Datasheet 2n5638_2n5639 Datasheet

2N5638, 2N5639

s

2N5638 is a Preferred Device

JFET Chopper Transistors

N−Channel − Depletion

N−Channel Junction Field Effect Transistors, depletion mode

(Type A) designed for chopper and high−speed switching applications.

Features

• Low Drain−Source “ON” Resistance: RDS(on) = 30W for 2N5638

RDS(on) = 60W for 2N5639

• Low Reverse Transfer Capacitance −

= 4.0 pF (Max) @ f = 1.0 MHz

C

rss

• Fast Switching Characteristics − t

= 5.0 ns (Max) (2N5638)

r

• Pb−Free Packages are Available*

MAXIMUM RATINGS

Rating Symbol Value Unit

Drain−Source Voltage V
Drain−Gate Voltage V
Reverse Gate−Source Voltage V
Forward Gate Current I
Total Device Dissipation

Storage Temperature Range T
Operating Junction Temp Range T

Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.

@ TA = 25°C
Derate above 25°C

V

DD

R

+

L

I

D

(

*

R

DS(on)

) 50

)

DS
DG

GSR

GF

P

D

stg

J

50

30 Vdc
30 Vdc
30 Vdc
10 mAdc

310

2.82

−65 to +150 °C

−65 to +135 °C

VDD = 10 Vdc

0.1 mF

mW

mW/°C

http://onsemi.com

1 DRAIN

3

GATE

2 SOURCE

TO−92
CASE 29
STYLE 5

1

2

3

x = 8 or 9

A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package

(Note: Microdot may be in either location)

MARKING
DIAGRAM

2N

563x

AYWWG

G

TO

50 W

SCOPE B

TO

50 W

SCOPE A

INPUT
(SCOPE A)

10%

t

d(off)

OUTPUT
(SCOPE B)

90%

t

10%

d(on)

t

90%

PULSE

GENERATOR

V

GS(on)

V

GS(off)

f

1.0 k

t

r

50

50

R

L

+−

0.001 mF

50 W

SCOPE

TEKTRONIX 567A

OR EQUIVALENT

Figure 1. Switching Times Test Circuit

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.

© Semiconductor Components Industries, LLC, 2006

March, 2006 − Rev. 4

1 Publication Order Number:

ORDERING INFORMATION

Device Package Shipping

2N5638RLRA TO−92
2N5638RLRAG TO−92

2N5639 TO−92 1000 Units/Box
2N5639G TO−92

2N5369RLRA TO−92 2000/Tape & Reel
2N5369RLRAG TO−92

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD801 1/D.

Preferred devices are recommended choices for future use
and best overall value.

(Pb−Free)

(Pb−Free)

(Pb−Free)

2000/Tape & Reel
2000/Tape & Reel

1000 Units/Box

2000/Tape & Reel

†

2N5638/D

2N5638, 2N5639

ELECTRICAL CHARACTERISTICS (T

= 25°C unless otherwise noted)

A

Characteristic

OFF CHARACTERISTICS

Gate−Source Breakdown Voltage

= −1.0 mAdc, VDS = 0)

(I

G

Gate Reverse Current

(VGS = −15 Vdc, VDS = 0)
(V

= −15 Vdc, VDS = 0, TA = 100°C)

GS

Drain−Cutoff Current

(V

= 15 Vdc, VGS = −12 Vdc) 2N5638

DS

(VDS = 15 Vdc, VGS = −12 Vdc, TA = 100°C) 2N5638

= 15 Vdc, VGS = −8.0 Vdc) 2N5639

(V

DS

(VDS = 15 Vdc, VGS = −8.0 Vdc, TA = 100°C) 2N5639

ON CHARACTERISTICS

Zero−Gate−Voltage Drain Current (Note 1) 2N5638

= 20 Vdc, VGS = 0) 2N5639

(V

DS

Drain−Source “ON” Voltage

(I

= 12 mAdc, VGS = 0) 2N5638

D

(ID = 6.0 mAdc, VGS = 0) 2N5639

Static Drain−Source “ON” Resistance

(I

= 1.0 mAdc, VGS = 0) 2N5638

D

2N5639

SMALL−SIGNAL CHARACTERISTICS

Static Drain−Source “ON” Resistance

= 0, ID = 0, f = 1.0 kHz) 2N5638

(V

GS

2N5639

Input Capacitance

(V

= 0, VGS = −12 Vdc, f = 1.0 MHz)

DS

Reverse Transfer Capacitance
(V

= 0, VGS = −12 Vdc, f = 1.0 MHz)

DS

SWITCHING CHARACTERISTICS (VDD = 10 Vdc, V

Turn−On Delay Time I

Rise Time I

Turn−Off Delay Time I

Fall Time I

GS(on)

I

I

I

I

= 0, V

GS(off)

= 12 mAdc, 2N5638

D(on)

= 6.0 mAdc, 2N5639

D(on)

= 12 mAdc, 2N5638

D(on)

= 6.0 mAdc, 2N5639

D(on)

= 12 mAdc, 2N5638

D(on)

= 6.0 mAdc, 2N5639

D(on)

= 12 mAdc, 2N5638

D(on)

= 6.0 mAdc, 2N5639

D(on)

= −10 Vdc, RG’ = 50 W. See Figure 1 on page 1)

1. Pulse Width ≤ 300 ms, Duty Cycle ≤ 3.0%.

Symbol Min Max Unit

V

(BR)GSS

I

GSS

I

D(off)

35 − Vdc

−  1.0

1.0

−

nAdc

mAdc

mAdc

1.0

1.0

1.0

1.0

I

DSS

V

DS(on)

R

DS(on)

R

DS(on)

C

C

t

d(on)

t

d(off)

iss

rss

t

r

t

f

50
25

−

−

−

−

−

−

0.5

0.5

30
60

30
60

−

mAdc

−

− 10 pF

− 4.0 pF

−

−

−

−

−

−

−

−

4.0

6.0

5.0

8.0

5.0
10

10
20

Vdc

ns

ns

ns

ns

W

W

http://onsemi.com

2

2N5638, 2N5639

PACKAGE DIMENSIONS

TO−92 (TO−226)

CASE 29−11

ISSUE AL

SEATING
PLANE

A

B

R

P

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.

L

MILLIMETERSINCHES

XX

V

1

K

D

G

H

J

C

SECTION X−X

N

N

DIM MIN MAX MIN MAX

A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
D 0.016 0.021 0.407 0.533
G 0.045 0.055 1.15 1.39
H 0.095 0.105 2.42 2.66
J 0.015 0.020 0.39 0.50
K 0.500 −−− 12.70 −−−
L 0.250 −−− 6.35 −−−
N 0.080 0.105 2.04 2.66
P −−− 0.100 −−− 2.54
R 0.115 −−− 2.93 −−−
V 0.135 −−− 3.43 −−−

STYLE 5:

PIN 1. DRAIN

2. SOURCE

3. GATE

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2N5638/D

3