Page 1
2N3906
Preferred Device
General Purpose
Transistors
PNP Silicon
Features
• Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector − Emitter Voltage V
Collector − Base Voltage V
Emitter − Base Voltage V
Collector Current − Continuous I
Total Device Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 60°C P
Total Device Dissipation @ TC = 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
CEO
CBO
EBO
P
P
TJ, T
C
D
D
D
stg
THERMAL CHARACTERISTICS (Note 1)
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Indicates Data in addition to JEDEC Requirements.
R
q
JA
R
q
JC
40 Vdc
40 Vdc
5.0 Vdc
200 mAdc
625
5.0
250 mW
1.5
12
−55 to +150 °C
200 °C/W
83.3 °C/W
mW
mW/°C
W
mW/°C
TO−92
CASE 29
STYLE 1
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COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
STRAIGHT LEAD
BULK PACK
MARKING DIAGRAM
2N
3906
ALYWG
G
1
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 3
1 Publication Order Number:
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
2N3906/D
Page 2
2N3906
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector− Emitter Breakdown Voltage (Note 2) (I
= 1.0 mAdc, IB = 0) V
C
Collector− Base Breakdown Voltage (IC = 10 mAdc, IE = 0)
Emitter− Base Breakdown Voltage (IE = 10 mAdc, IC = 0)
Base Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc) I
Collector Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc) I
ON CHARACTERISTICS (Note 2)
DC Current Gain (IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
Collector− Emitter Saturation Voltage (IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc
Base− Emitter Saturation Voltage (IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
SMALL− SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product (IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz) f
Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz) C
Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) C
Input Impedance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) h
Voltage Feedback Ratio (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) h
Small−Signal Current Gain (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) h
Output Admittance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) h
Noise Figure (IC = 100 mAdc, VCE = 5.0 Vdc, RS = 1.0 kW, f = 1.0 kHz)
SWITCHING CHARACTERISTICS
Delay Time
Rise Time t
(VCC = 3.0 Vdc, VBE = 0.5 Vdc,
IC = 10 mAdc, IB1 = 1.0 mAdc)
Storage Time (VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc) t
Fall Time (VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc) t
2. Pulse Test: Pulse Width v 300 ms; Duty Cycle v 2%.
(BR)CEO
V
(BR)CBO
V
(BR)EBO
BL
CEX
h
V
CE(sat)
V
BE(sat)
FE
T
obo
ibo
ie
re
fe
oe
40 − Vdc
40 − Vdc
5.0 − Vdc
− 50 nAdc
− 50 nAdc
60
80
100
60
30
−
−
0.65
−
−
−
300
−
−
0.25
0.4
0.85
0.95
250 − MHz
− 4.5 pF
− 10 pF
2.0 12
0.1 10 X 10
100 400 −
3.0 60
NF − 4.0 dB
t
d
r
s
f
− 35 ns
− 35 ns
− 225 ns
− 75 ns
−
Vdc
Vdc
kW
−4
mmhos
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2
Page 3
2N3906
ORDERING INFORMATION
Device Package Shipping
2N3906 TO−92 5000 Units / Bulk
2N3906G TO−92
(Pb−Free)
2N3906RL1 TO−92 5000 Units / Bulk
2N3906RL1G TO−92
(Pb−Free)
2N3906RLRA TO−92 2000 / Tape & Reel
2N3906RLRAG TO−92
(Pb−Free)
2N3906RLRM TO−92 2000 / Ammo Pack
2N3906RLRMG TO−92
(Pb−Free)
2N3906RLRP TO−92 2000 / Tape & Reel
2N3906RLRPG TO−92
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
5000 Units / Bulk
5000 Units / Bulk
2000 / Tape & Reel
2000 / Ammo Pack
2000 / Tape & Reel
†
3 V
< 1 ns
+0.5 V
10.6 V
* Total shunt capacitance of test jig and connectors
300 ns
DUTY CYCLE = 2%
10 k
275
CS < 4 pF*
Figure 1. Delay and Rise Time Equivalent Test Circuit
3 V
+9.1 V
0
10 < t1 < 500 ms
DUTY CYCLE = 2%
< 1 ns
10 k
1N916
10.9 V
t
1
275
C
< 4 pF*
S
* Total shunt capacitance of test jig and connectors
Figure 2. Storage and Fall Time Equivalent Test Circuit
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3
Page 4
10
7.0
5.0
3.0
CAPACITANCE (pF)
2.0
1.0
0.1
0.2 0.3 0.5 0.7
REVERSE BIAS (VOLTS)
Figure 3. Capacitance
TYPICAL TRANSIENT CHARACTERISTICS
C
obo
C
ibo
1.0 2.0 3.0 5.0 7.0 10 20
2N3906
30 40
TJ = 25°C
TJ = 125°C
5000
VCC = 40 V
3000
IC/IB = 10
2000
1000
700
500
300
Q, CHARGE (pC)
200
100
70
50
1.0
Q
T
2.0 3.0 5.0 7.0 10 20 30 50 70 100 200
IC, COLLECTOR CURRENT (mA)
Q
A
Figure 4. Charge Data
500
300
200
100
70
50
30
TIME (ns)
20
10
7
1.0 2.0 3.0 10 20
5.0 7.0 30 50
IC, COLLECTOR CURRENT (mA)
Figure 5. Turn−On Time
tr @ VCC = 3.0 V
td @ VOB = 0 V
IC/IB = 10
705100
15 V
40 V
2.0 V
200
500
300
200
100
70
50
30
f
t , FALL TIME (ns)
20
10
7
1.0 2.0 3.0 10 20
5.0 7.0 30 50
IC, COLLECTOR CURRENT (mA)
Figure 6. Fall Time
IC/IB = 20
IC/IB = 10
VCC = 40 V
IB1 = I
B2
705100
200
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4
Page 5
2N3906
TYPICAL AUDIO SMALL−SIGNAL CHARACTERISTICS
NOISE FIGURE VARIATIONS
(VCE = −5.0 Vdc, TA = 25°C, Bandwidth = 1.0 Hz)
5.0
SOURCE RESISTANCE = 200 W
IC = 1.0 mA
4.0
3.0
2.0
NF, NOISE FIGURE (dB)
SOURCE RESISTANCE = 2.0 k
1.0
IC = 100 mA
0
0.1
0.2 0.4
300
200
SOURCE RESISTANCE = 200 W
IC = 0.5 mA
SOURCE RESISTANCE = 2.0 k
IC = 50 mA
1.0 2.0 4.0 10 20
f, FREQUENCY (kHz)
Figure 7.
(VCE = −10 Vdc, f = 1.0 kHz, TA = 25°C)
40
100
h PARAMETERS
m
12
f = 1.0 kHz
10
8
6
4
NF, NOISE FIGURE (dB)
2
0
0.1 1.0 2.0 4.0 10 20
0.2 0.4
Rg, SOURCE RESISTANCE (k OHMS)
IC = 1.0 mA
IC = 0.5 mA
Figure 8.
100
70
50
30
IC = 50 mA
IC = 100 mA
40
100
100
70
fe
h , DC CURRENT GAIN
50
30
0.1 0.2 1.0 2.0
0.3 0.5 3.0
IC, COLLECTOR CURRENT (mA)
0.7
Figure 9. Current Gain
20
10
7.0
5.0
3.0
2.0
1.0
0.7
ie
0.5
h , INPUT IMPEDANCE (k OHMS)
0.3
0.2
0.1 0.2 1.0 2.0
0.3 0.5 3.0
IC, COLLECTOR CURRENT (mA)
0.7
Figure 11. Input Impedance
5.0 10
7.0
5.0 10
7.0
20
10
oe
h , OUTPUT ADMITTANCE ( mhos)
7
5
0.1 0.2 1.0 2.0
0.3 0.5 3.0
IC, COLLECTOR CURRENT (mA)
0.7
Figure 10. Output Admittance
10
−4
7.0
5.0
3.0
2.0
1.0
0.7
re
h , VOLTAGE FEEDBACK RATIO (X 10 )
0.5
0.1 0.2 1.0 2.0
0.3 0.5 3.0
IC, COLLECTOR CURRENT (mA)
0.7
Figure 12. Voltage Feedback Ratio
5.0 10
7.0
5.0
7.0
10
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Page 6
2N3906
TYPICAL STATIC CHARACTERISTICS
2.0
1.0
0.7
0.5
0.3
0.2
FE
h , DC CURRENT GAIN (NORMALIZED)
0.1
0.1
1.0
0.8
IC = 1.0 mA
0.6
0.2 0.3
TJ = +125°C
+25°C
−55 °C
0.5 2.0 3.0 10 50
1.00.7
IC, COLLECTOR CURRENT (mA)
30205.0 7.0
Figure 13. DC Current Gain
10 mA 30 mA 100 mA
70
VCE = 1.0 V
100
TJ = 25°C
200
0.4
0.2
CE
V , COLLECTOR EMITTER VOLTAGE (VOLTS)
0
1.0
TJ = 25°C V
0.8
0.6
0.4
V, VOLTAGE (VOLTS)
0.2
0
1.0 2.0 5.0 10 20
IC, COLLECTOR CURRENT (mA)
BE(sat)
V
CE(sat)
0.1
0.070.050.030.020.01
IB, BASE CURRENT (mA)
Figure 14. Collector Saturation Region
1.0
@ IC/IB = 10
0.5
VBE @ VCE = 1.0 V
0
−0.5
@ IC/IB = 10
50
100
200
−1.0
−1.5
, TEMPERATURE COEFFICIENTS (mV/ C)°
V
q
−2.0
0.5 2.0 3.0 100.2 0.3
qVC FOR V
0 60 80 120 140 160
1.00.7 5.0 7.0
+25°C TO +125°C
−55 °C TO +25°C
100 200
qVB FOR V
20 40
CE(sat)
BE(sat)
IC, COLLECTOR CURRENT (mA)
+25°C TO +125°C
−55 °C TO +25°C
180
Figure 15. “ON” Voltages
Figure 16. Temperature Coefficients
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Page 7
2N3906
TO−92 (TO−226)
PACKAGE DIMENSIONS
CASE 29−11
ISSUE AM
SEATING
PLANE
R
T
SEATING
PLANE
A
B
STRAIGHT LEAD
BULK PACK
R
P
L
K
XX
V
1
G
H
C
N
D
J
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
D 0.016 0.021 0.407 0.533
G 0.045 0.055 1.15 1.39
H 0.095 0.105 2.42 2.66
J 0.015 0.020 0.39 0.50
K 0.500 −−− 12.70 −−−
L 0.250 −−− 6.35 −−−
N 0.080 0.105 2.04 2.66
P −−− 0.100 −−− 2.54
R 0.115 −−− 2.93 −−−
V 0.135 −−− 3.43 −−−
MILLIMETERSINCHES
N
A
B
P
K
XX
G
V
1
C
N
BENT LEAD
TAPE & REEL
AMMO PACK
D
J
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
MILLIMETERS
DIM MIN MAX
A 4.45 5.20
B 4.32 5.33
C 3.18 4.19
D 0.40 0.54
G 2.40 2.80
J 0.39 0.50
K 12.70 −−−
N 2.04 2.66
P 1.50 4.00
R 2.93 −−−
V 3.43 −−−
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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2N3906/D
7
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