Datasheet 2N4123, 2N4124 Datasheet (ON Semiconductor)

Page 1
2N4123, 2N4124
General Purpose Transistors
NPN Silicon
PbFree Packages are Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage
2N4123 2N4124
CollectorBase Voltage
2N4123 2N4124
EmitterBase Voltage V
Collector Current Continuous I
Total Device Dissipation @ TA = 25°C Derate above 25°C
Total Device Dissipation @ TC = 25°C Derate above 25°C
Operating and Storage Junction Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, JunctiontoAmbient R
Thermal Resistance, JunctiontoCase R
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
V
CEO
V
CBO
EBO
P
P
TJ, T
C
D
D
55 to +150 °C
stg
q
JA
q
JC
30 25
40 30
5.0 Vdc
200 mAdc
625
5.0
1.5 12
200 °C/W
83.3 °C/W
Vdc
Vdc
mW
mW/°C
W
mW/°C
TO−92 CASE 29 STYLE 1
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COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
STRAIGHT LEAD
BULK PACK
MARKING DIAGRAM
2N
412x
AYWW G
G
1
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2008
November, 2008 Rev. 4
1 Publication Order Number:
x = 3 or 4 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping
2N4123RLRM TO92 2000 / Tape & Ammo
2N4124G TO92
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
5000 Units / Bulk
2N4123/D
Page 2
2N4123, 2N4124
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (Note 1)
(IC = 1.0 mAdc, IE = 0) 2N4123
CollectorBase Breakdown Voltage
(IC = 10 mAdc, IE = 0) 2N4123
EmitterBase Breakdown Voltage
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current
(VCB = 20 Vdc, IE = 0)
Emitter Cutoff Current
(VEB = 3.0 Vdc, IC = 0)
ON CHARACTERISTICS
DC Current Gain (Note 1)
(IC = 2.0 mAdc, VCE = 1.0 Vdc) 2N4123
(IC = 50 mAdc, VCE = 1.0 Vdc) 2N4123
CollectorEmitter Saturation Voltage (Note 1)
(IC = 50 mAdc, IB = 5.0 mAdc)
BaseEmitter Saturation Voltage (Note 1)
(IC = 50 mAdc, IB = 5.0 mAdc)
SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz) 2N4123
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
CollectorBase Capacitance
(IE = 0, VCB = 5.0 V, f = 1.0 MHz)
SmallSignal Current Gain
(IC = 2.0 mAdc, VCE = 10 Vdc, RS = 10 k W, f = 1.0 kHz) 2N4123
Current Gain High Frequency
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz) 2N4123
2N4124
2N4124
2N4124
2N4124
2N4124
2N4124
2N4124
V
(BR)CEO
V
(BR)CBO
V
(BR)EBO
I
CBO
I
EBO
h
V
CE(sat )
V
BE(sat)
f
C
C
h
|hfe|
FE
ibo
30 25
Vdc
Vdc
40 30
Vdc
5.0
nAdc
50
nAdc
50
50
120
25 60
150 360
Vdc
0.3
Vdc
0.95
T
250 300
MHz
pF
8.0
cb
fe
4.0
50
120
200 480
pF
2.5
3.0
(IC = 2.0 mAdc, VCE = 10 V, f = 1.0 kHz) 2N4123 (IC = 2.0 mAdc, VCE = 10 V, f = 1.0 kHz) 2N4124
Noise Figure
(IC = 100 mAdc, VCE = 5.0 Vdc, RS = 1.0 k W, f = 1.0 kHz) 2N4123
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.
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2
2N4124
NF
50
120
200 480
dB
6.0
5.0
Page 3
2N4123, 2N4124
10
7.0
5.0
3.0
CAPACITANCE (pF)
2.0
1.0
0.1
0.2 0.3 0.5 0.7
12
10
8
6
4
NF, NOISE FIGURE (dB)
2
0
SOURCE RESISTANCE = 200 W IC = 1 mA
SOURCE RESISTANCE = 500 W IC = 100 mA
0.1
C
ibo
C
obo
1.0 2.0 3.0 5.0 7.0 10 20
REVERSE BIAS VOLTAGE (VOLTS)
Figure 1. Capacitance
AUDIO SMALLSIGNAL CHARACTERISTICS
SOURCE RESISTANCE = 200 W IC = 0.5 mA
SOURCE RESISTANCE = 1 kW IC = 50 mA
12 4 1020400.2 0.4
f, FREQUENCY (kHz)
TIME (ns)
30 40
NOISE FIGURE
(V
= 5 Vdc, TA = 25°C)
CE
Bandwidth = 1.0 Hz
100
200
100
10.0
7.0
5.0
70 50
30
20
1.0
t
f
VCC = 3 V IC/IB = 10 V
EB(off)
2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
t
t
r
= 0.5 V
IC, COLLECTOR CURRENT (mA)
t
s
d
Figure 2. Switching Times
14
f = 1 kHz
12
10
8
6
4
NF, NOISE FIGURE (dB)
2
0
0.1 1.0 2.0 4.0 10 20 400.2 0.4 100
IC = 1 mA
IC = 0.5 mA
IC = 50 mA
IC = 100 mA
RS, SOURCE RESISTANCE (kW)
Figure 3. Frequency Variations
Figure 4. Source Resistance
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3
Page 4
2N4123, 2N4124
h PARAMETERS
(VCE = 10 V, f = 1 kHz, TA = 25°C)
300
200
100
, CURRENT GAIN
70
fe
h
50
30
0.1 0.2 1.0 2.0
0.5
IC, COLLECTOR CURRENT (mA)
Figure 5. Current Gain
20
10
5.0
2.0
5.0 10
100
50
m
20
10
5
oe
2
h , OUTPUT ADMITTANCE ( mhos)
1
0.1 0.2 1.0 2.0
0.5
IC, COLLECTOR CURRENT (mA)
Figure 6. Output Admittance
10
-4
7.0
5.0
3.0
2.0
5.0 10
1.0
, INPUT IMPEDANCE (k )Ω
ie
h
0.5
0.2
0.1 0.2 1.0 2.0 5.0 100.5 IC, COLLECTOR CURRENT (mA)
Figure 7. Input Impedance
2.0
1.0
0.7
0.5
0.3
0.2
FE
h , DC CURRENT GAIN (NORMALIZED)
0.1
0.1
0.5 2.0 3.0 10 50 700.2 0.3
1.0
0.7
re
h , VOLTAGE FEEDBACK RATIO (X 10 )
0.5
0.1 0.2 1.0 2.0 5.0
STATIC CHARACTERISTICS
TJ = +125°C
+25°C
-55°C
IC, COLLECTOR CURRENT (mA)
100.5
IC, COLLECTOR CURRENT (mA)
Figure 8. Voltage Feedback Ratio
VCE = 1 V
1001.00.7 20030205.0 7.0
Figure 9. DC Current Gain
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4
Page 5
CE
V , COLLECTOR EMITTER VOLTAGE (VOLTS)
1.0
0.8
0.6
0.4
0.2
2N4123, 2N4124
TJ = 25°C
IC = 1 mA
0
10 mA
0.1
0.070.050.030.020.01
IB, BASE CURRENT (mA)
Figure 10. Collector Saturation Region
30 mA 100 mA
0.5 2.0 3.0 100.2 0.3
1.00.7 5.0 7.0
1.2 TJ = 25°C
V
1.0
0.8
0.6
0.4
V, VOLTAGE (VOLTS)
0.2
1.0 2.0 5.0 10 20 500100
IC, COLLECTOR CURRENT (mA)
V
CE(sat)
@ IC/IB = 10
BE(sat)
VBE @ VCE = 1 V
@ IC/IB = 10
Figure 11. “On” Voltages
200
1.0
0.5
qVC for V
0
-0.5
-1.0
-1.5
, TEMPERATURE COEFFICIENTS (mV/ C)°θ
V
-2.0 0 60 80 120 140 160 18020 40 100 200
qVB for V
CE(sat)
BE(sat)
IC, COLLECTOR CURRENT (mA)
+25°C to +125°C
-55°C to +25°C
-55°C to +25°C
+25°C to +125°C
Figure 12. Temperature Coefficients
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Page 6
2N4123, 2N4124
a
PACKAGE DIMENSIONS
TO92 (TO−226)
CASE 2911
ISSUE AM
SEATING PLANE
R
T
SEATING PLANE
A
B
STRAIGHT LEAD
BULK PACK
R
P
L
K
XX
V
1
G
H
C
N
D
J
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 K 0.500 --- 12.70 --- L 0.250 --- 6.35 --- N 0.080 0.105 2.04 2.66 P --- 0.100 --- 2.54 R 0.115 --- 2.93 --- V 0.135 --- 3.43 ---
MILLIMETERSINCHES
N
A
B
BENT LEAD
TAPE & REEL
AMMO PACK
P
K
XX
G
D
J
V
1
C
SECTION X−X
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
MILLIMETERS
DIM MIN MAX
A 4.45 5.20 B 4.32 5.33 C 3.18 4.19 D 0.40 0.54
G 2.40 2.80
J 0.39 0.50 K 12.70 --- N 2.04 2.66 P 1.50 4.00 R 2.93 --- V 3.43 ---
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
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6
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