Designed to enable the engineer to “program’’ unijunction
characteristics such as RBB, η, IV, and IP by merely selecting two
resistor values. Application includes thyristor–trigger, oscillator , pulse
and timing circuits. These devices may also be used in special thyristor
applications due to the availability of an anode gate. Supplied in an
inexpensive TO–92 plastic package for high–volume requirements,
this package is readily adaptable for use in automatic insertion
equipment.
• Programmable — R
• Low On–State Voltage — 1.5 Volts Maximum @ I
• Low Gate to Anode Leakage Current — 10 nA Maximum
• High Peak Output Voltage — 11 Volts Typical
• Low Offset Voltage — 0.35 Volt Typical (R
• Device Marking: Logo, Device T ype, e.g., 2N6027, Date Code
, η, IV and I
BB
P
= 50 mA
F
= 10 k ohms)
G
http://onsemi.com
PUTs
40 VOLTS
300 mW
G
A
K
MAXIMUM RATINGS (T
RatingSymbolValueUnit
*Power Dissipation
Derate Above 25°C
*DC Forward Anode Current
Derate Above 25°C
*DC Gate CurrentI
Repetitive Peak Forward Current
µs Pulse Width, 1% Duty Cycle
100
µs Pulse Width, 1% Duty Cycle
*20
Non–Repetitive Peak Forward Current
µs Pulse Width
10
*Gate to Cathode Forward VoltageV
*Gate to Cathode Reverse VoltageV
*Gate to Anode Reverse VoltageV
*Anode to Cathode Voltage
Operating Junction Temperature RangeT
Programmable Unijunction
with “Program” Resistors
R1 and R2
+V
A
G
K
100k
1.0%
2N5270
20
B
R2
– VS =
R1
–
IP (SENSE)
100 µV = 1.0 nA
+
0.01 µF
Put
Under
Test
I
R1
R1 + R2
A
+
V
B
V
AK
1B –
Equivalent Test Circuit for
Figure 1A used for electrical
characteristics testing
(also see Figure 2)
R
RG =
G
Figure 1. Electrical Characterization
510k
R
RG = R/2
VS = V
B/2
(See Figure 1)
R
C
C
R1 R2
R1 + R2
V
S
+V
20 Ω
V
A
–V
P
V
S
V
F
V
V
I
GAO
B
16k
27k
v
o
0.6 V
VT = VP – V
I
P
IC – Electrical Characteristics
+V
V
o
6 V
t
S
I
V
f
I
I
A
F
t
Figure 2. Peak Current (IP) Test CircuitFigure 3. Vo and tr Test Circuit
http://onsemi.com
3
Page 4
2N6027, 2N6028
TYPICAL V ALLEY CURRENT BEHAVIOR
µ
V
I , VALLEY CURRENT ( A)
1000
100
10
10
5.0
2.0
1.0
0.5
500
RG = 10 kΩ
100 kΩ
1 MΩ
1051520
VS, SUPPLY VOLTAGE (VOLTS)TA, AMBIENT TEMPERATURE (°C)
µ
100
V
I , VALLEY CURRENT ( A)
10
5
–25+25+75
0–50+50+100
RG = 10 kΩ
Figure 4. Effect of Supply VoltageFigure 5. Effect of Temperature
25
TA = 25°C
TA = 25°C
(SEE FIGURE 3)
20
15
100 kΩ
1 MΩ
CC = 0.2 µF
F
V , PEAK FORWARD VOLTAGE (VOLTS)
0.2
0.1
0.05
0.02
0.01
10
5.0
o
V , PEAK OUTPUT VOLTAGE (VOLTS)
0
0.020.010.050.1
IF, PEAK FORWARD CURRENT (AMP)VS, SUPPLY VOLTAGE (VOLTS)
0.22.00.51.05.03540
5.01525
1002030
Figure 6. Forward VoltageFigure 7. Peak Output Voltage
B2
R
R
2
R
B1
η =
1
RBB = R1 + R2
R1
R1 + R2
G
T
G
A
C
C
K
Typical Application
A
K
Circuit Symbol
A
E
G
P
N
P
N
K
Equivalent Circuit
with External “Program”
Resistors R1 and R2
1000 pF
+
R
2
R
1
Figure 8. Programmable Unijunction
http://onsemi.com
4
Page 5
2N6027, 2N6028
TYPICAL PEAK CURRENT BEHAVIOR
2N6027
10
5.0
µ
3.0
2.0
1.0
RG = 10 kΩ
0.5
P
I , PEAK CURRENT ( A)
0.3
0.2
0.1
100 kΩ
1.0 MΩ
105.01520
VS, SUPPLY VOLTAGE (VOLTS)TA, AMBIENT TEMPERATURE (°C)
(SEE FIGURE 2)
Figure 9. Effect of Supply Voltage and R
1.0
0.7
0.5
µ
0.3
0.2
0.1
0.07
0.05
P
I , PEAK CURRENT ( A)
0.03
0.02
0.01
RG = 10 kΩ
100 kΩ
1.0 MΩ
(SEE FIGURE 2)
105.01520
TA = 25°C
TA = 25°C
G
2N6028
µ
I , PEAK CURRENT ( A)
100
µ
P
I , PEAK CURRENT ( A)
P
0.05
0.02
0.01
50
20
10
5.0
2.0
1.0
0.5
0.2
0.1
10
5.0
2.0
1.0
0.5
0.2
0.1
VS = 10 VOLTS
(SEE FIGURE 2)
RG = 10 kΩ
100 kΩ
1.0 MΩ
–25+25+75
0–50+50+100
Figure 10. Effect of T emperature and R
VS = 10 VOLTS
(SEE FIGURE 2)
RG = 10 kΩ
100 kΩ
1.0 MΩ
–25+25+75
0–50+50+100
G
VS, SUPPLY VOLTAGE (VOLTS)TA, AMBIENT TEMPERATURE (°C)
Figure 11. Effect of Supply Voltage and R
http://onsemi.com
G
5
Figure 12. Effect of T emperature and R
G
Page 6
2N6027, 2N6028
TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2AH2A
H
W2
H4
H5
L1
H1
W1
W
F1
F2
P2P2
P1
P
L
D
H2BH2B
T1
T
T2
Figure 13. Device Positioning on T ape
Specification
InchesMillimeter
SymbolItem
D
D2
F1, F2
H
H1
H2A
H2B
H4
H5
L
L1
P
P1
P2
T
T1
T2
W
W1
W2
Tape Feedhole Diameter
Component Lead Thickness Dimension
Component Lead Pitch
Bottom of Component to Seating Plane
Feedhole Location
Deflection Left or Right
Deflection Front or Rear
Feedhole to Bottom of Component
Feedhole to Seating Plane
Defective Unit Clipped Dimension
Lead Wire Enclosure
Feedhole Pitch
Feedhole Center to Center Lead
First Lead Spacing Dimension
Adhesive Tape Thickness
Overall Taped Package Thickness
Carrier Strip Thickness
Carrier Strip Width
Adhesive Tape Width
Adhesive Tape Position
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
Bulk in Box (5K/Box)
Radial Tape and Reel (2K/Reel)
Radial Tape and Reel (2K/Reel)
Radial Tape and Fan Fold Box (2K/Box)
Radial Tape and Fan Fold Box (2K/Box)
P ACKAGE DIMENSIONS
TO–92 (TO–226AA)
CASE 029–1 1
ISSUE AJ
N/A, Bulk
Round side of TO92 and adhesive tape visible
Flat side of TO92 and adhesive tape visible
Flat side of TO92 and adhesive tape visible
Round side of TO92 and adhesive tape visible
SEATING
PLANE
A
B
R
P
L
K
XX
1
G
H
V
C
N
D
J
SECTION X–X
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
J0.015 0.0200.390.50
K0.500––– 12.70–––
L0.250–––6.35–––
N 0.080 0.1052.042.66
P––– 0.100–––2.54
R0.115–––2.93–––
V 0.135–––3.43–––
STYLE 16:
PIN 1. ANODE
2. GATE
3. CATHODE
MILLIMETERSINCHES
http://onsemi.com
7
Page 8
2N6027, 2N6028
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability ,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer .
PUBLICATION ORDERING INFORMATION
NORTH AMERICA Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867Toll Free USA/Canada
Email: ONlit@hibbertco.com
Fax Response Line: 303–675–2167 or 800–344–3810 T oll Free USA/Canada
N. American Technical Support: 800–282–9855 Toll Free USA/Canada
EUROPE: LDC for ON Semiconductor – European Support
German Phone: (+1) 303–308–7140 (M–F 1:00pm to 5:00pm Munich Time)
Email: ONlit–german@hibbertco.com
French Phone: (+1) 303–308–7141 (M–F 1:00pm to 5:00pm Toulouse T ime)
Email: ONlit–french@hibbertco.com
English Phone: (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time)
Email: ONlit@hibbertco.com
EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781
*Available from Germany, France, Italy, England, Ireland
CENTRAL/SOUTH AMERICA:
Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)
Email: ONlit–spanish@hibbertco.com
ASIA/PACIFIC : LDC for ON Semiconductor – Asia Support
Phone: 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)
T oll Free from Hong Kong & Singapore:
001–800–4422–3781
Email: ONlit–asia@hibbertco.com
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, T okyo, Japan 141–8549
Phone: 81–3–5740–2745
Email: r14525@onsemi.com
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
http://onsemi.com
8
2N6027/D
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.