Datasheet 24LC16B Datasheet

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Page 1

16K 2.5V I2C™ Serial EEPROM

24LC16B

FEATURES

• Single supply with operation down to 2.5V

• Low power CMOS technology

- 1 mA active current typical

-10µA standby current typical at 5.5V

-5µA standby current typical at 3.0V

• Organized as 8 blocks of 256 bytes (8 x 256 x 8)

• 2-wire serial interface bus, I

• Schmitt trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz (E-temp.) and 400 kHz (C/I-temp.) compatibility

• Self-timed write cycle (including auto-erase)

• Page-write buffer for up to 16 bytes

• 2 ms typical write cycle time for page-write

• Hardware write protect for entire memory

• Can be operated as a serial ROM

• Factory programming (QTP) available

• ESD protection > 4,000V

• 1,000,000 erase/write cycles

• Data retention > 200 years

• 8-pin PDIP, SOIC, TSSOP and MSOP packages

• Available for extended temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

C™ compatible

DESCRIPTION

The Microchip Technology Inc. 24LC16B is a 16 Kbit Electrically Erasable PROM. The device is organized as eight blocks of 256 x 8-bit memory with a 2-wire serial interface. Low voltage design permits operation down to 2.5V with standby and active currents of only 5 µA and 1 mA respect ively. The 24LC16B also ha s a page-write capability for up to 16 bytes of data. The 24LC16B is availabl e in the stan dard 8-pin DIP, surface mount SOIC, TSSOP and MSOP packages.

BLOCK DIAGRAM

I/O

CONTROL

LOGIC

I/O

SDA

VSS

SCL

MEMORY

CONTROL

LOGIC

XDEC

HV GENERATOR

EEPROM

ARRAY

PAGE LATCHES

YDEC

SENSE AMP

R/W CONTROL

PACKAGE TYPES

PDIP

I2C™ is a trademark of the Philips Corporation

 2001 Microchip Technology Inc. DS20070M-page 1

24LC16B

VCC WP

7 6

SCL

SDA

Note: Pins A0, A1 and A2 are not used by the 24LC16B. (No internal connections).

A0 A1 A2

SOIC

1 2 3 4

24LC16B

SCL

SDA

A0 A1 A2

TSSOP MSOP

1 2 3 4

24LC16B

VCC

SCL

SDA

24LC16B

VCC

SCL

SDA

Page 2

24LC16B

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings†

VCC.............................................................................................................................................................................7.0V

All inputs and outputs w.r.t. V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temp. with power applied.................................. ...... .................................................. ..... ...........-65°C to +125°C

Soldering temperature of leads (10 seconds).......................................................................................................+300°C

ESD protection on all pins .....................................................................................................................................................≥ 4KV

† NOTICE: Stresses a bove thos e listed under “Ma ximu m ratin gs” may cause pe rmanent d amage to the devic e. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

1.1 DC Characteristics

DC CHARACTERISTICS

SS ......................................................................................................... -0.3V to VCC +1.0V

CC = +2.5V to +5.5V

Industrial (I): T Automotive (E): T

AMB = -40°C to +85°C AMB = -40°C to +125°C

Param.

No.

D1 V D2 — High level input volta ge .7 VCC — V — D3 V D4 VHYS Hysteresis of Schmitt

D5 V D6 ILI Input leakage current -10 10 µAVIN = .1V to VCC D7 ILO Output leakage curre nt -10 10 µAVOUT = .1V to VCC D8 CIN,

D9 ICC write Operating current — 3mAVCC = 5.5V, SCL = 400 kHz D10 I D11 ICCS Standby current —

Note: This parameter is periodically sampled and not 100% tested.

Sym. Characteristic Min. Max. Units Conditions

IH WP, SCL and SDA pins — ———

IL Low level input voltage — .3 VCC V —

.05 VCC — V (Note)

trigger inputs

OL Low level output voltage — .40 V IOL = 3.0 mA, VCC = 2.5V

Pin capacitance

OUT

CC read — 1mA—

(all inputs/outpu t s)

— 10 pF VCC = 5.0V (Note)

AMB = 25°C, FCLK = 1 MHz

—

100

µΑ

VCC = 3.0V, SDA = SCL = VCC VCC = 5.5V, SDA = SCL = VCC

µΑ

WP = VSS

DS20070M-page 2  2001 Microchip Technology Inc.

Page 3

1.2 AC Characteristics

AC CHARACTERISTICS

Param.

No.

Sym. Characteristic. Min. Max. Units Conditions

CLK Clock frequency —

2 THIGH Clock high time 600

LOW Clock low time 1300

R SDA and SCL rise time

(Note 1)

5T 6T

F SDA and SCL fall time — 300 ns (Note 1)

HD:STA START condition hold

time

SU:STA START condition setup

time 8THD:DAT Data input hold time 0 — ns (Note 2) 9T

SU:DAT Data input setup time 100

10 TSU:STO STOP condition setup

time

11 TAA Output valid from clock

(Note 2)

12 T

BUF Bus free time: Time the

bus must be free before a

new transmissi on can

start

13 TOF Output fall time from VIH

IL maximum

14 T

minimum to V

SP Input filter spike

suppression

(SDA and SCL pins)

15 T

WC Write cycle time (byte or

page)

16 — Endurance 1M — cycles 25°C, V

Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum

300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.

3: The combined T

suppression. This eliminates the need for a T

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please

consult the Total Endurance Model which can be obtained on Microchip’s website: www.microchip.com.

SP and VHYS specifications are due to new Schmitt trigger inputs which provide improved noise spike

CC = +2.5V to +5.5V

Industrial (I): T Automotive (E): T

—

4000

4700

— —

1000

600

4000

600

4700

250 600

4000

— —

3500

1300 4700

20+0.1C

—

400 100

— —

300

— —

900

— —

250 250

AMB = -40°C to +85°C AMB = -40°C to +125°C

kHz 2.5V ≤ VCC ≤ 5.5V

ns 2.5V ≤ VCC ≤ 5.5V

ns 2.5V ≤ VCC ≤ 5.5V (Note 1)

ns 2.5V ≤ VCC ≤ 5.5V

ns 2.5V ≤ V

— 50 ns (Notes 1 and 3)

— 5ms—

I specification for standard operation.

2.5V ≤ V

(Note 1)

2.5V ≤ V

(Note 4)

24LC16B

CC ≤ 5.5V (E-temp. range)

CC ≤ 5.5V CC ≤ 5.5V (E-temp. range)

CC = 5.0V, Block Mode

 2001 Microchip Technology Inc. DS20070M-page 3

Page 4

24LC16B

FIGURE 1-1: BUS TIMING DATA

SCL

SDA

OUT

FIGURE 1-2: BUS TIMING START/STOP

SCL

SDA

START STOP

DS20070M-page 4  2001 Microchip Technology Inc.

Page 5

24LC16B

2.0 FUNCTIONAL DESCRIPTION

The 24LC16B supports a bi-directional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, and a device receiving dat a as receiver. The bus has to be controlled by a master device which generates the serial clock (SCL), controls the bus access and generates the START and STOP conditions, while the 24LC16B works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated.

3.0 BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus is not busy.

• During data transfer, the data line must remain stable whene ver the cloc k line i s HIG H. Chang es in the data l ine while the clock lin e i s HI GH w ill be interpreted as a START or STOP condition.

Accordingly, the following bus conditions have been defined (Figure 3-1).

3.1 Bus not Busy (A)

Both data and clock lines remain HIGH.

3.2 Start Data Transfer (B)

A HIGH to LOW transition of the SDA line while the clock (SCL) is H IGH determines a START condition. All commands must be preceded by a START condition.

3.3 Stop Data Transfer (C)

A LOW to HIGH transition of the SDA line while the clock (SCL) is HIGH determines a STOP condition. All operations must be ended with a STOP condition.

3.4 Data Valid (D)

The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the HIGH period of the clock signal.

The data on the line must be changed during the LOW period of the clo ck sign al. Th ere is one c lock pulse p er bit of data.

Each data transfer is initiated with a START condition and terminated with a STOP condition. The n um ber of the data bytes transferred between the START and STOP conditions is determined by the master device and is theoreti cally u nlimited , althoug h only the las t sixteen will be stor ed when doing a write oper ation. When an overwrite does occur it will replace data in a first-in first-out (FIFO) fashion.

3.5 Acknowledge

Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The ma ster devi ce m ust gener at e an ex tr a cloc k pulse which is associated with this acknowledge bit.

Note: The 24LC16B does not generate any

acknowledge bits if an internal programming cy cle is in progress.

The device that acknowledges, has to pull down the SDA line during the ackn owledge clock pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the sl av e b y n ot generating an acknowledg e b it on the last byte that has be en c locked out of the slave. In this case, the slave (24LC16B) will leave the data line HIGH to enable the master to generate the STOP condition.

FIGURE 3-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS

(A) (B) (D) (D) (A)(C)

SCL

SDA

START

CONDITION

 2001 Microchip Technology Inc. DS20070M-page 5

ADDRESS OR

ACKNOWLEDGE

VALID

DATA

ALLOWED

TO CHANGE

STOP

CONDITION

Page 6

24LC16B

3.6 Device Addressing

A control byte is the first byte received following the start conditi on from t he mast er device. The contr ol byte consists of a fou r bit con trol co de, for th e 24LC 16B this is set as The next three bits of the control byte are the block select bits (B2, B1, B0). They are used by the master device to select which of the eight 256 word blocks of memory are to be access ed. These bits are in effect the three most significant bits of the word address. It should be noted that the protocol limits the size of the memory to eight blocks of 256 word s, therefore the protocol can support only one 24LC16B per system.

The last bit of the control byte defines the operation to be performed. When set to ‘ selected, when set to ‘ Following the START condition, the 24LC16B mon itors the SDA bus checking the device type identifier being transmitted, upon a puts an acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24LC16B will select a read or write operation.

Operation

1010 binary for read and write operations.

1’ a read operation is

0’ a write operation is selected.

1010 code the slave device out-

Read Write

Control

Code

1010

Block Select R/W

Block Address Block Address

FIGURE 3-2: CONTROL BYTE

ALLOCATION

START READ/WRITE

SLAVE ADDRESS

1010B2 B1 B0

X = Don’t care

R/W

DS20070M-page 6  2001 Microchip Technology Inc.

Page 7

24LC16B

4.0 WRITE OPERATION

4.1 Byte Write

Following the START condition from the master, the device code (4 bits), the block address (3 bits) and the R/W

bit which is a logic LO W i s p lac ed ont o the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow after it has generated an acknowl edge bit during the ninth clock cycl e. Therefore, th e next byte trans mitted by the master is the word address and will be written into the address pointer of the 24LC16B. After receiving another acknowledge signal from the 24LC16B, the master de vice will tran smit the dat a word to be written into the addressed memory location. The 24LC16B acknowledges again and the master generates a STOP condition. This initiates the internal write cycle, and during this time the 24LC 16B will not generate acknowledge signals (Figure 4-1).

4.2 Page Write

The write control byte, word address and the first data byte are transmitted to the 24LC16B in the same way as in a byte write. But instead of generating a STOP condition the master transmits up to 16 data bytes to the 24LC16B, which are temporarily stored in the onchip page buffer and will be written into the memory

after the master has transmitted a STOP condition. After the receipt of each word, the four lower order address pointer bits are internally incremented by ‘

1’.

The higher order 7 bits of the word address remains constant. If the master should transmit more than 16 words prior to generating the STOP condition, the address counter will roll over and the previously received data will be overwri tten. As w ith the by te writ e operation, once the STOP condition is received an internal write cycle will begin (Figure 4-2).

Note: Page write operations a re limited to writ-

ing bytes within a single physical page, regardless of the number of by tes ac tually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’) and end at addresses that are integer multiples of [pa ge size - 1]. If a page write co mm and at tem pts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being wr itt en to th e n ex t p a ge as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page bo undary .

FIGURE 4-1: BYTE WRITE

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

T A R T

S P

CONTROL

FIGURE 4-2: PAGE WRITE

S T

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

CONTROL

BYTE

R T

S P

BYTE

A C K

WORD

ADDRESS (n)

A C K

WORD

ADDRESS

A C K

DATA (n) DATA (n + 15)

A C K

DATA (n + 1)

A C K

DATA

A C K

S T O P

A C K

S T O P

A C K

 2001 Microchip Technology Inc. DS20070M-page 7

Page 8

24LC16B

5.0 ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once th e STOP condition for a wri te com mand has been issued from the master, the device initiates the internally timed write cycle. ACK polling can be initiated immedi ately . This in volves the master s ending a start condition followed by the control byte for a write command (R/W the write cycle, then no ACK will be returned. If the cycle is complete, then the device will return the ACK and the master can then proceed with the next read or write command. See Figure 5-1 for flow diagram.

FIGURE 5-1: ACKNOW LEDGE POLLING

= 0). If the device is still busy with

FLOW

Send

Write Command

Send Stop

Condition to

Initiate Wr ite Cycle

6.0 WRITE PROTECTION

The 24LC16B can be used as a serial ROM when the WP pin is connected to V inhibited and the entire memory will b e writ e-protec ted.

CC. Programming will be

Send Start

Send Control Byte

with R/W

Acknowledge

= 0

Did Device (ACK = 0)?

Yes

Operation

DS20070M-page 8  2001 Microchip Technology Inc.

Page 9

24LC16B

7.0 READ OPERATION

Read operations are initiated in the same way as write operations with the exception that the R/W slave address is se t to ‘

1’. There are three basic ty pes

of read operations: current add ress read, ran dom read and sequential read.

7.1 Current Address Read

The 24LC16B contains an address counter that maintains the address of the last word accessed, internally incremented by ‘

1’. Therefore, if the previous access

(either a read or write operation) was to address next current address read operati on would access da ta from address with R/W

n + 1. Upon receipt o f the slave addres s

bit set to ‘1’, the 24 LC16B issues an acknowledge and transmits the 8-b it data w ord. The master will not acknowledge the transfer but does generate a STOP condition and the 24LC16B discontinues transmission (Figure 7-1).

7.2 Random Read

Random read operations allow the master to access any memory location in a random manner. To perform this type of read operatio n, fi rst the word address must be set. This is d one by sending the word a ddress to the 24LC16B as part of a write operation. After the word address is sent, the master generates a START condition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set. Then the master issues the control byte again but with the R/W then issue an acknow ledge and tran smits the 8-bit data word. The master will n ot acknow ledg e the tra nsfer but does generate a ST OP conditio n and the 24LC16 B discontinues transmission (Figure 7-2).

bit set to a ‘1’. The 24LC16B wil l

bit of the

n, the

7.3 Sequential Read

Sequential reads are ini tiated in the sam e way as a random read except that after the 24LC16B transmits the first data byte, the master issues an acknowledge as opposed to a STOP condition in a random read. This directs the 24LC16B to transmit the next sequentially addressed 8-bit word (Figure 7-3).

To provide sequential reads the 24LC16B contains an internal address poin ter which is i ncremented by o ne at the completion of ea ch operation. This address pointer allows the entire memory contents to be serially read during one operation.

7.4 Noise Protection

The 24LC16B emp loys a VCC threshold detector circuit which disables the internal erase/write logic if the V is below 1.5V at nominal conditions.

The SCL and SDA inputs have Sch mitt trigger and filter circuits which suppress noise spikes to assure proper device operation even on a noisy bus.

FIGURE 7-1: CURRENT ADDRESS READ

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

 2001 Microchip Technology Inc. DS20070M-page 9

T A R

CONTROL

BYTE

DATA (n)

A C K

T O P

N O

A C K

Page 10

24LC16B

FIGURE 7-2: RANDOM READ

S BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

CONTROL

BYTE

S P

FIGURE 7-3: SE QUENTIAL READ

BUS ACTIVITY MASTER

SDA LINE

BUS ACTIVITY

CONTROL

BYTE

DATA (n) DATA (n + 1) DATA (n + 2) DATA (n + X)

A C K

WORD

ADDRESS (n)

A C K

S T A R T

A C K

CONTROL

BYTE

A C K

DATA (n)

S T O P

N O

A C K

S T O P

N O

A C K

DS20070M-page 10  2001 Microchip Technology Inc.

Page 11

8.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 8-1.

TABLE 8-1: PIN FUNCTION TABLE

Name PDIP SOIC TSSOP MSOP Description

A0 1 1 1 1 Not Connected A1 2 2 2 2 Not Connected A2 3 3 3 3 Not Connected

SS 4 4 4 4 Ground

SDA 5 5 5 5 Serial Address/Data I/O SCL 6 6 6 6 Serial Clock

WP 7 7 7 7 Write Protect Input

CC 8 8 8 8 +2.5V to 5.5V Power Supply

8.1 Serial Address/Data Input/Output (SDA)

This is a bi-directional pin used to transfer addresses and data into and data out of the device. It is an open drain terminal. Therefore, t he SDA bus r equires a pullup resistor t o V 400 kHz).

For normal data t ransfer SDA is all owed to change only during SCL LOW. Changes during SCL HIGH are reserved for indicating the START and STOP conditions.

CC (typical 10 kΩ for 100 k Hz , 2 kΩ for

24LC16B

8.2 Serial Clock (SCL)

This input is u sed t o sy nchron ize the d ata trans fer fro m and to the device.

8.3 Write-Protec t (W P)

This pin must be connected to either VSS or VCC. If tied to V

(read/write the entire memo ry If tied to V

entire memory will be w rite-prot ected. Read op erations are not affected.

This feature allows the user to use the 24LC16B as a serial ROM when WP is enabled (tied to V

SS normal memory operation is enabled

000-7FF).

CC, WRITE operations are inhibited. The

CC).

8.4 A0, A1, A2

These pins are not used by the 24LC16B. The y may be left floating or tied to either V

SS or VCC.

 2001 Microchip Technology Inc. DS20070M-page 11

Page 12

24LC16B

9.0 PACKAGING INFORMATION

9.1 Package Marking Information

8-Lead PDIP (300 mil)

XXXXXXXX XXXXXNNN

YYWW

8-Lead SOIC (150 mil)

XXXXXXXX XXXXYYWW

NNN

8-Lead TSSOP

XXXX

XYWW

NNN

Example:

24LC16B /PNNN

YYWW

Example:

24LC16B

SNYYWW

NNN

Example:

4L16

YWW

NNN

8-Lead MSOP

XXXXXX

YWWNNN

Legend: XX...X Customer specific information*

Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code

Note: In the event the full Microchip p art numb er ca nnot be mark ed on one l ine, it w ill

be carried over to the next line thus limiting the number of available cha rac ters for customer specific information.

* Standard PICmicro device marking consists of Microchip part number, year code, week code, and

traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.

Example:

4L16I

YWWNNN

DS20070M-page 12  2001 Microchip Technology Inc.

Page 13

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

24LC16B

Number of Pins Pitch Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018

Dimension Limits MIN NOM MAX MIN NOM MAX

Units INCHES* MILLIMETERS

n p

.008 .012 .015 0.20 0.29 0.38

.100 2.54

51015 51015 51015 51015

 2001 Microchip Technology Inc. DS20070M-page 13

Page 14

24LC16B

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

Number of Pins Pitch

Foot Angle Lead Thickness

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057

45×

n p

f c

α β

048048

MILLIMETERSINCHES*Units

1.27.050

MAXNOMMINMAXNOMMINDimension Limits

1.751.551.35.069.061.053AOverall Height

1.551.421.32.061.056.052A2Molded Package Thickness

0.250.180.10.010.007.004A1Standoff §

6.206.025.79.244.237.228EOverall Width

3.993.913.71.157.154.146E1Molded Package Width

5.004.904.80.197.193.189DOverall Length

0.510.380.25.020.015.010hChamfer Distance

0.760.620.48.030.025.019LFoot Length

0.250.230.20.010.009.008

0.510.420.33.020.017.013BLead Width 1512015120 1512015120

DS20070M-page 14  2001 Microchip Technology Inc.

Page 15

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

24LC16B

Number of Pins Pitch

Foot Angle Lead Thickne ss

Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086

n p

f c

α β

048048

MILLIMETERS*INCHESUnits

0.65.026

MAXNOMMINMAXNOMMINDimension Limits

1.10.043AOverall Height

0.950.900.85.037.035.033A2Molded Package Thickness

0.150.100.05.006.004.002A1Standoff §

6.506.386.25.256.251.246EOverall Width

4.504.404.30.177.173.169E1Molded Package Width

3.103.002.90.122.118.114DMolded Package Length

0.700.600.50.028.024.020LFoot Length

0.200.150.09.008.006.004

0.300.250.19.012.010.007BLead Wid th 10501050 10501050

 2001 Microchip Technology Inc. DS20070M-page 15

Page 16

24LC16B

8-Lead Plastic Micro Small Outline Package (MSOP)

n 1

MIN

.032 .002

.116 .116 .016

.005 .010

INCHES

NOM

.026 TYP.

.193 TYP.

.034

.118 .118 .022 .037.035FFootprint (Reference)

.006 .012

.043 .036 .006

.120 .120 .028

6 .007 .016

7 7

Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length

Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom

*Controlling Parameter Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

Units

n p

A A2 A1

E E1

MILLIMETERS*

MINMAX

0.81

0.05

2.95

0.40

0.13

0.25

NOM

0.65 TYP.

0.86

4.90 TYP.

3.00

0.55

0.15

0.30 7 7

MAX

1.10

0.91

0.15

3.05

0.70

1.000.950.90.039

0.18

0.40

DS20070M-page 16  2001 Microchip Technology Inc.

Page 17

24LC16B

ON-LINE SUPPORT

Microchip provides on-line support on the Microchip World Wide Web (WWW) site.

The web site is used b y Mic rochip as a me ans to m ake files and information easily available to customers. To view the site, the use r must have access to the Intern et and a web browser, such as Netscape Explorer. Files are also available for FTP download from our FTP site.

Connecting to the Microchip Internet Web Site

The Microchip web site is available by using your favorite Internet browser to attach to:

www.microchip.com

The file transfer site is available by using an FTP service to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User’s Guides, Articles and Sample Programs. A variety of Micr ochip specific bu siness informatio n is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked

Questions

• Design Tips

• Device Errata

• Job Postings

• Microchip Consultant Program Member Listing

• Links to other useful web sites related to

Microchip Products

• Conferences for prod ucts, D evelopment Systems, technical information and more

• Listing of seminars and events

or Microsoft

Systems Information and Upgrade Hot Line

The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive any currently available upgrade kits.The

Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world.

 2001 Microchip Technology Inc. DS20070M-page 17

Page 18

24LC16B

READER RESPONSE

It is our intentio n to pro vi de you with the best docume nt a tion possible to ensure succes sfu l u se of y ou r Mic r oc hip pro duct. If you wish to provid e your c omment s on org anizatio n, clarity, subject matter , and w ays in wh ich our d ocument ation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-7578.

Please list the following information, and use this outline to provide us with your comments about this Data Sheet.

To: RE: Read er Response

Technical Publications Manager

Total Pages Sent

From:

Application (optional): Would you like a reply? Y N

Device: Questions:

1. What are the best features of this docume nt?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this data sheet easy to follow? If not, why?

Name Company

Address City / State / ZIP / Country

Telephone: (_______) _________ - _________

24LC16B

Literature Number:

FAX: (______) _________ - _________

DS20070M

4. What additions to the data sheet do you think would enhance the structure and subject?

5. What deletions from the data sheet could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

8. How would you improve our software, systems, and silicon products?

DS20070M-page 18  2001 Microchip Technology Inc.

Page 19

NOTES:

24LC16B

 2001 Microchip Technology Inc. DS20070M-page 19

Page 20

24LC16B

NOTES:

DS20070M-page 20  2001 Microchip Technology Inc.

Page 21

NOTES:

24LC16B

 2001 Microchip Technology Inc. DS20070M-page 21

Page 22

24LC16B

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX

Device

PackageTemperature

Range

Device: 24LC16B: = 16 Kbit I2C Serial EEPROM

24LC16BT: = 16 Kbit I

Temperature Range:

Package: P = Plastic DIP (300 mil body), 8-lead

I=-40°C to +85°C E=-40°C to +125°C

SN = Plastic SOIC (150 mil body), 8-lead ST = Plastic TSSOP (4.4 mm), 8-lead MS = Plastic Micro Small Outline (MSOP), 8-lead

(Tape and Reel)

C Serial EEPROM

Examples:

a) 24LC16B-E/P: Extended Temp.,

PDIP package

b) 24LC16B-E/SN: Extended Temp.,

SOIC package

c) 24LC16BT - E/SN: Tape and Reel,

Extended Temp., SOIC package

d) 24LC16B-I/P: Industrial Temp.,

PDIP package

e) 24LC16B-I/SN: Industrial Temp.,

SOIC package

f) 24LC16BT-I/SN: Tape and Reel,

Industrial Temp., SOIC package

g) 24LC16B-I/ST: Industrial Temp.,

TSSOP package

h) 24LC16BT-I/ST: Tape and Reel,

Industrial Temp., TSSOP package

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. Fax: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

DS20070M-page 22  2001 Microchip Technology Inc.

Page 23

24LC16B

“All rights reserved. Copyright © 2001, Microchip Technology Incorporated, USA. Information contained in this publicat ion regarding d evice applica tions and the like is intended through suggestion only and may be superseded by updates . No rep resent ati on or wa rranty is given and no liabil ity is assume d by Microch ip Technology Incorpora ted with re spect to t he accuracy or use of such information, or inf ringement of paten ts or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual proper ty righ ts. The Mi croch ip log o and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other count ries. All rights reserve d. Al l ot her trademarks mentioned herein are the property of their respective companies. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.”

Trademarks

The Microchip name, logo, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, K

EELOQ,

SEEV AL, MPLAB and The Embedded Contr ol Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

Total Endurance, ICSP, In-Circuit Serial Programming, FilterLab, MXDEV, microID, FlexROM, fuzzyLAB, MPASM, MPLINK, MPLIB, PICDEM, ICEPIC, Migratable Memory, FanSense, ECONOMONITOR, Select Mode and microPort are trademarks of Microchip Technology Incorporated in the U.S.A.

Serialized Quick Term Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective compa ni es.

Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro

devices, Serial EEPROMs and microperipheral products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.

 2001 Microchip Technology Inc. DS20070M-page 23

8-bit MCUs, KEELOQ

code hopping

Page 24

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com

Rocky Mountain

2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456

Atlanta

500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307

Austin

Analog Product Sales 8303 MoPac Expressway North Suite A-201 Austin, TX 78759 Tel: 512-345-2030 Fax: 512-345-6085

Boston

2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821

Boston

Analog Product Sales Unit A-8-1 Millbrook Tarry Condominium 97 Lowell Road Concord, MA 01742 Tel: 978-371-6400 Fax: 978-371-0050

Chicago

333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075

Dallas

4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924

Dayton

Two Prestige Place, Suite 130 Miamisburg, OH 45342 Tel: 937-291-1654 Fax: 937-291-9175

Detroit

Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260

Los Angeles

18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338

Mountain View

Analog Product Sales 1300 Terra Bella Avenue Mountain View, CA 94043-1836 Tel: 650-968-9241 Fax: 650-967-1590

New York

150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335

San Jose

Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955

Toronto

6285 Northam Drive, Suite 108 Mississa uga, Ontario L4 V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFIC

Australia

Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

China - Beij ing

Microchip Technology Beijing Office Unit 915 New China Hong Kong Manhattan Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104

China - Shanghai

Microchip Technology Shanghai Office Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060

Hong Kong

Microchip Asia Pacific RM 2101, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431

India

Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122

ASIA/PACIFIC (continued)

Korea

Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934

Singapore

Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-334-8870 Fax: 65-334-8850

Taiwan

Microchip Technology Taiwan 11F-3 , No . 20 7 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

EUROPE

Denmark

Microchip Technology Denmark ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910

France

Arizona Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany

Arizona Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44

Germany

Analog Product Sales Lochhamer Strasse 13 D-82152 Martinsried, Germany Tel: 49-89-895650-0 Fax: 49-89-895650-22

Italy

Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883

United Kingdom

Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820

01/30/01

Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your respo nsibilit y to en sure t hat you r app licatio n mee ts with y our sp ecifica tions . No re presen tation or warra nty is given and n o liability is assumed by Micro chip Technology Incorporate d with re spect t o the accur acy or use of such infor mation, o r infrin gemen t of patents or other intellectua l property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellectual property righ ts. The Microchip lo go and name are registered tradema rks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.

DS20070M-page 24  2001 Microchip Technology Inc.