Page 1
DATA SH EET
Product specification
Supersedes data of April 1992
1996 Jun 10
DISCRETE SEMICONDUCTORS
1N4001ID to 1N4007ID
Rectifiers
ook, halfpage
M3D119
Page 2
1996 Jun 10 2
Philips Semiconductors Product specification
Rectifiers 1N4001ID to 1N4007ID
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack.
DESCRIPTION
Cavity free cylindrical glass package
through Implotec
(1)
technology.
(1) Implotec is a trademark of Philips.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
Fig.1 Simplified outline (SOD81) and symbol.
handbook, 4 columns
ak
MAM123
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RRM
repetitive peak reverse voltage
1N4001ID − 50 V
1N4002ID − 100 V
1N4003ID − 200 V
1N4004ID − 400 V
1N4005ID − 600 V
1N4006ID − 800 V
1N4007ID − 1000 V
V
R
continuous reverse voltage
1N4001ID − 50 V
1N4002ID − 100 V
1N4003ID − 200 V
1N4004ID − 400 V
1N4005ID − 600 V
1N4006ID − 800 V
1N4007ID − 1000 V
I
F(AV)
average forward current averaged over any 20 ms
period; T
amb
=75°C; see Fig.2
− 1.00 A
averaged over any 20 ms
period; T
amb
= 100 °C; see Fig.2
− 0.75 A
I
FRM
repetitive peak forward current − 10 A
I
FSM
non-repetitive peak forward current half sinewave; 60 Hz − 20 A
T
stg
storage temperature −65 +175 °C
T
j
junction temperature −65 +175 °C
Page 3
1996 Jun 10 3
Philips Semiconductors Product specification
Rectifiers 1N4001ID to 1N4007ID
ELECTRICAL CHARACTERISTICS
T
j
=25°C; unless otherwise specified.
THERMAL CHARACTERISTICS
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.4.
For more information please refer to the
“General Part of associated Handbook”
.
SYMBOL PARAMETER CONDITIONS MAX. UNIT
V
F
forward voltage
I
F
= 1 A; see see Fig.3
1.1 V
V
F(AV)
full-cycle average forward voltage I
F(AV)
= 1 A 0.8 V
I
R
reverse current VR=V
Rmax
10 µA
V
R=VRmax
; T
amb
= 100 °C50µA
I
R(AV)
full-cycle average reverse current VR=V
RRMmax
; T
amb
=75°C30µA
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-tp
thermal resistance from junction to tie-point lead length = 10 mm 60 K/W
R
th j-a
thermal resistance from junction to ambient note 1 120 K/W
Page 4
1996 Jun 10 4
Philips Semiconductors Product specification
Rectifiers 1N4001ID to 1N4007ID
GRAPHICAL DATA
Fig.2 Maximum forward current as a function of
ambient temperature.
handbook, halfpage
0 200
0
MBH386
0.5
1
1.5
100
T
amb
(°C)
I
F
(A)
Fig.3 Forward current as a function of forward
voltage; typical values.
handbook, halfpage
1.50 0.5
I
F
(A)
10
−1
1
10
MBH385
1
VF (V)
(2)(1) (3)
(1) T
amb
= 100°C.
(2) T
amb
= 20°C.
(3) T
amb
= −50°C.
Fig.4 Device mounted on a printed-circuit board.
handbook, halfpage
MGA200
3
2
7
50
25
50
Dimensions in mm.
Page 5
1996 Jun 10 5
Philips Semiconductors Product specification
Rectifiers 1N4001ID to 1N4007ID
PACKAGE OUTLINE
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Dimensions in mm.
Fig.5 SOD81.
handbook, full pagewidth
MBC051
5 max
3.8 max28 min 28 min
0.81
max
2.15
max
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