. . . employing the Schottky Barrier principle in a large area
metal–to–silicon power diode. State–of–the–art geometry features
chrome barrier metal, epitaxial construction with oxide passivation
and metal overlap contact. Ideally suited for use as rectifiers in
low–voltage, high–frequency inverters, free wheeling diodes, and
polarity protection diodes.
• Extremely Low V
• Low Power Loss/High Efficiency
• Low Stored Charge, Majority Carrier Conduction
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.1 gram (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
220°C Max. for 10 Seconds, 1/16″ from case
• Shipped in plastic bags, 500 per bag
• Available Tape and Reeled, 1500 per reel, by adding a “RL’’ suffix to
Preferred devices are recommended choices for future use
and best overall value.
1Publication Order Number:
1N5820/D
Page 2
1N5820, 1N5821, 1N5822
MAXIMUM RATINGS
RatingSymbol1N58201N58211N5822Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Non–Repetitive Peak Reverse VoltageV
RMS Reverse VoltageV
Average Rectified Forward Current (Note 1.)
V
0.2 V
R(equiv)
= 28°C/W, P.C. Board Mounting, see Note 5.)
(R
θ
JA
R(dc)
, TL = 95°C
Ambient Temperature
Rated V
R
θ
JA
, P
R(dc)
= 28°C/W
F(AV)
= 0
Non–Repetitive Peak Surge Current
(Surge applied at rated load conditions, half wave, single phase
60 Hz, T
= 75°C)
L
Operating and Storage Junction Temperature Range
(Reverse Voltage applied)
Peak Operating Junction Temperature (Forward Current applied)T
*THERMAL CHARACTERISTICS (Note 5.)
Characteristic
Thermal Resistance, Junction to AmbientR
*ELECTRICAL CHARACTERISTICS (T
Characteristic
Maximum Instantaneous Forward Voltage (Note 2.)
(i
= 1.0 Amp)
F
= 3.0 Amp)
(i
F
(i
= 9.4 Amp)
F
Maximum Instantaneous Reverse Current
@ Rated dc Voltage (Note 2.)
= 25°C
T
L
T
= 100°C
L
1. Lead Temperature reference is cathode lead 1/32″ from case.
2. Pulse Test: Pulse Width = 300 µs, Duty Cycle =2.0%.
*Indicates JEDEC Registered Data for 1N5820–22.
= 25°C unless otherwise noted) (Note 1.)
L
V
RRM
V
RWM
V
RSM
R(RMS)
I
O
T
I
FSM
TJ, T
J(pk)
R
A
stg
203040V
243648V
142128V
908580°C
80 (for one cycle)A
Symbol1N58201N58211N5822Unit
V
F
0.370
0.475
0.850
i
R
2.0
20
3.0
65 to +125°C
150
°C
SymbolMaxUnit
θ
JA
0.380
0.500
0.900
28°C/W
0.390
0.525
0.950
mA
2.0
20
2.0
20
A
V
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2
Page 3
1N5820, 1N5821, 1N5822
NOTE 3. — DETERMINING MAXIMUM RATINGS
Reverse power dissipation and the possibility of thermal
runaway must be considered when operating this rectifier at
reverse voltages above 0.1 V
. Proper derating may be
RWM
accomplished by use of equation (1).
T
where T
= T
A(max)
= Maximum allowable ambient temperature
A(max)
T
= Maximum allowable junction temperature
J(max)
J(max)
R
P
R
F(AV)
JA
θ
P
(1)
R(AV)
JA
θ
(125°C or the temperature at which thermal
runaway occurs, whichever is lowest)
P
= Average forward power dissipation
F(AV)
P
= Average reverse power dissipation
R(AV)
R
= Junction–to–ambient thermal resistance
JA
θ
Figures 1, 2, and 3 permit easier use of equation (1) by
taking reverse power dissipation and thermal runaway into
consideration. The figures solve for a reference temperature
as determined by equation (2).
TR = T
J(max)
R
P
JA
R(AV)
θ
(2)
Substituting equation (2) into equation (1) yields:
T
Inspection of equations (2) and (3) reveals that T
A(max)
= TR R
P
JA
F(AV)
θ
is the
R
(3)
ambient temperature at which thermal runaway occurs or
where TJ = 125°C, when forward power is zero. The
transition from one boundary condition to the other is
evident on the curves of Figures 1, 2, and 3 as a difference
in the rate of change of the slope in the vicinity of 115°C. The
data of Figures 1, 2, and 3 is based upon dc conditions. For
use in common rectifier circuits, Table 1. indicates
suggested factors for an equivalent dc voltage to use for
conservative design, that is:
V
R(equiv)
= V
F(4)
(FM)
The factor F is derived by considering the properties of the
various rectifier circuits and the reverse characteristics of
Schottky diodes.
EXAMPLE: Find T
for 1N5821 operated in a
A(max)
12–volt dc supply using a bridge circuit with capacitive filter
such that I
Voltage = 10 V
Step 1. Find V
= 2.0 A (I
DC
, R
(rms)
R(equiv).
V
= 1.0 A), I
F(AV)
=40°C/W.
JA
θ
Read F = 0.65 from Table 1. ,
= (1.41) (10) (0.65) = 9.2 V.
R(equiv)
(FM)/I(AV)
= 10, Input
Step 2. Find TR from Figure 2. Read TR = 108°C
Step 3. Find P
F(AV)
@
Step 4. Find T
@ VR = 9.2 V and R
from Figure 6. **Read P
I
(FM)
I
(AV)
A(max)
T
A(max)
10 and I
from equation (3).
= 108 (0.85) (40) = 74°C.
F(AV)
= 40°C/W.
JA
θ
1.0 A.
F(AV)
= 0.8 5 W
**Values given are for the 1N5821. Power is slightly lower
for the 1N5820 because of its lower forward voltage, and
higher for the 1N5822. Variations will be similar for the
MBR–prefix devices, using P
1.0
The temperature of the lead should be measured using a ther
mocouple placed on the lead as close as possible to the tie point.
0.5
The thermal mass connected to the tie point is normally large
0.3
enough so that it will not significantly respond to heat surges
generated in the diode as a result of pulsed operation once
0.2
0.1
(NORMALIZED)
0.05
0.03
0.02
r(t), TRANSIENT THERMAL RESISTANCE
0.01
steady-state conditions are achieved. Using the measured val
ue of T
, the junction temperature may be determined by:
L
T
= TL + T
J
JL
t
∆T
∆T
r(t) = normalized value of transient thermal resistance at time, t, i.e.:
r(t
1
t
+ tp, etc.
1
P
p
JL
JL
pk
t
1
= P
• R
pk
= the increase in junction temperature above the lead temperature.
P
[D + (1 - D) • r(t
θ
JL
pk
DUTY CYCLE = t
PEAK POWER, Ppk, is peak of an
TIME
equivalent square power pulse.
+ tp) + r(tp) - r(t1)] where:
1
+ tp) = normalized value of transient thermal resistance at time
0.20.51.02.05.01020501002005001.0 k2.0 k5.0 k10 k
t, TIME (ms)
Figure 5. Thermal Response
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4
LEAD LENGTH = 1/4″
p/t1
20 k
Page 5
1N5820, 1N5821, 1N5822
10
7.0
5.0
3.0
2.0
1.0
0.7
0.5
SINE WAVE
I
(FM)
(ResistiveLoad)
I
(AV)
Capacitive
Loads
5.0
10
20
SQUARE WAVE
0.3
T
≈ 125°C
, AVERAGE POWER DISSIPATION (WATTS)
F(AV)
P
0.2
0.1
0.2 0.30.52.0
I
, AVERAGE FORWARD CURRENT (AMP)
F(AV)
0.7 1.07.0 10
J
3.00.1
5.0
Figure 6. Forward Power Dissipation 1N5820–22
NOTE 4. – APPROXIMATE THERMAL CIRCUIT MODEL
R
θ
T
dc
A(A)
S(A)
R
θ
T
L(A)
L(A)
R
θ
T
C(A)TJ
J(A)
R
θ
P
D
J(K)
R
θ
T
C(K)
L(K)
R
θ
S(K)
T
A(K)
T
L(K)
Use of the above model permits junction to lead thermal
resistance for any mounting configuration to be found. For
a given total lead length, lowest values occur when one side
of the rectifier is brought as close as possible to the heat sink.
Terms in the model signify:
T
= Ambient TemperatureTC = Case Temperature
A
TL = Lead TemperatureTJ = Junction Temperature
R
= Thermal Resistance, Heat Sink to Ambient
S
θ
R
= Thermal Resistance, Lead to Heat Sink
L
θ
R
= Thermal Resistance, Junction to Case
J
θ
PD = Total Power Dissipation = PF + P
R
PF = Forward Power Dissipation
PR = Reverse Power Dissipation
(Subscripts (A) and (K) refer to anode and cathode sides,
respectively.) Values for thermal resistance components
are:
R
= 42°C/W/in typically and 48°C/W/in maximum
L
θ
R
= 10°C/W typically and 16°C/W maximum
J
θ
The maximum lead temperature may be found as follows:
TL = T
where
T
J(max)
TJL R
JL
· P
JL
D
θ
NOTE 5. — MOUNTING DATA
Data shown for thermal resistance junction–to–ambient (R
for the mountings shown is to be used as typical guideline values
for preliminary engineering, or in case the tie point temperature
cannot be measured.
TYPICAL VALUES FOR R
Mounting
Method
1
2
3
Lead Length, L (in)
1/81/41/23/4
50515355°C/W
58596163
θ
28
IN STILL AIR
JA
R
θ
°C/W
°C/W
JA
θ
JA
Mounting Method 1
P.C. Board where available
copper surface is small.
)
Mounting Method 2
LL
VECTOR PUSH-IN
TERMINALS T-28
LL
Mounting Method 3
P.C. Board with
2–1/2″ x 2–1/2″
copper surface.
L = 1/2″
BOARD GROUND
PLANE
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Page 6
1N5820, 1N5821, 1N5822
50
30
20
10
7.0
5.0
3.0
2.0
1.0
0.7
0.5
, INSTANTANEOUS FORWARD CURRENT (AMP)
F
i
0.3
0.2
0.1
T
= 100°C
J
25°C
100
70
50
30
20
, PEAK HALF-WAVE CURRENT (AMP)
FSM
I
10
100
50
20
10
5.0
2.0
1.0
0.5
T
= 75°C
L
f = 60 Hz
1 CYCLE
SURGE APPLIED AT RATED LOAD CONDITIONS
7.0 102.0 3.0
5.01001.0
NUMBER OF CYCLES
203050 70
Figure 8. Maximum Non–Repetitive Surge
Current
T
= 125°C
J
100°C
75°C
0.07
0.05
500
300
200
C, CAPACITANCE (pF)
100
70
1.0
1.2
0.400.20.60.8
v
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
F
1.10.30.10.50.71.30.9
Figure 7. Typical Forward Voltage
1N5820
T
= 25°C
J
f = 1.0 MHz
1N5822
0.77.02030
1.00.5
2.0 3.05.010
VR, REVERSE VOLTAGE (VOLTS)
Figure 10. Typical Capacitance
1N5821
0.2
R
I , REVERSE CURRENT (mA)
1.4
0.1
0.05
0.02
0.01
25°C
4.012202836
8.00
16
, REVERSE VOLTAGE (VOLTS)
V
R
243240
Figure 9. Typical Reverse Current
NOTE 6. — HIGH FREQUENCY OPERATION
Since current flow in a Schottky rectifier is the result of
majority carrier conduction, it is not subject to junction
diode forward and reverse recovery transients due to minority carrier injection and stored charge. Satisfactory circuit
analysis work may be performed by using a model consisting of an ideal diode in parallel with a variable capacitance.
(See Figure 10.)
1N5820
1N5821
1N5822
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6
Page 7
1N5820, 1N5821, 1N5822
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267–03
ISSUE G
NOTES:
D
1
B
K
A
2
K
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MINMAXMIN MAX
A 0.370 0.3809.409.65
B 0.190 0.2104.835.33
D 0.048 0.0521.221.32
K 1.000--- 25.40---
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
MILLIMETERSINCHES
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7
Page 8
1N5820, 1N5821, 1N5822
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