Datasheet 2n5457_2n5458 Datasheet

Page 1
2N5457, 2N5458
JFETs - General Purpose
N−Channel − Depletion
N−Channel Junction Field Effect Transistors, depletion mode
Features
• N−Channel for Higher Gain
• Drain and Source Interchangeable
• High AC Input Impedance
• High DC Input Resistance
• Low Transfer and Input Capacitance
• Low Cross−Modulation and Intermodulation Distortion
• Plastic Encapsulated Package
• Pb−Free Packages are Available*
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1 DRAIN
3
GATE
2 SOURCE
MARKING DIAGRAM
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain−Source Voltage V
Drain−Gate Voltage V
Reverse Gate −Source Voltage V
Gate Current I
Total Device Dissipation @ TA = 25°C Derate above 25°C
Operating Junction Temperature T
Storage Temperature Range T
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
DS
DG
GSR
G
P
D
J
stg
25 Vdc
25 Vdc
−25 Vdc
10 mAdc
310
2.82
135 °C
−65 to +150 °C
mW
mW/°C
2N
545x
AYWWG
1
2
3
STRAIGHT LEAD
BULK PACK
2N545x = Device Code
A = Assembly Location Y = Year WW = Work Week G =Pb−Free Package
(Note: Microdot may be in either location)
1
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
x = 7 or 8
G
TO−92 CASE 29 STYLE 5
ORDERING INFORMATION
Device Package Shipping
2N5457 TO−92 1000 Units/Box
2N5457G TO−92
(Pb−Free)
2N5458 TO−92 1000 Units/Box
1000 Units/Box
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 6
1 Publication Order Number:
2N5458G TO−92
(Pb−Free)
1000 Units/Box
2N5457/D
Page 2
2N5457, 2N5458
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Characteristic
OFF CHARACTERISTICS
Gate−Source Breakdown Voltage
= −10 mAdc, VDS = 0)
(I
G
Gate Reverse Current
(V
= −15 Vdc, VDS = 0)
GS
(V
= −15 Vdc, VDS = 0, TA = 100°C)
GS
Gate−Source Cutoff Voltage 2N5457
(V
= 15 Vdc, iD = 10 nAdc) 2N5458
DS
Gate−Source Voltage
= 15 Vdc, iD = 100 mAdc) 2N5457
(V
DS
= 15 Vdc, iD = 200 mAdc) 2N5458
(V
DS
ON CHARACTERISTICS
Zero−Gate−Voltage Drain Current (Note 1) 2N5457
(VDS = 15 Vdc, VGS = 0) 2N5458
DYNAMIC CHARACTERISTICS
Forward Transfer Admittance (Note 1) 2N5457
(VDS = 15 Vdc, VGS = 0, f = 1 kHz) 2N5458
Output Admittance Common Source (Note 1)
(V
= 15 Vdc, VGS = 0, f = 1 kHz)
DS
Input Capacitance
(V
= 15 Vdc, VGS = 0, f = 1 kHz)
DS
Reverse Transfer Capacitance
(V
= 15 Vdc, VGS = 0, f = 1 kHz)
DS
1. Pulse Width ≤ 630 ms, Duty Cycle ≤ 10%.
Symbol Min Typ Max Unit
V
(BR)GSS
I
GSS
V
GS(off)
V
GS
I
DSS
|Yfs| 1000
−25 − − Vdc
−
−
−0.5
−1.0
−
−
1.0
2.0
1500
−
−
−
−
−2.5
−3.5
3.0
6.0
3000 4000
-1.0
−200
−6.0
−7.0
−
−
5.0
9.0
5000 5500
nAdc
Vdc
Vdc
mAdc
mmhos
|Yos|
− 10 50
C
iss
C
rss
− 4.5 7.0 pF
− 1.5 3.0 pF
mmhos
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2
Page 3
TYPICAL CHARACTERISTICS
14
12
10
8
6
NF, NOISE FIGURE (dB)
4
2
2N5457, 2N5458
For 2N5457 Only
VDS = 15 V V
= 0
GS
f = 1 kHz
0
Figure 1. Noise Figure versus Source Resistance
1.2
1.0
0.8
0.6
0.4
, DRAIN CURRENT (mA)
D
I
0.2
0
0 5 10 15 20
V
^ -1.2 V
GS(off)
VDS, DRAIN-SOURCE VOLTAGE (VOLTS)
Figure 2. Typical Drain Characteristics
0.001 0.01 0.1 1.0 RS, SOURCE RESISTANCE (Megohms)
1.2
1.0
0.8
0.6
0.4
, DRAIN CURRENT (mA)
D
I
0.2
0
-1.2
V
GS(off)
VGS = 0 V
-0.2 V
-0.4 V
-0.6 V
-0.8 V
-1.0 V
25
Figure 3. Common Source Transfer Characteristics
10
^ -1.2 V
VDS = 15 V
-0.8 -0.4 0
VGS, GATE-SOURCE VOLTAGE (VOLTS)
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3
Page 4
2N5457, 2N5458
TYPICAL CHARACTERISTICS
For 2N5457 Only
, DRAIN CURRENT (mA)
D
I, DRAIN CURRENT (mA)
5
4
V
^ -3.5 V
GS(off)
3
2
1
0
0
510152025
VDS, DRAIN-SOURCE VOLTAGE (VOLTS)
Figure 4. Typical Drain Characteristics
10
8
6
4
V
GS(off)
^ -5.8 V
VGS = 0 V
-1 V
-2 V
-3 V
VGS = 0 V
-1 V
-2 V
, DRAIN CURRENT (mA)
D
I
5
V
^ -3.5 V
GS(off)
4
3
VDS = 15 V
2
1
0
-5
-4 VGS, GATE-SOURCE VOLTAGE (VOLTS)
-3 -2 -1 0
Figure 5. Common Source Transfer
Characteristics
10
8
6
4
V
GS(off)
^ -5.8 V
VDS = 15 V
D
I
2
0
0 5 10 15 20 25
VDS, DRAIN-SOURCE VOLTAGE (VOLTS)
Figure 6. Typical Drain Characteristics
NOTE: Note: Graphical data is presented for dc conditions. Tabular data is given
for pulsed conditions (Pulse Width = 630 ms, Duty Cycle = 10%). Under dc conditions, self heating in higher I
-3 V
-4 V
-5 V
, DRAIN CURRENT (mA)
D
I
2
0
-7
units reduces I
DSS
-6 -5 -4 -3 -2 -1 VGS, GATE -  SOURCE VOLTAGE (VOLTS)
Figure 7. Common Source Transfer
Characteristics
.
DSS
0
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4
Page 5
2N5457, 2N5458
PACKAGE DIMENSIONS
TO−92 (TO−226)
CASE 29−11
ISSUE AM
SEATING PLANE
R
T
SEATING PLANE
A
B
STRAIGHT LEAD
BULK PACK
R
P
L
K
XX
V
1
G
H
C
N
D
J
SECTION X−X
N
A
B
BENT LEAD
TAPE & REEL
AMMO PACK
P
K
XX
G
D
J
V
1
C
SECTION X−X
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 K 0.500 --- 12.70 --- L 0.250 --- 6.35 --- N 0.080 0.105 2.04 2.66 P --- 0.100 --- 2.54 R 0.115 --- 2.93 --- V 0.135 --- 3.43 ---
TYLE 5:
PIN 1. DRAIN
2. SOURCE
3. GATE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
MILLIMETERS
DIM MIN MAX
A 4.45 5.20 B 4.32 5.33 C 3.18 4.19 D 0.40 0.54 G 2.40 2.80
J 0.39 0.50 K 12.70 --- N 2.04 2.66
P 1.50 4.00 R 2.93 ---
V 3.43 ---
MILLIMETERSINCHES
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2N5457/D
5
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