Datasheet 2N4401-D Datasheet (ON Semiconductor)

Page 1
2N4401
Preferred Device
General Purpose Transistors
Features
Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector − Emitter Voltage V Collector − Base Voltage V Emitter − Base V oltage V Collector Current − Continuous I Total Device Dissipation
@ TA = 25°C Derate above 25°C
Total Device Dissipation
@ TC = 25°C Derate above 25°C
Operating and Storage Junction Temperature Range
CEO CBO EBO
P
P
TJ, T
C
D
D
stg
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient R Thermal Resistance, Junction−to−Case R
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
q
JA
q
JC
40 Vdc 60 Vdc
6.0 Vdc
600 mAdc
625
5.0
1.5 12
−55 to +150
200 °C/W
83.3 °C/W
mW
mW/°C
mW/°C
W
°C
TO−92 CASE 29 STYLE 1
http://onsemi.com
COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
STRAIGHT LEAD
BULK PACK
MARKING DIAGRAM
2N
4401
AYWWG
G
1
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 3
1 Publication Order Number:
2N4401 = Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
Preferred devices are recommended choices for future use and best overall value.
2N4401/D
Page 2
2N4401
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Characteristic
OFF CHARACTERISTICS
Collector−Emitter Breakdown V oltage (Note 1) (I
= 1.0 mAdc, IB = 0) V
C
Collector−Base Breakdown V oltage (IC = 0.1 mAdc, IE = 0) V Emitter−Base Breakdown V oltage (IE = 0.1 mAdc, IC = 0) V Base Cutoff Current (VCE = 35 Vdc, V
= 0.4 Vdc) I
EB
Collector Cutoff Current (VCE = 35 Vdc, VEB = 0.4 Vdc) I
ON CHARACTERISTICS (Note 1)
DC Current Gain
(IC = 0.1 mAdc, VCE = 1.0 Vdc) (IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc) (IC = 150 mAdc, VCE = 1.0 Vdc) (IC = 500 mAdc, VCE = 2.0 Vdc)
Collector−Emitter Saturation V oltage (IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)
Base−Emitter Saturation Voltage (IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)
SMALL−SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product (IC = 20 mAdc, VCE = 10 Vdc, f = 100 MHz) f Collector−Base Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz) C Emitter−Base Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) C Input Impedance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) h Voltage Feedback Ratio (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) h Small−Signal Current Gain (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) h Output Admittance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) h
SWITCHING CHARACTERISTICS
Delay Time Rise Time t Storage Time Fall Time t
(VCC = 30 Vdc, VBE = 2.0 Vdc, IC = 150 mAdc, IB1 = 15 mAdc)
(VCC = 30 Vdc, IC = 150 mAdc, IB1 = IB2 = 15 mAdc)
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.
Symbol Min Max Unit
(BR)CEO (BR)CBO (BR)EBO
BEV CEX
h
FE
V
CE(sat)
V
BE(sat)
T cb eb ie re fe
oe
t
d
r
t
s
f
40 Vdc 60 Vdc
6.0 Vdc
0.1 mAdc
0.1 mAdc
− 20 40 80
100
40
0.75
300
0.4
0.75
0.95
1.2
Vdc
Vdc
250 MHz
6.5 pF
30 pF
1.0 15 k W
0.1 8.0 X 10 40 500
1.0 30 mmhos
15 ns
20 ns
225 ns
30 ns
−4
ORDERING INFORMATION
Device Package Shipping
2N4401 TO−92 5000 Units / Bulk 2N4401G TO−92
5000 Units / Bulk
(Pb−Free) 2N4401RLRA TO−92 2000 / Tape & Reel 2N4401RLRAG TO−92
2000 / Tape & Reel
(Pb−Free) 2N4401RLRMG TO−92
2000 / Ammo Pack
(Pb−Free) 2N4401RLRP TO−92 2000 / Ammo Pack 2N4401RLRPG TO−92
2000 / Ammo Pack
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
Page 3
2N4401
TRANSIENT CHARACTERISTICS
SWITCHING TIME EQUIVALENT TEST CIRCUITS
+16 V
0
−2.0 V
30
20
10
7.0
5.0
CAPACITANCE (pF)
3.0
+30 V
1.0 to 100 ms, DUTY CYCLE 2.0%
< 2.0 ns
1.0 kW
200 W
CS* < 10 pF
Scope rise time < 4.0 ns *Total shunt capacitance of test jig connectors, and oscilloscope
+16 V
0
−14 V
1.0 to 100 ms, DUTY CYCLE 2.0%
1.0 kW
< 20 ns
−4.0 V
Figure 1. Turn−On Time Figure 2. Turn−Off Time
25°C 100°C
10
7.0 VCC = 30 V
5.0 IC/IB = 10
C
obo
C
cb
3.0
2.0
1.0
0.7
0.5
Q, CHARGE (nC)
0.3
0.2
+30 V
200 W
C
* < 10 pF
S
Q
T
Q
A
2.0
0.1 2.0 5.0 10 20
REVERSE VOLTAGE (VOLTS)
3.01.00.50.30.2
Figure 3. Capacitances
100
70
50
30
20
t, TIME (ns)
10
7.0
5.0 10 20 50 70 100 200 300 50030
IC, COLLECTOR CURRENT (mA)
tr @ VCC = 30 V tr @ VCC = 10 V td @ VEB = 2.0 V td @ VEB = 0
Figure 5. Turn−On Time
IC/IB = 10
30 50
0.1 10 20 50 70 100 200
30
IC, COLLECTOR CURRENT (mA)
Figure 4. Charge Data
100
70
50
30
20
t, TIME (ns)
10
7.0
5.0 10 20 50 70 100 200 300 50030
t
r
t
f
IC, COLLECTOR CURRENT (mA)
Figure 6. Rise and Fall Times
300 500
VCC = 30 V IC/IB = 10
http://onsemi.com
3
Page 4
2N4401
SMALL−SIGNAL CHARACTERISTICS
300
200
100
70
, STORAGE TIME (ns)
s
t
50
30
10 20 50 70 100 200 300 50030
10
8.0
6.0
IC, COLLECTOR CURRENT (mA)
Figure 7. Storage Time
IC = 1.0 mA, RS = 150 W IC = 500 mA, RS = 200 W IC = 100 mA, RS = 2.0 kW IC = 50 mA, RS = 4.0 kW
100 ts′ = ts − 1/8 t IB1 = I IC/IB = 10 to 20
f
B2
70
50
30
20
, FALL TIME (ns)
f
t
10
7.0
5.0 10 20 50 70 100 200 300 50030
NOISE FIGURE
V
= 10 Vdc, TA = 25°C; Bandwidth = 1.0 Hz
CE
10
f = 1.0 kHz
RS = OPTIMUM
RS = SOURCE RS = RESISTANCE
8.0
6.0
IC/IB = 20
IC/IB = 10
IC, COLLECTOR CURRENT (mA)
Figure 8. Fall Time
IC = 50 mA IC = 100 mA IC = 500 mA IC = 1.0 mA
VCC = 30 V IB1 = I
B2
4.0
NF, NOISE FIGURE (dB)
2.0
0
0.1 2.0 5.0 10 20 501.00.50.20.01 0.02 0.05 100
f, FREQUENCY (kHz)
Figure 9. Frequency Effects
4.0
NF, NOISE FIGURE (dB)
2.0
0
Figure 10. Source Resistance Effects
100k50 100 200 500 1.0k 2.0k 5.0k 10k 20k 50k
RS, SOURCE RESISTANCE (OHMS)
http://onsemi.com
4
Page 5
2N4401
h PARAMETERS
= 10 Vdc, f = 1.0 kHz, TA = 25°C
V
CE
This group of graphs illustrates the relationship between hfe and other “h” parameters for this series of transistors. T o obtain these curves, a high−gain and a low−gain unit were
300
200
100
70
, CURRENT GAIN
50
fe
h
30
20
0.1 0.2 0.5 0.7 1.0 2.0 3.0 100.3
IC, COLLECTOR CURRENT (mA)
Figure 11. Current Gain
2N4401 UNIT 1 2N4401 UNIT 2
5.0 7.0
selected from the 2N4401 lines, and the same units were used to develop the correspondingly numbered curves on each graph.
50k
2N4401 UNIT 1
20k
10k
5.0k
2.0k
, INPUT IMPEDANCE (OHMS)
ie
h
1.0k
500
0.1 0.2 0.5 0.7 1.0 2.0 3.0 100.3 5.0 7.0
IC, COLLECTOR CURRENT (mA)
Figure 12. Input Impedance
2N4401 UNIT 2
10
−4
7.0
5.0
3.0
2.0
1.0
0.7
0.5
0.3
re
h , VOLTAGE FEEDBACK RATIO (X 10 )
0.2
0.1 0.2 0.5 0.7 1.0
0.3
IC, COLLECTOR CURRENT (mA)
Figure 13. Voltage Feedback Ratio
2N4401 UNIT 1 2N4401 UNIT 2
2.0 3.0 10
5.0 7.0
100
50
m
20
10
5.0
2.0
oe
h , OUTPUT ADMITTANCE ( mhos)
1.0
0.1 0.2 0.5 0.7 1.0
0.3
IC, COLLECTOR CURRENT (mA)
Figure 14. Output Admittance
2N4401 UNIT 1 2N4401 UNIT 2
2.0 3.0 10
5.0 7.0
http://onsemi.com
5
Page 6
3.0
2.0
2N4401
STATIC CHARACTERISTICS
VCE = 1.0 V VCE = 10 V
TJ = 125°C
1.0
0.7
0.5
0.3
FE
h , NORMALIZED CURRENT GAIN
0.2
1.0
0.8
0.6
0.4
0.2
0.1
IC = 1.0 mA
0.5 2.0 3.0 10 50 700.2 0.3
25°C
−55°C
IC, COLLECTOR CURRENT (mA)
Figure 15. DC Current Gain
10 mA 100 mA
1001.00.7 50030205.0 7.0
200 300
TJ = 25°C
500 mA
CE
V , COLLECTOR−EMITTER VOLTAGE (VOLTS)
0
1.0
0.8
0.6
0.4
VOLTAGE (VOLTS)
0.2
0.1 0.2 0.5
TJ = 25°C
0.070.050.030.020.01
V
BE(sat)
VBE @ VCE = 10 V
V
@ IC/IB = 10
CE(sat)
1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)
Figure 17. “On” Voltages
0.1
0.5 2.0 3.0 500.2 0.3
IB, BASE CURRENT (mA)
1.00.7 5.0 7.0
Figure 16. Collector Saturation Region
+0.5
@ IC/IB = 10
−0.5
−1.0
−1.5
COEFFICIENT (mV/ C)°
−2.0
500100
200
500
−2.5
0
0.1 0.2 0.5
Figure 18. Temperature Coefficients
10 20 30
qVC for V
CE(sat)
qVB for V
BE
1.0 2.0 5.0 10 20 IC, COLLECTOR CURRENT (mA)
50 100 500200
http://onsemi.com
6
Page 7
2N4401
TO−92 (TO−226)
PACKAGE DIMENSIONS
CASE 29−11
ISSUE AM
SEATING PLANE
R
T
SEATING PLANE
A
B
STRAIGHT LEAD
BULK PACK
R
P
L
K
XX
V
1
G
H
C
N
D
J
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66
J 0.015 0.020 0.39 0.50 K 0.500 −−− 12.70 −−− L 0.250 −−− 6.35 −−− N 0.080 0.105 2.04 2.66 P −−− 0.100 −−− 2.54 R 0.115 −−− 2.93 −−− V 0.135 −−− 3.43 −−−
MILLIMETERSINCHES
N
A
B
P
K
XX
G
V
1
C
N
BENT LEAD
TAPE & REEL
AMMO PACK
D
J
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
MILLIMETERS
DIM MIN MAX
A 4.45 5.20 B 4.32 5.33 C 3.18 4.19 D 0.40 0.54 G 2.40 2.80 J 0.39 0.50 K 12.70 −−− N 2.04 2.66 P 1.50 4.00 R 2.93 −−− V 3.43 −−−
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local Sales Representative
2N4401/D
7
Loading...