Product specification
Supersedes data of October 1981
File under Discrete Semiconductors, SC08a
1995 Oct 27
Page 2
Philips SemiconductorsProduct specification
Silicon planar epitaxial
overlay transistor
APPLICATIONS
• The 2N3553 is intended for use in VHF and UHF
transmitting applications.
PINNING - TO-39/3
PINDESCRIPTION
1emitter
2base
3collector
2N3553
DESCRIPTION
The device is a silicon NPN overlay transistor in a TO-39
metal package with the collector connected to the case.
handbook, halfpage
1
2
3
Fig.1 Simplified outline.
MBB199
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMAX.UNIT
V
V
I
P
T
f
CEX
CEO
CM
tot
j
T
collector-emitter voltageIC≤ 200 mA; VBE= −1.5 V65V
collector-emitter voltageopen base; IC≤ 200 mA40V
peak collector current1.0A
total power dissipationup to Tmb=25°C7.0W
junction temperature200°C
transition frequencyIC= 125 mA; VCE= 28 V500−
RF performance
f
(MHz)
V
(V)
CE
P
(W)
o
G
p
(dB)
η
(%)
175282.5>10>50
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1995 Oct 272
Page 3
Philips SemiconductorsProduct specification
Silicon planar epitaxial
2N3553
overlay transistor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CBO
V
CEX
V
CEO
V
EBO
I
C
I
CM
P
tot
T
stg
T
j
THERMAL CHARACTERISTICS
SYMBOLPARAMETERVALUEUNIT
R
th j-mb
collector-base voltageopen emitter−65V
collector-emitter voltageIC≤ 200 mA; VBE= −1.5 V−65V
collector-emitter voltageopen base; IC≤ 200 mA−40V
emitter-base voltageopen collector−4V
collector current (DC)−0.35A
peak collector current−1A
total power dissipationup to Tmb=25°C−7W
storage temperature−65+200°C
junction temperature−200°C
thermal resistance from junction to mounting base25K/W
10
handbook, halfpage
I
C
(A)
1
-1
10
-2
10
1
(1) All frequencies, including DC.
(2) f ≥ 1 MHz.
(3) Allowed during switching off, provided the transistor is cut-off
≤−1.5 V; RBE≥ 33 Ω; IC≤ 200 mA and the transient
with V
BB
energy ≤ 0.5 mW.
(1)
10
VCE (V)
MGC928
(2)
(3)
Fig.2 DC SOAR.
10
handbook, halfpage
P
tot
(W)
5
2
10
0
0
100200
Tmb (
MGC927
o
C)
Fig.3 Power derating curve.
1995 Oct 273
Page 4
Philips SemiconductorsProduct specification
Silicon planar epitaxial
2N3553
overlay transistor
CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
(BR)CBO
V
(BR)CEO
V
(BR)CEX
V
(BR)EBO
V
BE
V
CEsat
I
CEO
h
FE
f
T
Rho
ie
C
c
collector-base breakdown voltageopen emitter; IC= 0.25 mA65−−V
collector-emitter breakdown voltageopen base; IC up to 200 mA;
40−−V
note 1
collector-emitter breakdown voltageIC up to 200 mA; VBE= −1.5 V;
VCE= 28 V; Tmb=25°C.
(1) Pi= 0.5 W.
(2) Pi= 0.375 W.
(3) Pi= 0.25 W.
200100400300
(4) Pi= 0.1 W.
(5) Pi= 0.05 W.
f(MHz)
Fig.8Output power as a function of frequency;
typical values.
1995 Oct 276
Page 7
Philips SemiconductorsProduct specification
Silicon planar epitaxial
overlay transistor
PACKAGE OUTLINE
handbook, full pagewidth
0.86
max
1.0
max
o
45
9.4 max
5.08
2N3553
1
2
8.5
max
3
6.6
max
12.7 min
0.51
max
MSA241
Dimensions in mm.
Fig.9 TO-39.
1995 Oct 277
Page 8
Philips SemiconductorsProduct specification
Silicon planar epitaxial
2N3553
overlay transistor
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Oct 278
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