Datasheet 1N6507J, 1N6506J, 1N6509J, 1N6508J, 1N5772F Datasheet (Microsemi Corporation)

SG5768, SG5770, SG5772, SG5774

SG6506/SG6507/SG6508/SG6509

DESCRIPTION

The Linfinity series of diode arrays feature high breakdown, high speed
diodes in a variety of configurations.

Each array configuration consists of either common anode diodes,
common cathode diodes, or a combination of common anode and
common cathode diodes.

Individual diodes within the array have 60V minimum breakdown
voltage, can handle 500mA of current and typically switch in less than
10 nanoseconds.

Each of the array configurations is available in ceramic DIP or ceramic
flatpack and can be processed to JANTXV, JANTX, or JAN flows at
Linfinity’s MIL-S-19500 facility.

DIODE ARRAY CIRCUITS

FEATURES

••

••

• 60V minimum breakdown voltage

••

••

• 500mA current capability per diode

••

••

• Fast switching speeds: typically less than

10ns

••

••

• Low leakage current

HIGH RELIABILITY FEATURES

♦♦

♦♦

♦ MIL-S-19500/474 QPL - 1N5768 - 1N6506

- 1N5770 - 1N6507

- 1N5772 - 1N6508

- 1N5774 - 1N6509

♦♦

♦♦

♦ JANTXV, JANTX & JAN available
♦♦

♦♦

♦ LMI level "S" processing available

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CIRCUIT DIAGRAMS

COMMON ANODE / COMMON CATHODE

SG5772/SG6508

DUAL COMMON ANODE / COMMON CATHODE

SG5774/SG6509

COMMON CATHODE

SG5768/SG6506

COMMON ANODE

SG5770/SG6507

DIODE ARRAY SERIES

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ABSOLUTE MAXIMUM RATINGS (Note 1 & 2)

Breakdown Voltage (VBR) ...................................................

Output Current (I

O

), TC = 25°C

Continuous ................................................................

60V

500mA

Operating Junction Temperature

Hermetic (J, F Packages) ............................................

Storage Temperature Range ............................

150°C

-65°C to 200°C

Note 1. Exceeding these ratings could cause damage to the device.
Note 2. Applicable for each diode.

J Package:

Thermal Resistance-

Junction to Case, θ

JC

.................. 30°C/W

Thermal Resistance-

Junction to Ambient, θ

JA

.............. 80°C/W

F Package (10 Pin):

Thermal Resistance-

Junction to Case, θ

JC

.................. 80°C/W

Thermal Resistance-

Junction to Ambient, θ

JA

............ 145°C/W

F Package (14 Pin):

Thermal Resistance-

Junction to Case, θ

JC

.................. 80°C/W

Thermal Resistance-

Junction to Ambient, θ

JA

............ 140°C/W

THERMAL DATA

Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).
Note B. The above numbers for

θJC are maximums for the limiting

thermal resistance of the package in a standard mount­ing configuration. The θ

JA

numbers are meant to be
guidelines for the thermal performance of the device/pc­board system. All of the above assume no ambient
airflow.

Operating Ambient Temperature Range

SG5768 ..........................................................-55°C to 150°C

SG5770 ..........................................................-55°C to 150°C

SG5772 ..........................................................-55°C to 150°C

Operating Ambient Temperature Range

SG5774 ..........................................................-55°C to 150°C

SG6506 ..........................................................-55°C to 150°C

SG6507 ..........................................................-55°C to 150°C

SG6508 ..........................................................-55°C to 150°C

SG6509 ..........................................................-55°C to 150°C

RECOMMENDED OPERATING CONDITIONS (Note 3)

Note 3. Range over which the device is functional.

ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, these specifications apply for the operating temperature of TA = 25°C for each diode. Low duty cycle pulse testing techniques
are used which maintains junction and case temperatures equal to the ambient temperature.)

1.0

1.1

1.5

1.0

100

50

4
40
20

V
V

V
V

V
nA
µA

pf

ns

Breakdown Voltage (VBR)
Forward Voltage (V

F

)

Reverse Current (IR)
Capacitance (C)

(Note 4)

Forward Recovery Time (tfr)

(Note 4)

Reverse Recovery Time (trr)

(Note 4)

60

SG5768/SG6506

Test Conditions UnitsParameter

Note 4. The parameters, although guaranteed, are not 100% tested in production.

Min. Typ. Max.

I

R

= 10µA
Duty Cycle ≤ 2%, 300 µs pulse
I

F

= 100mA
I

F

= 200mA
I

F

= 500mA
I

F

= 10mA, TA = -55°C
V

R

= 40V

V

R

= 40V, TA = 150°C

V

R

= 0V, f = 1MHz, Pin-to-pin

I

F

= 500mA, tr ≤ 15ns, Vfr = 1.8V, RS = 50Ω
I

F

= IR = 200mA, irr = 20mA, RL = 100Ω

DIODE ARRAY SERIES

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ELECTRICAL CHARACTERISTICS (continued)

1.0

1.1

1.5

1.0

100

50

8
40
20

Min. Typ. Max.

V
V

V
V

V
nA
µA

pf
ns
ns

7

Breakdown Voltage (V

BR

)

Forward Voltage (V

F

)

Reverse Current (IR)
Capacitance (C)

(Note 4)

Forward Recovery Time (tfr)

(Note 4)

Reverse Recovery Time (trr)

(Note 4)

60

SG5770/SG6507

Test Conditions

UnitsParameter

1.0

1.1

1.5

1.0

100

50

8
40
20

V
V

V
V

V
nA
µA

pf
ns
ns

7

I

R

= 10µA, 100ms pulse, ≤ 20% Duty Cycle
Duty Cycle ≤ 2%, 300µs pulse
I

F

= 100mA

I

F

= 200mA

I

F

= 500mA

I

F

= 10mA, TA = -55°C

V

R

= 40V

V

R

= 40V, TA = 150°C

V

R

= 0V, f = 1MHz, Pin-to-pin

I

F

= 500mA, tr ≤ 15ns, Vfr = 1.8V, RS = 50Ω

Breakdown Voltage (VBR)
Forward Voltage (V

F

)

Reverse Current (IR)
Capacitance (C)

(Note 4)

Forward Recovery Time (tfr)

(Note 4)

Reverse Recovery Time (trr)

(Note 4)

60

Parameter

SG5772/SG6508
SG5774/SG6509

Min. Max.Typ.

Units

Test Conditions

IR = 10µA, 100ms pulse, ≤ 20% Duty Cycle
Duty Cycle ≤ 2%, 300 µs pulse
I

F

= 100mA

I

F

= 200mA

I

F

= 500mA

I

F

= 10mA, TA = -55°C

V

R

= 40V

V

R

= 40V, TA = 150°C

V

R

= 0V, f = 1MHz, Pin-to-pin

I

F

= 500mA, tr ≤ 15ns, Vfr = 1.8V, RS = 50Ω

I

F

= IR = 200mA, irr = 20mA, RL = 100Ω

DIODE ARRAY SERIES

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CONNECTION DIAGRAMS & ORDERING INFORMATION (See Notes Below)

Ambient

Temperature Range

Part No.Package

Connection Diagram

14-PIN CERAMIC DIP
J - PACKAGE

SG6506J -55°C to 150°C
(1N6506) -55°C to 150°C

SG5768F -55°C to 150°C
(1N5768) -55°C to 150°C

10-PIN CERAMIC FLATPACK
F - PACKAGE

SG6507J -55°C to 150°C
(1N6507) -55°C to 150°C

14-PIN CERAMIC DIP
J - PACKAGE

1
2
3
4
5
6
7

14
13
12
11
10
9
8

1
2
3
4

9
8

5

6

7

10

1
2
3
4
5
6
7

14

12

9
8

11
10

13

SG5770F -55°C to 150°C
(1N5770) -55°C to 150°C

SG6508J -55°C to 150°C
(1N6508) -55°C to 150°C

14-PIN CERAMIC DIP
J - PACKAGE

SG5772F -55°C to 150°C
(1N5772) -55°C to 150°C

1

2

3

4

56

7

8

10

9

1
2
3
4

9
8

5

6

7

10

1

7

6

5

4

3

2

14
13

8

9

10

11

12

10-PIN CERAMIC FLATPACK
F - PACKAGE

10-PIN CERAMIC FLATPACK
F - PACKAGE

Note 1. Consult factory for other packages available.

2. All packages are viewed from the top.

3. Consult factory for JAN, JAN TX, and JAN TXV product availability.

DIODE ARRAY SERIES

6/90 Rev 1.1 2/94 LINFINITY Microelectronics Inc.

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CONNECTION DIAGRAMS & ORDERING INFORMATION (continued)

Ambient

Temperature Range

Part No.Package

Connection Diagram

14-PIN CERAMIC DIP
J - PACKAGE

SG6509J -55°C to 150°C
(1N6509) -55°C to 150°C

SG5774F -55°C to 150°C
(1N5774) -55°C to 150°C

14-PIN CERAMIC FLATPACK
F - PACKAGE

8

9

10

11

12

13

14

1

7

6

5

4

3

2

14

8

9

10

1
2

5

4

3

7

6

13
12
11