erase cycle; typically takes 20 msec. After a software chip clear operation has been completed, all 256K bit locations of memory show 
high level at read operation mode.
d.) Software Autoclear Disable Mode
This software algorithm disables the internal automatic clear before 
write cycle. Table 4 shows the six steps needed to perf orm the autoclear disable mode:
Step   Mode Address A14-A0   Data I/O 7-0 
  1 Page Write 5555 Hex   AA Hex 
  2 Page Write 2AAA Hex   55 Hex 
  3 Page Write 5555 Hex   80 Hex 
  4 Page Write 5555 Hex   AA Hex 
  5 Page Write 2AAA Hex   55 Hex 
  6 Page Write 5555 Hex   40 Hex 
7-70 Page Write Address   Data
Page write operation using the software autoclear disable mode will 
reduce programming time to typically 5 msec. The page write using 
software autoclear disable mode is usually used after a chip clear or 
a software chip clear operation. At the end of the six steps sequence, 
the autoclear before write is disabled and will stay that wa y unless a 
power-down occurs or the software autoclear enable procedure is 
initiated.
e.) Software Autoclear Enable Mode
Automatic page clear before page write can be restored to 28C256A 
either by Vcc power-down or by software autoclear enable mode. 
Table 5 shows the six steps page write procedure needed to enable 
software autoclear mode:
Step   Mode Address A14-A0   Data I/O 7-0 
  1 Page Write 5555 Hex   AA Hex 
  2 Page Write 2AAA Hex   55 Hex 
  3 Page Write 5555 Hex   80 Hex 
  4 Page Write 5555 Hex   AA Hex 
  5 Page Write 2AAA Hex   55 Hex 
  6 Page Write 5555 Hex   50 Hex 
7-70 Page Write Address   Data
Symbol Parameter Condition Min Max Units
  Icc Active Vcc CE=OE=Vil; All I/O 50 (C) mA
Current Open, Min Read or 70 (I) mA
Write Cycle Time 90 (M) mA
  Isb1 CMOS CE=Vcc-0.3 V to 200 (C) µA
Standby Vcc+1 V 300 (I&M) µA 
Current
  Isb2 TTL Standby CE=Vih, OE=Vil, 3 mA
Current All I/O Open, Other
Inputs=Vcc Max 
Vin=Vcc Max
  Iil Input 1 µA
Leakage 
Current
  Iol Output 10 µA
Leakage 
Current
  Vil Input Low -0.1 -0.8 V
Voltage
  Vih Input High 2 Vcc+0.3 V
Voltage
  Vo l Output Low Iol=2.1 mA 0.45 V
Voltage
  Voh Output High Ioh=-0.45 mA 2.4 V
Voltage
D.C. CHARACTERISTICS
(C) = COMMERCIAL 
(I) = INDUSTRIAL 
(M) = MILITARY
Turbo IC, Inc.
28C256A
ABSOLUTE MAXIMUM STRESS RANGES *
TEMPERATURE
Storage: -65° C to 150° C 
Under Bias: -55° C to 125° C
ALL INPUT OR OUTPUT VOLTAGES
with respect to Vss +6 V to -0.3 V
 “Absolute Maximum Ratings” ma y cause permanent damage to the device. This is a stress rating 
only and functional operation of the device at 
these or any other conditions above those indicated in the operation section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may 
affect device reliability.
RECOMMENDED OPERATING CONDITIONS 
Temperature Range: Commercial: 0° C to 70° C
Industrial: -40° C to 85° C 
Military: -55° C to 125° C
Vcc Supply Voltage:5 V ± 10%
Endurance: 100,000 Cycles/Byte (Typical) 
Data Retention: 10 Years
A.C. CHARACTERISTICS - READ OPERATION
28C256A-1 28C256A-2 28C256A-3 28C256A-4
 Symbol Parameters Min Max Min Max Min Max Min MaxUnit 
  tacc Address to 120 150 200 250 ns
Output Delay
  tce CE to Output 120 150 200 250 ns
Delay 
  toe OE to Output 70 90 110 150 ns 
  tdf OE to Output 0 40 0 60 0 90 0 90 ns
In High Z 
  toh Output Hold 0000ns
from Address
Changes, Chip
Enable or
Output Enable
Whichever
Occurs First
A.C. Read Wave Forms
A.C. TEST CONDITIONS
Output Load : 1 TTL Load and Cl=100 pF 
Input Rise and Fall Times : < 10 ns 
Input Pulse Level : 0 V to 3 V 
Timing Measurement Reference Level : 1.5 V
tacc
ADDRESS VALIDADDRESS
CE
OE
OUTPUT HIGH-Z
toe
tce
tdf
toh
OUTPUT VALID
HIGH-Z