D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
T
J(pk)
0.050.10.2 0.30.51.02.0 3.05.01020 3050100200 3001000500
t, TIME (ms)
- TC = P
JC
1
(pk) θJC
(t)
Figure 4. Thermal Response
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
2
10
dc
= 25°C
C
1.0 ms
5.0
T
2.0
1.0
0.5
, COLLECTOR CURRENT (AMP)
C
I
0.2
0.1
1.0
= 150°C
J
SECOND BREAKDOWN LIMITED
BONDING WIRE LIMITED
THERMALLY LIMIT @ T
PULSE CURVES APPLY BELOW
RATED V
2.0 3.05.01020305010070
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
5.0 ms
CEO
7.0
Figure 5. Active–Region Safe Operating Area
5.0
100
IC/IB = 20
200 300
3.0
2.0
1.0
0.7
0.5
0.3
, STORAGE TIME (s)
0.2
′
s
tµ
0.1
0.07
0.05
10
IC/IB = 10
t
′ = t
- 1/8 t
s
s
f
20 3050 70500 700 1000
IC, COLLECTOR CURRENT (mA)
T
= 25°C
J
T
= 150°C
J
IB1 = I
100 µs
B2
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC – V
CE
operation i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 5 is based on T
= 150C; TC is
J(pk)
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T
J(pk)
150C. At high case temperatures, thermal limitations
will reduce the power that can be handled to values less than
the limitations imposed by second breakdown.
5.0
3.0
2.0
1.0
0.7
0.5
0.3
, FALL TIME (s)
f
tµ
0.2
0.1
0.07
0.05
10
IC/IB = 20
IC/IB = 10
20 3050 70500 700 1000
IC, COLLECTOR CURRENT (mA)
100
T
T
200 300
= 25°C
J
= 150°C
J
VCC = 30 V
IB1 = I
B2
Figure 6. Storage Time
Figure 7. Fall Time
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4
Page 5
2N4918 thru 2N4920
TYPICAL DC CHARACTERISTICS
1000
700
500
T
= 150°C
300
200
100
70
50
, DC CURRENT GAIN
FE
h
30
20
10
2.0
3.0 5.01020 30200 300 5002000
J
25°C
-55°C
5010010003.030100
IC, COLLECTOR CURRENT (mA)
Figure 8. Current Gain
8
10
IC = 10 I
7
10
6
10
5
10
4
10
, EXTERNAL BASE-EMITTER RESISTANCE (OHMS)
3
10
BE
0
R
I
≈ I
C
CES
I
VALUES
CES
OBTAINED FROM
FIGURE 13
306090120150
T
, JUNCTION TEMPERATURE (°C)
J
CES
IC = 2x I
Figure 10. Effects of Base–Emitter Resistance
VCE = 1.0 V
VCE = 30 V
CES
1.0
IC = 0.1 A
0.8
0.6
T
= 25°C
J
0.4
0.2
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
V
0
0.2
0.3 0.51.02.05.0102050200
0.25 A0.5 A1.0 A
IB, BASE CURRENT (mA)
Figure 9. Collector Saturation Region
1.5
1.2
0.9
0.6
VOLTAGE (VOLTS)
0.3
T
= 25°C
J
V
@ IC/IB = 10
BE(sat)
VBE @ VCE = 2.0 V
V
@ IC/IB = 10
0
2.0
3.0500 1000
CE(sat)
5.01020 30 50100 200 3002000
IC, COLLECTOR CURRENT (mA)
Figure 11. “On” Voltage
2
10
1
10
T
= 150°C
0
10
-1
10
-2
10
, COLLECTOR CURRENT (A)µI
4
C
10
REVERSE
3
10
-0.2
-0.10+0.1+0.2+0.3+0.4+0.5
J
100°C
IC = I
CES
25°C
FORWARD
VBE, BASE-EMITTER VOLTAGE (VOLTS)
VCE = 30 V
Figure 12. Collector Cut–Off Region
+2.5
h
@V
FE
+2.0
+1.5
+1.0
+0.5
0
-0.5
-1.0
-1.5
-2.0
TEMPERATURE COEFFICIENTS (mV/ C)°
-2.5
2.0
3.0 5.01020 30 50100 2002000
*APPLIES FOR IC/IB <
*θ
FOR V
VC
θ
CE(sat)
FOR V
VB
BE
IC, COLLECTOR CURRENT (mA)
CE
2
T
= 100°C to 150°C
J
T
= -55°C to +100°C
J
300 500 1000
Figure 13. Temperature Coefficients
1.0V
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5
Page 6
2N4918 thru 2N4920
PACKAGE DIMENSIONS
TO–225AA
CASE 77–09
ISSUE W
–B–
–A–
K
F
M
U
Q
132
H
V
G
0.25 (0.010)B
S
D
2 PL
M
0.25 (0.010)B
A
M
A
M
STYLE 1:
PIN 1. EMITTER
C
J
R
M
M
M
2. COLLECTOR
3. BASE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MINMAXMIN MAX
A 0.425 0.435 10.80 11.04
B 0.295 0.3057.507.74
C 0.095 0.1052.422.66
D 0.020 0.0260.510.66
F 0.115 0.1302.933.30
G0.094 BSC2.39 BSC
H 0.050 0.0951.272.41
J 0.015 0.0250.390.63
K 0.575 0.655 14.61 16.63
M5 TYP5 TYP
Q 0.148 0.1583.764.01
R 0.045 0.0651.151.65
S 0.025 0.0350.640.88
U 0.145 0.1553.693.93
V 0.040---1.02---
MILLIMETERSINCHES
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6
Page 7
Notes
2N4918 thru 2N4920
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7
Page 8
2N4918 thru 2N4920
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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AN4918/D
8
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