Datasheet 24AA08, 24LC08B Specification

24AA08/24LC08B

8K I2C™ Serial EEPROM

Device Selection Table

Part

Number

24AA08 1.7-5.5 400 kHz

24LC08B 2.5-5.5 400 kHz I, E

Note 1: 100 kHz for VCC <2.5V

VCC

Range

Max. Clock

Frequency

(1)

Temp.

Ranges

I

Features:

• Single supply with operation down to 1.7V for
24AA08 devices, 2.5V for 24LC08B dev i ces

• Low-power CMOS technology:

- Read current 1 mA, typical

- Standby current 1 μA, typical

• 2-wire serial interface, I2C™ compatible

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz and 400 kHz clock compatibility

• Page write time 3 ms, typical

• Self-timed erase/write cycle

• 16-byte page write buffer

• Hardware write-protect

• ESD protection >4,000V

• More than 1 million erase/write cycles

• Data retention >200 years

• Factory programming available

• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN, MSOP and 5-lead SOT-23

• Pb-free and RoHS compliant

• Temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Description:

The Microchip Technology Inc. 24AA08/24LC08B
(24XX08*) is a 8 Kbit Elec trically Erasable PROM . The
device is organized as four blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V, with standby
and active currents of only 1 μA and 1 mA,
respectively. The 24XX08 also has a page write
capability for up to 16 bytes of data. The 24XX08 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN and MSOP packages, and is
also available in the 5-lead SOT-23 package. All
packages are Pb-free and RoHS compliant.

Block Diagram

HV

Generator

EEPROM

Array

Page

Latches

YDEC

Sense Amp.
R/W Control

Control

Logic

I/O

SDA

V
VSS

CC

I/O

SCL

WP

Memory

Control

Logic

XDEC

Package Types

A0
A1
A2

V

SS

SOIC, TSSOP

1
2

3
4

8

CC

V

7

WP

6

SCL

5

SDA

PDIP, MSOP

1

A0

2

A1

3

A2

SS

4

V

8

VCC
WP

7

SCL

6

SDA

5

SOT-23-5

15

SCL

2

Vss

3

SDA

*24XX08 is used in this document as a generic part
number for the 24AA08/24LC08B devices.

© 2007 Microchip Technology Inc. DS21710G-page 1

Note: Pins A0, A1 and A2 are not used by the 24XX08. (No

internal connections).

WP

4

V

Vcc

A0
A1

A2

DFN

1
2

3

SS

4

CC

V

8

WP

7

SCL

6
5

SDA

24AA08/24LC08B

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

VCC.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-40°C to +125°C

ESD protection on all pins ......................................................................................................................................................≥ 4kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indica ted in the opera tional li stings of this sp ecification is not i mplied. Ex posure to maximum rating
conditions for extended periods may affect device reliability.

TABLE 1-1: DC CHARACTERISTICS

DC CHARACTERISTICS

Param.

No.

D1 V
D2 — High-level input voltage 0.7 VCC ——V—
D3 V
D4 VHYS Hysteresis of Schmitt

D5 V
D6 ILI Input leakage current ——±1μAVIN = .1V to VCC
D7 ILO Output leakage current ——±1μAVOUT = .1V to VCC
D8 CIN,

D9 ICC write Operating current —0.13mAVCC = 5.5V, SCL = 400 kHz
D10 I
D11 ICCS Standby current —

Note: This parameter is periodically sampled and not 100% tested.

Symbol Characteristic Min. Typ. Max. Units Conditions

IH WP, SCL and SDA pins — ————

IL Low-level input voltage — — 0.3 VCC V—

Trigger inputs

OL Low-level output voltage — — 0.40 V IOL = 3.0 mA, VCC = 2.5V

Pin capacitance

OUT

C

CC read — 0.05 1 mA —

(all inputs/outpu t s)

SS .........................................................................................................-0.3V to VCC +1.0V

(†)

V

CC = +1.7V to +5.5V

Industrial (I): T
Automotive (E): T

A = -40°C to +85°C
A = -40°C to +125°C

0.05 VCC ——V(Note)

——10pFVCC = 5.0V (Note)

A = 25°C, FCLK = 1 MHz

T

μA
μA

Industrial
Automotive

—

0.01
—

1
5

SDA = SCL = V
WP = VSS

CC

DS21710G-page 2 © 2007 Microchip Technology Inc.

24AA08/24LC08B

TABLE 1-2: AC CHARACTERISTICS

CC = +1.7V to +5.5V

V

AC CHARACTERISTICS

Param.

No.

1F

Symbol Characteristic Min. Typ. Max. Units Conditions

CLK Clock frequency —

2 THIGH Clock high time 600

3TLOW Clock low time 1300

4T

R SDA and SCL rise time

(Note 1)

5T

6T

F SDA and SCL fall time — —

HD:STA Start condition hold time 600

7TSU:STA Start condition setup

time

8T

9T

HD:DAT Data input hold time 0 —

SU:DAT Data input setup time 100

10 TSU:STO Stop condition setup

time

11 T

AA Output valid from clock

(Note 2)

12 TBUF Bus free time: Time the

bus must be free before
a new transmission can
start

13 TOF Output fall time from VIH

minimum to V

IL

maximum

14 T

SP Input filter spike

suppression
(SDA and SCL pins)

15 T

WC Write cycle time (byte or

page)
16 — Endurance 1M — — cycles 25°C, (Note 4)
Note 1: Not 100% tested. C

B = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combine d T

SP and VHYS specifications are due to new Schmit t Trigger inputs w h ic h p rov id e i mp rov ed

noise spike suppression. This eliminates the need for a

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specif ic

application, please co nsult the Total Endurance™ Model which can be obtained from Microchip’ s web site
at www.microchip.com.

Industrial (I): T
Automotive (E): T

—

4000

4700

—
—

A = -40°C to +85°C
A = -40°C to +125°C

—
—

—
—

—
—

—
—

400
100

—
—

—
—

300

1000

kHz 2.5V ≤ VCC ≤ 5.5V

1.7V ≤ V

ns 2.5V ≤ VCC ≤ 5.5V

1.7V ≤ V

ns 2.5V ≤ VCC ≤ 5.5V

1.7V ≤ V

ns 2.5V ≤ VCC ≤ 5.5V (Note 1)

1.7V ≤ V

(Note 1)

300 ns (Note 1)

—

4000

600

4700

—
—

—
—

—
—

—
—

ns 2.5V ≤ VCC ≤ 5.5V

1.7V ≤ V

ns 2.5V ≤ VCC ≤ 5.5V

1.7V ≤ V

—ns(Note 2)

—

250
600

4000

—
—

1300
4700

20+0.1C

—

—
—

—
—

—
—

—
—

—

B

—

—
—

—
—

900

3500

—
—

250
250

ns 2.5V ≤ VCC ≤ 5.5V

1.7V ≤ V

ns 2.5V ≤ VCC ≤ 5.5V

1.7V ≤ V

ns 2.5V ≤ VCC ≤ 5.5V

1.7V ≤ V

ns 2.5V ≤ VCC ≤ 5.5V

1.7V ≤ V

ns 2.5V ≤ V

1.7V ≤ V

— — 50 ns (Notes 1 and 3)

——5ms—

TI specification for standard operation.

CC < 2.5V (24AA08)

CC < 2.5V (24AA08)

CC < 2.5V (24AA08)

CC < 2.5V (24AA08)

CC < 2.5V (24AA08)

CC < 2.5V (24AA08)

CC < 2.5V (24AA08)

CC < 2.5V (24AA08)

CC < 2.5V (24AA08)

CC < 2.5V (24AA08)

CC ≤ 5.5V
CC < 2.5V (24AA08)

© 2007 Microchip Technology Inc. DS21710G-page 3

24AA08/24LC08B

FIGURE 1-1: BUS TIMING DATA

5

3

SCL

7

SDA

IN

SDA

OUT

14

6

FIGURE 1-2: BUS TIMING START/STOP

SCL

7

SDA

6

2

8

9

11

D4

4

10

12

10

Start Stop

DS21710G-page 4 © 2007 Microchip Technology Inc.

24AA08/24LC08B

)

2.0 FUNCTIONAL DESCRIPTION

The 24XX08 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX08 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.

3.0 BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus
is not busy.

• During data transfer, the data line must remain
stable wheneve r the c lock lin e is high . Changes i n
the data line while the clock line is high will be
interpreted as a Start or Stop condition.

Accordingly, the following bus conditions have been
defined (Figure 3-1).

3.1 Bus Not Busy (A)

Both data and clock lines remain high.

3.2 Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.

3.3 Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.

3.4 Data Valid (D)

The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.

The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.

Each data transfer is initiated with a S tart condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited, although only the last sixteen
will be stored when doing a write operation. When an
overwrite does occu r it will replac e data in a first-in first­out (FIFO) fashion.

3.5 Acknowledge

Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The ma ster devi ce m ust gener at e an ex tr a cloc k
pulse which is associated with this Acknowledge bit.

Note: The 24XX08 does not generate any

Acknowledge bits if an internal program­ming cycle is in progress.

The device that acknowledges, has to pull down the
SDA line during the ackn owledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the sla ve by no t gene rating a n Ack nowl edge b it
on the last byte that has be en c loc ke d ou t of th e sl av e.
In this case, the sl ave (24 XX08) will leave the data lin e
high to enable the master to generate the Stop
condition.

FIGURE 3-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS

SCL

SDA

© 2007 Microchip Technology Inc. DS21710G-page 5

(A) (B) (D) (D) (A

Start

Condition

Address or

Acknowledge

Valid

Data

Allowed

to Change

(C)

Stop

Condition

24AA08/24LC08B

3.6 Device Addressing

A control byte is the first byte received following the
Start condition from the master device (Figure 3-2).
The control byte co nsi sts of a four-bit control cod e. For
the 24XX08, this is set as ‘
write operations. The ne xt th ree bits of the control byte
are the block-select bits (B2, B1, B0). B2 is a “don’t
care” for the 24XX08. They are used by the master
device to select which of the four 256 word-blocks of
memory are to be access ed. These bits are in effect the
three Most Significant bits of the word address.

The last bit of the control byte defines the operation to
be performed. When set to ‘
selected. When set to ‘
Following the Start condition, the 24XX08 monitors the
SDA bus, checking the device type identifier being
transmitted and, upon receiving a ‘
slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX08 will select a read or write operation.

Operation

Read
Write

Control

Code

1010

1010

1010’ binary for read and

1’ a read operation is

0’ a write operation is selected.

1010’ code, the

Block Select R/W

Block Address
Block Address

1

0

FIGURE 3-2: CONTROL BYTE

ALLOCATION

Read/Write

Block

Control Code

10 10

S

Start Bit

x = “don’t care”

Slave Address

Select

Bits

x B1 B0

Acknowledge Bit

R/W

Bit

ACK

DS21710G-page 6 © 2007 Microchip Technology Inc.

24AA08/24LC08B

4.0 WRITE OPERATION

4.1 Byte Write

Following the Start condition from the master, the
device code (4 bits), the block address (3 bits) and the
R/W bit, which is a logic-low, is placed onto the bus by
the master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow once it has generated an Ack nowledge bit d uring
the ninth clock cycl e. Therefore, th e next byte trans mit­ted by the master is the word address and will be
written into the Address Pointer of the 24XX08. After
receiving another Acknowledge signal from the
24XX08, the master device will transmit the data word
to be written into the addressed memory location. The
24XX08 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and, during this time, the 24XX08 will not
generate Acknowledge signals (Figure 4-1).

4.2 Page Write

The write control byte, word address and the first data
byte are transmitted to the 24 XX08 in th e same w ay a s
in a byte write. However, instead of generating a Stop
condition, the master transmits up to 16 data bytes to
the 24XX08, which are temporarily stored in the on­chip page buffer and will be written into memory once
the master has transmitted a Stop condition. Upon
receipt of each word, the four lower-order Address
Pointer bits are internally incremented by ‘
higher-order 7 bits of the word address remain
constant. If the master should transmit more than 16
words prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwri tten. As w ith the by te writ e
operation, once the Stop condition is received an
internal write cycle will begin (Figure 4-2).

Note: Page write operations are limite d to writin g

bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buf fer size (or
‘page-size’) and end a t ad dresses that a re
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might b e
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.

1’. The

FIGURE 4-1: BYTE WRITE

Bus Activity
Master

SDA Line

Bus Activity

S
T
A
R
T

101

S P

x = “don’t care”

Control

Byte

0XB1

Block

Select

Bits

B0 0

Word

Address

A
C
K

A
C
K

Data

S
T
O
P

A
C
K

FIGURE 4-2: PAGE WRITE

S
Bus Activity
Master

SDA Line

Bus Activity

x = “don’t care”

© 2007 Microchip Technology Inc. DS21710G-page 7

T

Control

A

Byte

R

T

B0

1

S P

B1

0X

1

0

0

Block

Select

Bits

Address (n)

A
C
K

Word

Data (n) Data (n + 15)

A
C
K

Data (n + 1)

A
C
K

A
C
K

S
T
O
P

A
C
K

24AA08/24LC08B

5.0 ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issu ed from the mas ter , the device
initiates the int ernally-timed wri te cycle and ACK pol ling
can then be initiated immediately. This involves the
master sending a S tart c ondition fo llowed by t he contro l
byte for a Write c ommand (R/W
busy with the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the master can then proceed with the next Read or
Write command. See Figure 5-1 for a flow diagram of
this operation.

FIGURE 5-1: ACKNOWLEDGE POLLING

FLOW

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

= 0). If the device is still

6.0 WRITE PROTECTION

The WP pin a llows t he user to wri te-prot ect the entire
array (000-3FF) when the pin is tied to V
tied to V

SS the write protection is disabled.

CC. If the pin is

Send Start

Send Control Byte

with R/W

Did Device

Acknowledge

(ACK = 0)?

= 0

Yes

Next

Operation

No

DS21710G-page 8 © 2007 Microchip Technology Inc.

24AA08/24LC08B

7.0 READ OPERATION

Read operations are initiated in the same way as write
operations, with the exception that the R/W
slave address is set to ‘
of read operations: current addr ess read , rand om rea d
and sequential read.

1’. There are three basic types

7.1 Current Address Read

The 24XX08 contains an address counter that main­tains the address of the last word accessed, internally
incremented by ‘
(either a read or write operation) was to address
next current address read operati on would access da ta
from address
with R/W
edge and transmits the 8-b it data w ord. The master will
not acknowledge the tra nsfer , but does generate a Stop
condition and the 24XX08 discontinues transmission
(Figure 7-1).

bit set to ‘1’, the 24XX08 issues an acknowl-

1’. Therefore, if the previous access

n + 1. Upon receipt o f the slave addres s

7.2 Random Read

Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operatio n, th e w ord add ress m us t firs t
be set. This is accomplished by sending the word
address to the 24XX08 as part of a write operation.
Once the word address is sent , the master ge nerates a
Start condition following the acknowledge. This
terminates the write operation, but not before the
internal Address Pointe r is se t. The m aster th en issue s
the control byte again, but with the R/W
The 24XX08 will then i ssue an ack nowledge a nd trans­mit the 8-bit data word. The master will not acknowl­edge the transfer, but does generate a Stop condition
and the 24XX08 will discontinue transmission
(Figure 7-2).

bit of the

n, the

bit set to a ‘1’.

7.3 Sequential Read

Sequential reads are initiated in the same way as a
random read, except that once the 24XX08 transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24XX08 to transmit the next sequentially­addressed 8-bit word (Figure 7-3).

To provide se quential read s, the 24XX08 co ntains an
internal Address Pointer that is incremented by one
upon completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.

7.4 Noise Protection

The 24XX08 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the V
is below 1.5V at nominal conditions.

The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.

CC

FIGURE 7-1: CURRENT ADDRESS READ

S

Bus Activity
Master

SDA Line

Bus Activity

x = “don’t care”

© 2007 Microchip Technology Inc. DS21710G-page 9

T
A
R

T

1

SP

01

Control

Byte

x

0

B1 B0

Block

Select

Bits

S

Data (n)

1

A
C
K

T
O
P

N
o

A
C
K

24AA08/24LC08B

FIGURE 7-2: RANDOM READ

S
Bus Activity
Master

SDA Line

Bus Activity

x = “don’t care”

T

Control

A

Byte

R

T

B0

010

1

S P

B1

X

01

Block

Select

Bits

FIGURE 7-3 : SEQUENTIAL READ

Bus Activity
Master

SDA Line

Bus Activity

Control

Byte

Data (n) Data (n + 1) Data (n + 2) Data (n + X)

1

A
C
K

Address (n)

A
C
K

A
C
K

Word

S
T

Control

A

Byte

R
T

B0

B1

1

0

0

S

A
C
K

A
C
K

X

Block

Select

Bits

Data (n)

1

A
C
K

A
C
K

S
T
O
P

N
o

A
C
K

S
T
O
P

P

N

o

A
C
K

DS21710G-page 10 © 2007 Microchip Technology Inc.

24AA08/24LC08B

8.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 8-1.

TABLE 8-1: PIN FUNCTION TABLE

Name PDIP SOIC TSSOP DFN MSOP SOT-23 Description

A0 1 1 1 1 1 — Not Connected
A1 2 2 2 2 2 — Not Connected
A2 3 3 3 3 3 — Not Connected

SS 4 4 4 4 4 2 Ground

V
SDA 5 5 5 5 5 3 Serial Address/Data I/O
SCL 6 6 6 6 6 1 Serial Clock

WP 7 7 7 7 7 5 Write-Protect Input

CC 8 8 8 8 8 4 +1.7V to 5.5V Power Supply

V

8.1 Serial Address/Data Input/Output
(SDA)

SDA is a bidirectional pin used to transfer addresses
and data into and out of the de vice . Sinc e it i s an open­drain terminal, the SDA bus requires a pull-up resistor

CC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz).

to V
For normal data transfer, SDA is allowed to change

only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.

8.2 Serial Clock (SCL)

The SCL input is used to sync hro ni ze th e da t a tra ns fer
to and from the device.

8.3 Write-Protect (WP)

The WP pin must be connected to either VSS or VCC.
If tied to V

(read/write the entire memory 000-03FF).
If tied to V

memory will be write-protected. Read operations are
not affected.

This feature allows the user to use the 24XX08 as a
serial ROM when WP is enabled (tied to V

SS, normal memory operation is enabled

CC, write operations are inhibited. The entire

CC).

8.4 A0, A1, A2

The A0, A1 and A2 pins are not used by the 24XX08.
They may be left floating or tied to either V

SS or VCC.

© 2007 Microchip Technology Inc. DS21710G-page 11

24AA08/24LC08B

9.0 PACKAGING INFORMATION

9.1 Package Marking Information

8-Lead PDIP (300 mil)

XXXXXXXX
T/XXXNNN

YYWW

8-Lead SOIC (3.90 mm)

XXXXXXXX

T/XXYYWW

NNN

8-Lead TSSOP

XXXX

TYWW

NNN

Example:

24LC08B
I/P 13F

3

e

0527

Example:

24LC08BI

3

e

SN 0527

13F

Example:

4L08

I527

13F

8-Lead MSOP

XXXXXT

YWWNNN

5-Lead SOT-23

XXNN M43F

8-Lead 2x3 DFN

XXX

YWW

NN

Example:

Example:

4L18BI

52713F

Example:

244

527

13

DS21710G-page 12 © 2007 Microchip Technology Inc.

1st Line Marking

24AA08/24LC08B

Part No. TSSOP MSOP

24AA08 4A08 4A08T B4NN — 241 —

24LC08B 4L08 4L2BT M4NN N4NN 244 245

Legend: XX...X Part number or part number code

T Temperature (I, E)
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

3

e

Note: For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

3

e

Note: In the event the full Microchip part num ber cann ot be marked on one lin e, it will

be carried over to the next line, thus limiting the number of available
character s for customer-specific information.

SOT-23 DFN

I-Temp E-Temp I-Temp E-Temp

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

© 2007 Microchip Technology Inc. DS21710G-page 13

24AA08/24LC08B

8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]

N

1
2
3
4

B

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

N

otes:

. Pin 1 visual index feature may vary, but must be located with the hatched area.
. § Significant Characteristic.
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

NOTE 1

E1

12

A

A1

b1

b

Number of Pins N 8
Pitch e .100 BSC
Top to Seating Plane A – – .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 – –
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB – – .430

3

D

L

e

Units INCHES

Dimension Limits MIN NOM MAX

E

A2

c

eB

Microchip Technology Drawing C04-018

DS21710G-page 14 © 2007 Microchip Technology Inc.

8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

B

http://www.microchip.com/packaging

D

e

N

E

E1

NOTE 1

12 3

b

h

24AA08/24LC08B

h

α

φ

A

A1

A2

L

L1

β

c

Units MILLIMETERS

Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 1.27 BSC
Overall Height A – – 1.75
Molded Package Thickness A2 1.25 – –
Standoff

§

A1 0.10 – 0.25
Overall Width E 6.00 BSC
Molded Package Width E1 3.90 BSC
Overall Length D 4.90 BSC
Chamfer (optional) h 0.25 – 0.50
Foot Length L 0.40 – 1.27
Footprint L1 1.04 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.17 – 0.25
Lead Width b 0.31 – 0.51
Mold Draft Angle Top α 5° – 15°
Mold Draft Angle Bottom β 5° – 15°

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-057

© 2007 Microchip Technology Inc. DS21710G-page 15

24AA08/24LC08B

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

N

1
2
3

B

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

12

b

e

c

A

A1

Number of Pins N 8
Pitch e 0.65 BSC
Overall Height A – – 1.20
Molded Package Thickness A2 0.80 1.00 1.05
Standoff A1 0.05 – 0.15
Overall Width E 6.40 BSC
Molded Package Width E1 4.30 4.40 4.50
Molded Package Length D 2.90 3.00 3.10
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.09 – 0.20
Lead Width b 0.19 – 0.30

otes:

. Pin 1 visual index feature may vary, but must be located within the hatched area.
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

A2

L1

Units MILLIMETERS

Dimension Limits MIN NOM MAX

L

φ

Microchip Technology Drawing C04-086

DS21710G-page 16 © 2007 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

B

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

2

1

e

24AA08/24LC08B

b

A

A1

Number of Pins N 8
Pitch e 0.65 BSC
Overall Height A – – 1.10
Molded Package Thickness A2 0.75 0.85 0.95
Standoff A1 0.00 – 0.15
Overall Width E 4.90 BSC
Molded Package Width E1 3.00 BSC
Overall Length D 3.00 BSC
Foot Length L 0.40 0.60 0.80
Footprint L1 0.95 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.08 – 0.23
Lead Width b 0.22 – 0.40

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

A2

Dimension Limits MIN NOM MAX

c

L1

Units MILLIMETERS

Microchip Technology Drawing C04-111

φ

L

© 2007 Microchip Technology Inc. DS21710G-page 17

24AA08/24LC08B

5-Lead Plastic Small Outline Transistor (OT or CT) [SOT -23]

N

1
2

B

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

N

1

A

A1

2

e

e1

D

b

E

E1

3

A2

c

L

L1

φ

Units MILLIMETERS

Dimension Limits MIN NOM MAX
Number of Pins N 5
Lead Pitch e 0.95 BSC
Outside Lead Pitch e1 1.90 BSC
Overall Height A 0.90 – 1.45
Molded Package Thickness A2 0.89 – 1.30
Standoff A1 0.00 – 0.15
Overall Width E 2.20 – 3.20
Molded Package Width E1 1.30 – 1.80
Overall Length D 2.70 – 3.10
Foot Length L 0.10 – 0.60
Footprint L1 0.35 – 0.80
Foot Angle φ 0° – 30°
Lead Thickness c 0.08 – 0.26

otes:

. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Lead Width b 0.20 – 0.51

Microchip Technology Drawing C04-091

DS21710G-page 18 © 2007 Microchip Technology Inc.

24AA08/24LC08B

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]

N

1
2
3
4

B

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

L

b

K

E

EXPOSED PAD

NOTE 1

2

1

TOP VIEW

A

A3 A1

Number of Pins N 8
Pitch e 0.50 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Length D 2.00 BSC
Overall Width E 3.00 BSC
Exposed Pad Length D2 1.30 – 1.75
Exposed Pad Width E2 1.50 – 1.90
Contact Width b 0.18 0.25 0.30
Contact Length L 0.30 0.40 0.50
Contact-to-Exposed Pad K 0.20 – –

otes:

. Pin 1 visual index feature may vary, but must be located within the hatched area.
. Package may have one or more exposed tie bars at ends.
. Package is saw singulated.
. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

NOTE 2

Units MILLIMETERS

Dimension Limits MIN NOM MAX

e

N

E2

1

2

D2

BOTTOM VIEW

Microchip Technology Drawing C04-123

NOTE 1

© 2007 Microchip Technology Inc. DS21710G-page 19

24AA08/24LC08B

APPENDIX A: REVISION HISTORY

Revision C

Corrections to Section 1.0, Electrical Characteristics.
Section 9.1, 24LC08B standard marking code.

Revision D

Added DFN package.

Revision E

Revised Figure 3-1: Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 C urrent Address Read ; Figure 7­2 Random Read; Figure 7-3 Sequential Read; 8.3
Write-Protect (000-3FF).

Revision F (02/2007)

Updated Device Selection Table; Features section;
Changed 1.8V to 1.7V throughout document; Revised
Electrical Characteristics Ambient Temperature;
Replaced Package Drawings; Revised Product ID
System.

Revison G (02/2007)

Replaced Package Drawings.

DS21710G-page 20 © 2007 Microchip Technology Inc.

24AA08/24LC08B

THE MICROCHIP WEB SITE

Microchip provides onlin e support v ia our W WW site at
www.m ic roc hi p.c om . Thi s web si te i s us ed as a m ean s
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:

• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, lat est softwa re releases and archived
software

• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultan t
program member listing

• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of s eminars and events, listings of
Microchip sales offices, distributors and factory
representatives

CUSTOMER CHANGE NOTIFICATION SERVICE

CUSTOMER SUPPORT

Users of Microchip products can receive assistance
through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line
Customers should contact their distributor,

representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.

T echnic al support is avail able throug h the web si te
at: http://support.microchip.com

Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified produ ct family or develo pment tool of inte rest.

To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.

© 2007 Microchip Technology Inc. DS21710G-page 21

24AA08/24LC08B

READER RESPONSE

It is our intentio n to pro vi de you with the best documentation possible to ens ure suc c es sfu l u se of y ou r M ic roc hip prod­uct. If you wish to provid e your c omment s on org anizatio n, clarity, subject matter , and ways in w hich o ur document atio n
can better serve you, please FAX your comments to the Technical Publications Manager at [phone].

Please list the following information, and use this outline to provide us with your comments about this document.

To:
RE: Reader Response
From:

Application (optional):
Would you like a reply? Y N

Device: Literature Number:
Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

Technical Publications Manager

Name
Company

Address
City / State / ZIP / Country

Telephone: (_______) _________ - _________

Total Pages Sent ________

FAX: (______) _________ - _________

DS21710G24AA08/24LC08B

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21710G-page 22 © 2007 Microchip Technology Inc.

24AA08/24LC08B

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX

Device

PackageTemperature

Range

Device: 24AA08: = 1.7V, 8 Kbit I2C Serial EEPROM

24AA08T: = 1.7V, 8 Kbit I

24LC08B: = 2.5V, 8 Kbit I
24LC08BT: = 2.5V, 8 Kbit I

Temperature
Range:

Package: P = Plastic DIP (300 mil body), 8-lead

I = -40°C to +85°C
E = -40°C to +125°C

SN = Plastic SOIC (3.90 mm body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MC = 2x3 DFN, 8-lead
MS = Plastic Micro Small Outline (MSOP), 8-lead
OT = SOT-23, 5-lead (Tape and Reel only)

(Tape and Reel)

(Tape and Reel)

2

C Serial EEPROM

2

C Serial EEPROM

2

C Serial EEPROM

Examples:

a) 24AA08-I/P: Industrial Temperature,1.7V,

PDIP package

b) 24AA08-I/SN : Industrial Temperature,1.7V,

SOIC package

c) 24AA08T-I/OT: Industrial Temperature,

1.7V, SOT-23 package, Tape and Reel

d) 24LC08B-I/P: Industrial T emperature, 2.5V,

PDIP package

e) 24LC08B-E/SN: Automotive Temp.,2.5V

SOIC package

f) 24LC08BT-I/OT: Industrial Temperature,

2.5V, SOT-23 package, Tape and Reel

© 2007 Microchip Technology Inc. DS21710G-page 23

24AA08/24LC08B

NOTES:

DS21710G-page 24 © 2007 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and t he lik e is provided only for your convenience
and may be su perseded by updat es . It is y our responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life supp ort and/or safety ap plications is entir ely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless M icrochip from any and all dama ges, claims,
suits, or expenses re sulting from such use. No licens es are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

EELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, Pow e rTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.

SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC
MCUs and dsPIC® DSCs, KEELOQ
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.

®

code hopping devices, Serial

© 2007 Microchip Technology Inc. DS21710G-page 25

®

WORLDWIDE SALES AND SERVICE

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12/08/06

DS21710G-page 26 © 2007 Microchip Technology Inc.