718-8180
Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
10
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon,
Hong Kong
Tel : <852>-(2)-735-9218
Fax : <852>-(2)-730-0281
URL : http://www.hitachi.com.hk
Colophon 2.0
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