Datasheet 2SC1472 Datasheet (HIT)

Page 1
Application
High gain amplifier
Outline
TO-92 (1)
2SC1472(K)
Silicon NPN Epitaxial, Darlington
3
2
1. Emitter
2. Collector
3. Base
1
Page 2
2SC1472 (K)
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Collector to base voltage V Collector to emitter voltage V Emitter to base voltage V Collector current I Collector peak current i Collector power dissipation P
CBO
CEO
EBO
C
C(peak)
C
Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C
40 V 30 V 10 V 300 mA 500 mA 500 mW
Page 3
2SC1472 (K)
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Collector to emitter breakdown
V
(BR)CEO
voltage Collector cutoff current I Emitter cutoff current I DC current transfer ratio h
Collector to emitter saturation
V
CBO
EBO
FE1
FE2
FE3
CE(sat)
voltage Base to emitter voltage V Gain bandwidth product f
BE(sat)
T
Collector output capacitance Cob — — 10 pF VCB = 10 V, IE = 0, f = 1 MHz Turn on time t
Turn off time t Storage time t
on
off
stg
Note: 1. The 2SC1472(K) is grouped by hFE as follows.
AB
h
FE1
FE2
FE3
2000 to 100000 5000 to 100000 3000 min 10000 min 3000 min 10000 min
30 — — V IC = 1 mA, RBE = ∞
— — 100 nA V — — 100 nA V
1
*
2000 — 100000 IC = 10 mA, VCE = 5 V
1
*
3000 — — IC = 100 mA, VCE = 5 V
= 30 V, IE = 0
CB
= 10 V, IC = 0
EB
(Pulse Test)
1
*
3000 — — IC = 400 mA, VCE = 5 V
(Pulse Test)
— — 1.5 V IC = 100 mA, IB = 0.1 mA
— — 2.0 V IC = 100 mA, IB = 0.1 mA 50 — — MHz VCE = 5 V, IC = 10 mA
— 60 — ns VCC = 11 V
I
= 100 IB1 = 100 mA
C
I
= –I
B2
B1
— 800 — ns — 350 — ns
P.G. tr, tf ≤ 15 ns PW ≥ 10 µs duty ratio ≤ 10%
Switching Time Test Circuit
D.U.T.
6 k
6 k
0.002
50
0.002
+–
+–
50
50
–6 V
100
11 V
Unit R : Ω
CRT
C : µF
13 V Input
0
Output
0
Response Waveform
10%
90%
10%
t
d
t
on
90%
t
stg
t
off
90%
10%
Page 4
2SC1472 (K)
Maximum Collector Dissipation Curve
600
(mW)
C
400
200
Collector Power Dissipation P
0
Ambient Temperature Ta (°C)
Typical Output Characteristics
200
5.0
4.5
160
(mA)
C
120
80
4.0
3.5
3.0
2.5
2.0
40
Collector Current I
1.5
1.0
0.5 µA
0
Collector to Emitter Voltage V
P
= 500 mW
C
CE
Pulse
IB = 0
(V)
Typical Output Characteristics
500
400
(mA)
C
300
30
25
35
20
18
16
14
12
10
8
6
200
4
100
Collector Current I
2 µA
P
= 500 mW
C
IB = 0
15050 100
0
Collector to Emitter Voltage V
CE
102.0 6.04.0 8.0
(V)
Collector Cutoff Current vs.
Collector to Emitter Voltage
10,000
(nA)
CEO
1,000
100
RBE = ∞
75
100
10
50
1.0 TC = 25°C
0.1
Collector Cutoff Current I
0.01
5010 3020 40
010 3020
Collector to Emitter Voltage VCE (V)
Page 5
2SC1472 (K)
DC Current Transfer Ratio vs.
Collector Current
80
)
3
(×10
VCE = 5 V
70
Pulse
FE
60 50 40 30 20 10
DC Current Transfer Ratio h
0
Ta = 100°C
75
50
25
–25
0
–50
2.0 Collector Current I
(mA)
C
Collector to Emitter Saturation
Voltage vs. Base Current
2.4
2.0
1.6
(V)
CE (sat)
V
1.2
0.8
20 50
100 200
IC = 500 mA
0.4
Collector to Emitter Saturation Voltage
0
1 10030 3003 10 1,000
Base Current IB (µA)
5001005.0 502010 200
Ta = 25°C Pulse
Collector to Emitter Saturation
Voltage vs. Collector Current
1.1
(V)
CE (sat)
V
1.0
0.9
0.8
0.7
0.6
IC = 1,000 I
B
Ta = –50°C
–25
0
25 50
75
100
0.5
0.4
Collector to Emitter Saturation Voltage
0.3 12
Collector Current I
Base to Emitter Saturation
Voltage vs. Collector Current
2.0
–25
25
100
Pulse
0
50 75
(V)
BE (sat)
V
1.8
1.6
1.4
1.2
1.0
IC = 1,000 I
B
Ta = –50°C
0.8
0.6
Base to Emitter Saturation Voltage
0.4 1 10020 2002105 50 500
Collector Current IC (mA)
(mA)
C
Pulse
5001005502010 200
Page 6
2SC1472 (K)
Input and Output Capacitance vs. Voltage
10
(pF)
ob
8
(pF)
ib
f = 1 MHz
Switching Time vs. Collector Current
30
IC = 100 IB1 = –100 I
10
VCC = 10.5 V
B2
6
Cib(IC = 0)
4
2
Collector Output Capacitance C
Emitter Input Capacitance C
0
0.1 3031.0 100.3 Collector to Base Voltage VCB (V) Emitter to Base Voltage V
Switching Time Test Circuit
P.G.
50
tr, tf ≤ 15 ns PW ≥ 10 µs duty ratio ≤ 10%
–6 V
D.U.T.
0.002 +–
50
0.002
50
Cob(IE = 0)
EB
+–
(V)
Unit R : Ω
10.5 V
CRT
C : µF
Switching Time t (µs)
13 V
Input
0
Output
0
3
1.0
0.3
0.1
t
off
t
stg
t
on
t
d
0.03
0.3 3010 1001.0 3 300 Base Current IC (mA)
Response Waveform
90%
10%
90%
10%
t
d
t
on
t
stg
90%
10%
t
off
Page 7
Unit: mm
0.60 Max
0.5 ± 0.1
4.8 ± 0.3
1.27
2.54
0.7
5.0 ± 0.2
2.3 Max
12.7 Min
3.8 ± 0.3
0.5
Hitachi Code JEDEC EIAJ Weight
(reference value)
TO-92 (1) Conforms Conforms
0.25 g
Page 8
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223
Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533
Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Loading...