Datasheet 227c256 Datasheet

Page 1
May 2001
FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
General Description
The FM27C256 is a 256K Electrically Programmable Read Only Memory. It is manufactured in Fairchild’s latest CMOS split gate EPROM technology which enables it to operate at speeds as fast as 90 ns access time over the full operating range.
The FM27C256 provides microprocessor-based systems exten­sive storage capacity for large portions of operating system and application software. Its 90 ns access time provides high speed operation with high-performance CPUs. The FM27C256 offers a single chip solution for the code storage requirements of 100% firmware-based equipment. Frequently-used software routines are quickly executed from EPROM storage, greatly enhancing system utility.
The FM27C256 is configured in the standard EPROM pinout which provides an easy upgrade path for systems which are currently using standard EPROMs.
Block Diagram
V
CC
GND
V
PP
OE
CE/PGM
Output Enable
and Chip Enable Logic
The FM27C256 is one member of a high density EPROM Family which range in densities up to 4 Mb.
Features
■ High performance CMOS —90, 120, 150 ns access time
■ JEDEC standard pin configuration — 32-pin PLCC package — 28-pin CERDIP package
■ Drop-in replacement for 27C256 or 27256
■ Manufacturer’s identification code
Data Outputs O0 - O
Output Buffers
7
A0 - A Address
Inputs
© 2001 Fairchild Semiconductor Corporation
FM27C256 Rev. A
1
. . . . . . . . .
Y Gating
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Y Decoder
14
X Decoder
Page 2
Connection Diagrams
27C040 27C040
XX/V
A
16
A
15
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O
0
O
1
O
2
GND
Note: Compatible EPROM pin configurations are shown in the blocks adjacent to the FM27C256 pins.
27C512 27C512
27C010 27C010
XX/V
PP
PP
A
16
A
15
A
12
A A A A A A A A O O O
GND
7 6 5 4 3 2 1 0 0 1 2
A
15
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
O O O
GND
V
PP
A
12 A
A A A A A A A
O
0
O
1
O
2
GND
FM27C256
1 2 3
7
4
6
5
5
6
4
7
3
8
2
9
1
10
0
11
0
12
1
13
2
14
DlP
28
V
CC
27
A
14
26
A
13
25
A
8
24
A
9
23
A
11
22
OE
21
A
10
20
CE/PGM
19
O
7
18
O
6
17
O
5
16
O
4
15
O
3
V
CC
A
14
A
13
A
8
A
9
A
11
OE/V
PP
A
10
CE/PGM
O
7
O
6
O
5
O
4
O
3
V
CC
XX/PGM
XX
A
14
A
13
A
8
A
9
A
11
OE
A
10
CE
O
7
O
6
O
5
O
4
O
3
V
CC
A
18
A
17
A
14
A
13
A
8
A
9
A
11
OE
A
10
CE/PGM
O
7
O
6
O
5
O
4
O
3
FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
Commercial Temp. Range (0°C to +70°C)
VCC = 5V ±10%
Parameter/Order Number Access Time (ns)
FM27C256 Q, V 90 90
FM27C256 Q, V 120 120
FM27C256 Q, V 150 150
Extended Temp. Range (-40°C to +85°C)
VCC = 5V ±10%
Parameter/Order Number Access Time (ns)
FM27C256 QE, VE 90 90
FM27C256 QE, VE 120 120
FM27C256 QE, VE 150 150
Package Types: FM27C256 Q, V XXX
Q = Quartz-Windowed Ceramic DIP V = Surface-Mount PLCC
• All Packages conform to the JEDEC standard.
• All versions are guaranteed to function for slower speeds.
Pin Names
Symbol Description
A0–A14 Addresses
CE/PGM Chip Enable/Program
OE Output Enable
O0–O7 Outputs
XX Don’t Care (during Read)
PLCC
VCCA14A
13
29 28 27 26 25 24 23 22 21
A A A A A A A
XX
O
A7A12VPPXX
4 3 2 1 32 31 30
5
6
6
5
7
4
8
3
9
2
10
1
11
0
12 13
0
14 15 16 17 18 19 20
A
8
A
9
A
11
XX OE A
10
CE/PGM O
7
O
6
FM27C256 Rev. A
GND
XX
3O4O5
O
O1O
2
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2
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FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
Absolute Maximum Ratings (Note 1)
Storage Temperature -65°C to +150°C
ESD Protection > 2000V
All Output Voltages with
Respect to Ground VCC + 1.0V to GND -0.6V
All Input Voltages except A9 with
Respect to Ground -0.6V to +7V
VPP and A9 with Respect
to Ground -0.7V to +14V
VCC Supply Voltage with
Respect to Ground -0.6V to +7V
Operating Range
Range Temperature V
Comm’l0°C to +70°C +5V ±10%
Industrial -40°C to +85°C +5V ±10%
Read Operation
DC Electrical Characteristics Over Operating Range with V
Symbol Parameter Test Conditions Min Max Units
V
IL
V
IH
V
OL
V
OH
I
SB1
(Note 11) (CMOS)
I
SB2
I
CC1
I
PP
V
PP
I
LI
I
LO
Input Low Level -0.5 0.8 V
Input High Level 2.0 VCC +1 V
Output Low Voltage IOL = 2.1 mA 0.4 V
Output High Voltage IOH = -2.5 mA 3.5 V
VCC Standby Current CE = VCC ±0.3V 100 µA
VCC Standby Current (TTL) CE = V
IH
VCC Active Current CE = OE = VIL,f=5 MHz 35 mA TTL Inputs Inputs = VIH or VIL, I/O = 0 mA
VPP Supply Current VPP = V
CC
VPP Read Voltage VCC - 0.7 V
Input Load Current VIN = 5.5V or GND -1 1 µA
Output Leakage Current V
= 5.5V or GND -10 10 µA
OUT
PP
= V
CC
1mA
10 µA
CC
CC
V
AC Electrical Characteristics Over Operating Range with V
PP
= V
CC
Symbol Parameter 90 120 150 Units
Min Max Min Max Min Max
t
ACC
t
CE
t
OE
t
DF
(Note 2) Output Float
t
OH
(Note 2) Addresses,
Capacitance (Note 2) T
Address to Output Delay
90 120 150 ns
CE to Output Delay 90 120 150
OE to Output Delay 35 50 50
Output Disable to 30 35 45
Output Hold from 0 0 0
CE or OE, Whichever Occurred First
= +25˚C, f = 1 MHz
A
Symbol Parameter Conditions Typ Max Units
C
IN
C
OUT
Input Capacitance VIN = 0V 6 12 pF
Output Capacitance V
= 0V 9 12 pF
OUT
FM27C256 Rev. A
3
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AC Test Conditions
Output Load 1 TTL Gate and CL = 100 pF (Note 8)
Input Rise and Fall Times ≤ 5 ns
Input Pulse Levels 0.45 to 2.4V
Timing Measurement Reference Level (Note 10)
Inputs 0.8V and 2.0V Outputs 0.8V and 2.0V
AC Waveforms (Note 6) (Note 7) (Note 9)
FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
OUTPUT
CE
OE
2.0V
0.8V
2.0V
0.8V
2.0V
0.8V
2.0V
0.8V
ADDRESSES VALID
t
CE
t
OE
(Note 3)
t
ACC
(Note 3)
VALID OUTPUT
t
OH
t
CE
(Notes 4, 5)
t
DF
(Notes 4, 5)
Hi-ZHi-Z
ADDRESSES
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 2: This parameter is only sampled and is not 100% tested. Note 3: OE may be delayed up to t Note 4: The tDF and tCF compare level is determined as follows:
High to TRI-STATE®, the measured V Low to TRI-STATE, the measured V
- tOE after the falling edge of CE without impacting t
ACC
(DC) - 0.10V;
OH1
(DC) + 0.10V.
OL1
ACC
.
Note 5: TRI-STATE may be attained using OE or CE. Note 6: The power switching characteristics of EPROMs require careful device decoupling. It is recommended that at least a 0.1 µF ceramic capacitor be used on every device
between VCC and GND.
Note 7: The outputs must be restricted to VCC + 1.0V to avoid latch-up and device damage. Note 8: TTL Gate: IOL = 1.6 mA, IOH = -400 µA.
CL = 100 pF includes fixture capacitance.
Note 9: VPP may be connected to VCC except during programming. Note 10: Inputs and outputs can undershoot to -2.0V for 20 ns Max. Note 11: CMOS inputs: VIL = GND ±0.3V, VIH = VCC ±0.3V.
FM27C256 Rev. A
4
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Programming Characteristics (Note 12) (Note 13) (Note 14) (Note 15)
Symbol Parameter Conditions Min Typ Max Units
t t t
V
V
t
t
AS
OES
VPS
VCS
t
DS
t
AH
t
DH
t
DF
t
PW
t
OE
I
PP
I
CC
T
CC
PP
t
FR
V V
t
IN
OUT
A
IL
IH
Address Setup Time 1 µs OE Setup Time 1 µs VPP Setup Time 1 µs VCC Setup Time 1 µs Data Setup Time 1 µs Address Hold Time 0 µs Data Hold Time 1 µs Output Enable to Output CE = V
IL
060ns
Float Delay Program Pulse Width 45 50 105 µs Data Valid from OE CE = V VPP Supply Current CE = V
during Programming Pulse
IL
IL
100 ns
30 mA
VCC Supply Current 50 mA Temperature Ambient 20 25 30 °C Power Supply Voltage 6.25 6.5 6.75 V Programming Supply Voltage 12.5 12.75 13.0 V Input Rise, Fall Time 5 ns Input Low Voltage 0.0 0.45 V Input High Voltage 2.4 4.0 V Input Timing Reference Voltage 0.8 2.0 V Output Timing Reference Voltage 0.8 2.0 V
FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
Programming Waveforms (Note 14)
t
OE
PROGRAM
VERIFY
DATA OUT VALID
ADD N
t
AH
t
DF
PROGRAM
DATA
V
V
CE
OE
2.0V
0.8V
2.0V
0.8V
5.25V
CC
12.75V
PP
2.0V
0.8V
2.0V
0.8V
t
AS
DATA IN STABLE
t
DS
t
VCS
t
VPS
ADD N
t
ADDRESS N
t
DH
t
PW
OES
ADDRESSES
Note 12: Fairchild’s standard product warranty applies to devices programmed to specifications described herein. Note 13: VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. The EPROM must not be inserted into or removed from a board with
voltage applied to VPP or VCC. Note 14: The maximum absolute allowable voltage which may be applied to the VPP pin during programming is 14V. Care must be taken when switching the VPP supply to
prevent any overshoot from exceeding this 14V maximum specification. At least a 0.1 µF capacitor is required across VPP, VCC to GND to suppress spurious voltage transients which may damage the device.
Note 15: During power up the PGM pin must be brought high (≥ VIH) either coincident with or before power is applied to VPP.
FM27C256 Rev. A
5
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Page 6
Turbo Programming Algorithm Flow Chart
VCC = 6.5V VPP = 12.75V
n = 0
ADDRESS = FIRST LOCATION
PROGRAM ONE 50µs PULSE
INCREMENT n
NO
FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
DEVICE
FAILED
YES
n = 10?
INCREMENT
ADDRESS
FAIL
VERIFY
BYTE
PASS
LAST
ADDRESS
NO
?
YES
ADDRESS = FIRST LOCATION
VERIFY
FAIL
BYTE
PASS
LAST
NO
ADDRESS
?
YES
INCREMENT
ADDRESS
n = 0
PROGRAM ONE
50 µs
PULSE
CHECK ALL BYTES
= VPP = 6.0V
1ST: V
CC
2ND: V
Note: The standard National Semiconductor algorithm may also be used but it will have longer programming time.
= VPP = 4.3V
CC
FIGURE 1.
6
FM27C256 Rev. A
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FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
Functional Description
DEVICE OPERATION
The six modes of operation of the EPROM are listed in Table 1. It should be noted that all inputs for the six modes are at TTL levels. The power supplies required are V supply must be at 12.75V during the three programming modes, and must be at 5V in the other three modes. The V must be at 6.5V during the three programming modes, and at 5V in the other three modes.
Read Mode
The EPROM has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (CE/PGM) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (t available at the outputs t that CE/PGM has been low and addresses have been stable for at least t
) is equal to the delay from CE to output (tCE). Data is
ACC
ACC
–tOE.
after the falling edge of OE, assuming
OE
Standby Mode
The EPROM has a standby mode which reduces the active power dissipation by over 99%, from 385 mW to 0.55 mW. The EPROM is placed in the standby mode by applying a CMOS high signal to the CE/PGM input. When in standby mode, the outputs are in a high impedance state, independent of the OE input.
Output Disable
The EPROM is placed in output disable by applying a TTL high signal to the OE input. When in output disable all circuitry is enabled, except the outputs are in a high impedance state (TRI­STATE).
Output OR-Typing
Because the EPROM is usually used in larger memory arrays, Fairchild has provided a 2-line control function that accommo­dates this use of multiple memory connections. The 2-line control function allows for:
1. the lowest possible memory power dissipation, and
2. complete assurance that output bus contention will not occur.
To most efficiently use these two control lines, it is recommended that CE/PGM be decoded and used as the primary device select­ing function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low power standby modes and that the output pins are active only when data is desired from a particular memory device.
Programming
CAUTION: Exceeding 14V on pin 1 (VPP) will damage the EPROM.
Initially, and after each erasure, all bits of the EPROM are in the “1’s” state. Data is introduced by selectively programming “0’s” into the desired bit locations. Although only “0’s” will be pro­grammed, both “1’s” and “0’s” can be presented in the data word. The only way to change a “0” to a “1” is by ultraviolet light erasure.
and VPP. The VPP power
CC
power supply
CC
The EPROM is in the programming mode when the VPP power supply is at 12.75V and OE is at V
0.1 µF capacitor be placed across V spurious voltage transients which may damage the device. The data to be programmed is applied 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL.
When the address and data are stable, an active low, TTL program pulse is applied to the CE/PGM input. A program pulse must be applied at each address location to be programmed. The EPROM is programmed with the Turbo Programming Algorithm shown in Figure 1. Each Address is programmed with a series of 50 µs pulses until it verifies good, up to a maximum of 10 pulses. Most memory cells will program with a single 50 µs pulse. (The standard National Semiconductor Algorithm may also be used but it will have longer programming time.)
The EPROM must not be programmed with a DC signal applied to the CE/PGM input.
Programming multiple EPROM in parallel with the same data can be easily accomplished due to the simplicity of the programming requirments. Like inputs of the parallel EPROM may be connected together when they are programmed with the same data. A low level TTL pulse applied to the CE/PGM input programs the paralleled EPROM.
. It is required that at least a
IH
, VCC to ground to suppress
PP
Program Inhibit
Programming multiple EPROMs in parallel with different data is also easily accomplished. Except for CE/PGM, all like inputs (including OE) of the parallel EPROMs may be common. A TTL low level program pulse applied to an EPROM’s CE/PGM input with VPP at 12.75V will program that EPROM. A TTL high level CE/ PGM input inhibits the other EPROMs from being programmed.
Program Verify
A verify should be performed on the programmed bits to determine whether they were correctly programmed. The verify may be performed with VPP at 12.75V. VPP must be at VCC, except during programming and program verify.
AFTER PROGRAMMING
Opaque labels should be placed over the EPROM window to prevent unintentional erasure. Covering the window will also prevent temporary functional failure due to the generation of photo currents.
MANUFACTURER’S IDENTIFICATION CODE
The EPROM has a manufacturer’s identification code to aid in programming. When the device is inserted in an EPROM pro­grammer socket, the programmer reads the code and then automatically calls up the specific programming algorithm for the part. This automatic programming control is only possible with programmers which have the capability of reading the code.
The Manufacturer’s Identification code, shown in Table 2, specifi­cally identifies the manufacturer and device type. The code for FM27C256 is “8F04”, where “8F” designates that it is made by Fairchild Semiconductor, and “04” designates a 256K part.
The code is accessed by applying 12V ±0.5V to address pin A9. Addresses A1–A8, A10–A16, and all control pins are held at VIL. Address pin A0 is held at VIL for the manufacturer’s code, and held at VIH for the device code. The code is read on the eight data pins, O0 –O7. Proper code access is only guaranteed at 25°C to ±5°C.
FM27C256 Rev. A
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FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
Functional Description (Continued)
ERASURE CHARACTERISTICS
The erasure characteristics of the device are such that erasure begins to occur when exposed to light with wavelengths shorter than approximately 4000 Angstroms (Å). It should be noted that sunlight and certain types of fluorescent lamps have wavelengths in the 3000Å–4000Å range.
The recommended erasure procedure for the EPROM is expo­sure to short wave ultraviolet light which has a wavelength of 2537Å. The integrated dose (i.e., UV intensity x exposure time) for erasure should be a minimum of 15W-sec/cm2.
The EPROM should be placed within 1 inch of the lamp tubes during erasure. Some lamps have a filter on their tubes which should be removed before erasure
An erasure system should be calibrated periodically. The distance from lamp to device should be maintained at one inch. The erasure time increases as the square of the distance from the lamp (if distance is doubled the erasure time increases by factor of 4). Lamps lose intensity as they age. When a lamp is changed, the distance has changed, or the lamp has aged, the system should
be checked to make certain full erasure is occurring. Incomplete erasure will cause symptoms that can be misleading. Program­mers, components, and even system designs have been errone­ously suspected when incomplete erasure was the problem.
SYSTEM CONSIDERATION
The power switching characteristics of EPROMs require careful decoupling of the devices. The supply current, I segments that are of interest to the system designer: the standby current level, the active current level, and the transient current peaks that are produced by voltage transitions on input pins. The magnitude of these transient current peaks is dependent of the output capacitance loading of the device. The associated V transient voltage peaks can be suppressed by properly selected decoupling capacitors. It is recommended that at least a 0.1 µF ceramic capacitor be used on every device between V GND. This should be a high frequency capacitor of low inherent inductance. In addition, at least a 4.7 µF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The bulk capacitor should be located near where the power supply is connected to the array. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of the PC board traces.
has three
CC,
CC
and
CC
Mode Selection
The modes of operation of FM27C256 listed in Table 1. A single 5V power supply is required in the read mode. All inputs are TTL levels except for VPP and A9 for device signature.
TABLE 1. Modes Selection
Pins CE/PGM OE V
PP
V
CC
Outputs
Mode
Read V
IL
Output Disable X V
(Note 16)
Standby V
Programming V
Program Verify V
Program Inhibit V
Note 16: X can be VIL or VIH.
IH
IL
IH
IH
V
IL
IH
V
CC
V
CC
5.0V D
5.0V High-Z
XVCC5.0V High-Z
VIH 12.75V 6.25V D
V
IL
V
IH
12.75V 6.25V D
12.75V 6.25V High-Z
TABLE 2. Manufacturer’s Identification Code
Pins A0A9O7O6O5O4O3O2O1O0Hex
(10) (24) (19) (18) (17) (16) (15) (13) (12) (11) Data
Manufacturer Code
Device Code V
V
12V100011118F
IL
12V0000010004
IH
OUT
IN
OUT
FM27C256 Rev. A
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Page 9
Physical Dimensions inches (millimeters) unless otherwise noted
1.450
[36.83]
MAX
15
0.520 ± 0.006
0.600 [13.21 ±0.15]
[15.24]
MAX Glass
R 0.025
[0.64]
28
FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
0.225 MAX TYP
0.125 MIN TYP
1
R 0.030-0.055
[0.76 - 1.40]
TYP
0.005 MIN
0.060-0.100 TYP
TYP
0.090-0.110 TYP
0.280 ±0.010 [7.11 ±0.25] UV WINDOW
0.050-0.060 TYP
0.015-0.021 TYP
14
86°-94°
TYP
0.175 MAX
0.150 MIN TYP
0.015 -0.060 TYP
Glass Sealant
UV Window Cavity Dual-In-Line CerDIP Package (Q)
Order Number FM27C256QXXX
Package Number J28AQ
[14.99 - 15.75]
95° ±5°
TYP
0.685
17.40
0.590-0.620
0.010 ±0.002 [0.25 ±0.05]
+0.025
-0.060 +0.64
-1.52
TYP
FM27C256 Rev. A
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Page 10
Physical Dimensions inches (millimeters) unless otherwise noted
0.485-0.495
Polished Optional
0.549-0.553
[13.94-14.05]
0.585-0.595
[14.86-15.11]
0.045
[1.143]
0.000-0.010 [0.00-0.25]
-B-
0.007[0.18]
-F-
13
0.002[0.05]
0.007[0.18]
A
S
[12.32-12.57]
B
D-E
S
S
0.007[0.18]
0.449-0.453
[11.40-11.51]
-A-
B
D-E
S
S
0.007[0.18]
4
5
A
S
A
S
F-G
S
0.002[0.05]
F-G
B
S
-D-
1
30
29
21
2014
-E-
S
-G-
0.050
0.106-0.112 [2.69-2.84]
0.023-0.029 [0.58-0.74]
0.541-0.545
[13.74-13-84]
See detail A
0.123-0.140 [3.12-3.56]
60
°
-H-
-J-
0.004[0.10]
-C-
Base Plane
0.015 [0.38]
0.400
( )
[10.16]
0.013-0.021 [0.33-0.53]
0.078-0.095 [1.98-2.41]
Min Typ
0.015[0.38]
TYP
0.007[0.18]
0.490-0530
[12.45-13.46]
S
C
M
0.020 [0.51]
C D-E, F-G
D-E, F-G
0.005 [0.13]
FM27C256 262,144-Bit (32K x 8) High Performance CMOS EPROM
S
S
Max
0.0100 [0.254]
0.118-0.129 [3.00-3.28]
0.010[0.25]
0.026-0.032 [0.66-0.81]
0.007[0.18]
B A
D-E, F-G
B
H
D-E, F-G
45
°X
B
S
0.042-0.048 [1.07-1.22]
S
Min
0.006-0.012 [0.15-0.30]
0.019-0.025 [0.48-0.64]
0.025 [0.64]
L
Typ
S
0.025 [0.64]
0.021-0.027 [0.53-0.69]
0.027-0.033 [0.69-0.84]
Section B-B
Typical
Min
0.031-0.037 [0.79-0.94]
0.065-0.071 [1.65-1.80]
0.053-0.059 [1.65-1.80]
0.045 [1.14]
Detail A
Typical
Rotated 90°
0.030-0.040
R
[0.76-1.02]
32-Lead Plastic Leaded Chip Carrier (PLCC)
Order Number FM27C256VXXX
Package Number VA32A
Life Support Policy
Fairchild's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of Fairchild Semiconductor Corporation. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably ex­pected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Fairchild Semiconductor Fairchild Semiconductor Fairchild Semiconductor Fairchild Semiconductor Americas Europe Hong Kong Japan Ltd. Customer Response Center Fax: +44 (0) 1793-856858 8/F, Room 808, Empire Centre 4F, Natsume Bldg.
Tel. 1-888-522-5372 Deutsch Tel: +49 (0) 8141-6102-0 68 Mody Road, Tsimshatsui East 2-18-6, Yushima, Bunkyo-ku
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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www.fairchildsemi.com
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FM27C256 Rev. A
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