Datasheet 2N4920G, 2N4922G Specification

Page 1
2N4918 - 2N4920 Series
Medium-Power Plastic PNP Silicon Transistors
These mediumpower, highperformance plastic devices are
Features
Low Saturation Voltage V
Excellent Power Dissipation, P
= 0.6 Vdc (Max) @ IC = 1.0 A
CE(sat)
= 30 W @ TC = 25_C
D
Excellent Safe Operating Area
Gain Specified to I
= 1.0 A
C
Complement to NPN 2N4921, 2N4922, 2N4923
PbFree Package is Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector Emitter Voltage
Collector Base Voltage
Emitter Base Voltage V
Collector Current Continuous
(Note 1)
Base Current I
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. The 1.0 A max I
3.0 A max value is based upon actual current−handling capability of the device (See Figure 5).
2. Indicates JEDEC Registered Data for 2N4918 Series.
value is based upon JEDEC current gain requirements. The
C
2N4918 2N4919 2N4920
2N4918 2N4919 2N4920
THERMAL CHARACTERISTICS (Note 3)
Characteristic
Thermal Resistance,
JunctiontoCase
3. Recommend use of thermal compound for lowest thermal resistance.
V
CEO
V
CBO
EBO
I
C
(Note 2)
B
P
D
TJ, T
stg
Symbol Max Unit
q
JC
40 60 80
40 60 80
5.0 Vdc
1.0
3.0
1.0 Adc
30
0.24
65 to +150 °C
4.16 °C/W
Vdc
Vdc
Adc
W/°C
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3.0 A, 4080 V, 30 W
GENERAL PURPOSE
POWER TRANSISTORS
4
1
2
3
FRONT VIEW BACK VIEW
MARKING DIAGRAM
W
xx = 18, 19, 20 Y = Year WW = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of this data sheet.
3
2
TO225
CASE 077
STYLE 1
YWW 2N 49xx
1
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2004
January, 2017 − Rev. 12
1 Publication Order Number:
2N4918/D
Page 2
2N4918 2N4920 Series
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ELECTRICAL CHARACTERISTICS (T
= 25_C unless otherwise noted)
C
Characteristic
OFF CHARACTERISTICS
CollectorEmitter Sustaining Voltage (Note 4)
= 0.1 Adc, IB = 0) 2N4918
(I
C
2N4919 2N4920
Collector Cutoff Current
= 20 Vdc, IB = 0) 2N4918
(V
CE
(V
= 30 Vdc, IB = 0) 2N4919
CE
(V
= 40 Vdc, IB = 0) 2N4920
CE
Collector Cutoff Current
(V
CE
(V
CE
= Rated V = Rated V
CEO
CEO
, V
= 1.5 Vdc)
BE(off)
, V
= 1.5 Vdc, TC = 125_C
BE(off)
Collector Cutoff Current
= Rated VCB, IE = 0)
(V
CB
Emitter Cutoff Current
= 5.0 Vdc, IC = 0)
(V
BE
ON CHARACTERISTICS
DC Current Gain (Note 4)
= 50 mAdc, VCE = 1.0 Vdc)
(I
C
(I
= 500 mAdc, VCE = 1.0 Vdc)
C
(I
= 1.0 Adc, VCE = 1.0 Vdc)
C
CollectorEmitter Saturation Voltage (Note 4)
= 1.0 Adc, IB = 0.1 Adc)
(I
C
BaseEmitter Saturation Voltage (Note 4)
= 1.0 Adc, IB = 0.1 Adc)
(I
C
BaseEmitter On Voltage (Note 4)
= 1.0 Adc, VCE = 1.0 Vdc)
(I
C
SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product (IC = 250 mAdc, VCE = 10 Vdc, f = 1.0 MHz)
Output Capacitance (VCB = 10 Vdc, IE = 0, f = 100 kHz)
SmallSignal Current Gain (IC = 250 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
4. Pulse Test: PW [ 300 ms, Duty Cycle [ 2.0%
Symbol
V
CEO(sus)
I
CEO
I
CEX
I
CBO
I
EBO
h
FE
V
CE(sat)
V
BE(sat)
V
BE(on)
f
T
C
ob
h
fe
Min
40 60 80
40 30 10
3.0
25
Max
0.5
0.5
0.5
0.1
0.5
0.1
1.0
150
0.6
1.3
1.3
100
Unit
Vdc
mAdc
mAdc
mAdc
mAdc
Vdc
Vdc
Vdc
MHz
pF
ORDERING INFORMATION
Device Package Shipping
2N4918 TO225 500 Unit / Bulk
2N4919 TO225 500 Unit / Bulk
2N4920 TO225 500 Unit / Bulk
2N4920G TO225
500 Unit / Bulk
(PbFree)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifi-
cations Brochure, BRD8011/D.
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2
Page 3
V
BE(off)
V
in
APPROX
-11 V
APPROX
-11 V
0
t
1
t
2
in
TURN-OFF PULSE
APPROX 9.0 V
0V
t 100 < t t
t
DUTY CYCLE 2.0%
3
< 15 ns
1
< 15 ns
3
2N4918 2N4920 Series
40
30
20
10
, POWER DISSIPATION (WATTS)
D
P
0
25 50 75 100 125 150
TC, CASE TEMPERATURE (°C)
Figure 1. Power Derating
5.0
V
CC
V
Cjd<<C
< 500 ms
2
R
C
in
R
B
eb
SCOPE
+4.0 V
RB and R
C
varied to obtain desired current levels
t, TIME (s)μ
3.0
2.0
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
VCC = 30 V
t
d
VCC = 30 V V
BE(off)
10
= 0
20 30 50 70 100 200 700 1000
V
= 30 V
CC
= 20
I
C/IB
VCC = 60 V
IC/IB = 10, UNLESS NOTED
t
r
V
= 2.0 V
BE(off)
IC, COLLECTOR CURRENT (mA)
TJ = 25°C
= 150°C
T
J
VCC = 60 V
300 500
Figure 2. Switching Time Equivalent Test Circuit
Figure 3. TurnOn Time
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3
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1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
(NORMALIZED)
0.03
0.02
r(t), TRANSIENT THERMAL RESISTANCE
0.01
0.01
D = 0.5
0.2
0.1
0.05
0.01
SINGLE PULSE
0.02 0.03
2N4918 2N4920 Series
P
qJC(t) = r(t) q qJC = 4.16°C/W MAX
D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t T
J(pk)
0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 300 1000500 t, TIME (ms)
- TC = P
JC
1
(pk) qJC
(t)
Figure 4. Thermal Response
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
2
10
dc
= 25°C
C
1.0 ms
5.0
2.0
1.0
0.5
, COLLECTOR CURRENT (AMP)
C
I
0.2
0.1
1.0
TJ = 150°C
SECOND BREAKDOWN LIMITED BONDING WIRE LIMITED THERMALLY LIMIT @ T
PULSE CURVES APPLY BELOW
RATED V
2.0 3.0 5.0 10 20 30 50 10070 VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
5.0 ms
CEO
7.0
Figure 5. Active−Region Safe Operating Area
5.0
100
IC/IB = 20
200 300
3.0
2.0
1.0
0.7
0.5
0.3
, STORAGE TIME (s)
0.2
s
t μ
0.1
0.07
0.05 10
IC/IB = 10
ts′ = ts - 1/8 t
20 30 50 70 500 700 1000
f
IC, COLLECTOR CURRENT (mA)
TJ = 25°C
= 150°C
T
J
IB1 = I
B2
100 ms
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I
V
C
CE
operation i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
The data of Figure 5 is based on T
= 150_C; TC is
J(pk)
variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T
J(pk)
v 150_C. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown.
5.0
3.0
2.0
1.0
0.7
0.5
0.3
, FALL TIME (s)
f
t μ
0.2
0.1
0.07
0.05 10
IC/IB = 20
IC/IB = 10
20 30 50 70 500 700 1000
IC, COLLECTOR CURRENT (mA)
100
200 300
TJ = 25°C
= 150°C
T
J
VCC = 30 V
= I
I
B1
B2
Figure 6. Storage Time
Figure 7. Fall Time
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4
Page 5
2N4918 2N4920 Series
TYPICAL DC CHARACTERISTICS
1000
700 500
300
TJ = 150°C
200
100
, DC CURRENT GAIN
FE
h
70 50
30
25°C
-55°C
20
10
2.0
3.0 5.0 10 20 30 200 300 500 2000
50 100 1000 3.0 30 100
IC, COLLECTOR CURRENT (mA)
Figure 8. Current Gain
8
10
IC = 10 I
7
10
6
10
5
10
4
10
IC I
CES
I
VALUES
CES
OBTAINED FROM
CES
IC = 2x I
FIGURE 13
, EXTERNAL BASE-EMITTER RESISTANCE (OHMS)
3
10
BE
0
R
30 60 90 120 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 10. Effects of Base−Emitter Resistance
VCE = 1.0 V
VCE = 30 V
CES
1.0
IC = 0.1 A
0.25 A 0.5 A 1.0 A
0.8
0.6
TJ = 25°C
0.4
0.2
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
V
0
0.2
0.3 0.5 1.0 2.0 5.0 10 20 50 200
IB, BASE CURRENT (mA)
Figure 9. Collector Saturation Region
1.5
1.2 TJ = 25°C
0.9
V
@ IC/IB = 10
BE(sat)
0.6
VOLTAGE (VOLTS)
VBE @ VCE = 2.0 V
0.3
V
@ IC/IB = 10
CE(sat)
0
5.0 10 20 30 50 100 200 300 2000
2.0
3.0 500 1000
, COLLECTOR CURRENT (mA)
I
C
Figure 11. “On” Voltage
2
10
1
10
TJ = 150°C
0
10
-1
10
100°C
-2
10
, COLLECTOR CURRENT (A)μI
4
C
10
IC = I
CES
VCE = 30 V
25°C
REVERSE
3
10
-0.2
-0.1 0 +0.1 +0.2 +0.3 +0.4 +0.5
FORWARD
VBE, BASE-EMITTER VOLTAGE (VOLTS)
Figure 12. Collector Cut−Off Region
+2.5
h
@V
FE
+2.0
+1.5
+1.0
+0.5
*APPLIES FOR I
0
*qVC FOR V
CE(sat)
C/IB
<
CE
2
TJ = 100°C to 150°C
TJ = -55°C to +100°C
-0.5
-1.0
-1.5
-2.0
TEMPERATURE COEFFICIENTS (mV/ C)°
-2.5
2.0
3.0 5.0 10 20 30 50 100 200 2000
qVB FOR V
BE
300 500 1000
IC, COLLECTOR CURRENT (mA)
Figure 13. Temperature Coefficients
+1.0V
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Page 6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
4
TO225
CASE 7709
ISSUE AD
DATE 25 MAR 2015
1
2
3
3
2
1
FRONT VIEW BACK VIEW
SCALE 1:1
Q
P
2X
b2
e
2X
E
A1
D
123
L1
b
c
FRONT VIEW SIDE VIEW
A
PIN 4
BACKSIDE TAB
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. NUMBER AND SHAPE OF LUGS OPTIONAL.
MILLIMETERS
DIM MIN MAX
A 2.40 3.00
A1 1.00 1.50
b 0.60 0.90
b2 0.51 0.88
c 0.39 0.63 D 10.60 11.10 E 7.40 7.80 e 2.04 2.54 L 14.50 16.63
L1 1.27 2.54
P 2.90 3.30 Q 3.80 4.20
GENERIC
MARKING DIAGRAM*
YWW XX XXXXXG
Y = Year WW = Work Week XXXXX = Device Code G = PbFree Package
*This information is generic. Please refer to
device data sheet for actual part marking. PbFree indicator, “G” or microdot “ G”, may or may not be present.
STYLE 1:
PIN 1. EMITTER
2., 4. COLLECTOR
3. BASE
STYLE 6:
PIN 1. CATHODE
2., 4. GATE
3. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
STYLE 2:
PIN 1. CATHODE
2., 4. ANODE
3. GATE
STYLE 7:
PIN 1. MT 1
2., 4. GATE
3. MT 2
98ASB42049B
TO225
STYLE 3:
PIN 1. BASE
2., 4. COLLECTOR
3. EMITTER
STYLE 8:
PIN 1. SOURCE
2., 4. GATE
3. DRAIN
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
STYLE 4:
PIN 1. ANODE 1
2., 4. ANODE 2
3. GATE
STYLE 9:
PIN 1. GATE
2., 4. DRAIN
3. SOURCE
STYLE 5:
PIN 1. MT 1
2., 4. MT 2
3. GATE
STYLE 10:
PIN 1. SOURCE
2., 4. DRAIN
3. GATE
PAGE 1 OF 1
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