Datasheet 100371MW8, 100371MD8, 100371FMQB, 100371DMQB, 100371DM-MLS Datasheet (NSC)

100371
Low Power Triple 4-Input Multiplexer with Enable

General Description

The 100371 contains three 4-input multiplexers which share
a common decoder (inputs S

0

and S1). Output buffer gates
provide trueandcomplement outputs. AHIGH on the Enable
input (E) forces all true outputs LOW (see TruthTable).All in­puts have 50 kΩ pull-down resistors.

Features

n 35%power reduction of the 100171

n 2000V ESD protection
n Pin/function compatible with 100171
n Voltage compensated operating range=−4.2V to −5.7V
n Available to MIL-STD-883

Logic Symbol

Pin Names Description

I

0x–I3x

Data Inputs

S

0,S1

Select Inputs

E

Enable Input (Active LOW)

Z

a–Zc

Data Outputs

Z

a–Zc

Complementary Data Outputs

DS100975-1

September 1998

100371 Low Power Triple 4-Input Multiplexer with Enable

© 1998 National Semiconductor Corporation DS100975 www.national.com

Connection Diagrams

Logic Diagram

24-Pin DIP

DS100975-2

24-Pin Quad Cerpak

DS100975-3

DS100975-5

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Truth Table

Inputs Outputs

E

S

0

S

1

Z

n

LL L I

0x

LH L I

1x

LLH I

2x

LHH I

3x

HX X L

H

=

HIGH Voltage Level
L=LOW Voltage Level
X=Don’t Care

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Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.

Storage Temperature (T

STG

) −65˚C to +150˚C

Maximum Junction Temperature (T

J

)

Ceramic +175˚C

V

EE

Pin Potential to Ground Pin −7.0V to +0.5V

Input Voltage (DC) V

EE

to +0.5V
Output current (DC Output HIGH) −50 mA
ESD (Note 2) ≥2000V

Recommended Operating
Conditions

Case Temperature (TC)

Military −55˚C to +125˚C

Supply Voltage (V

EE

) −5.7V to −4.2V

Note 1: Absolute maximum ratings are those values beyond which the de­vice may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.

Note 2: ESD testing conforms to MIL-STD-883, Method 3015.

Military Version
DC Electrical Characteristics

V

EE

=

−4.2V to −5.7V, V

CC

=

V

CCA

=

GND, T

C

=

−55˚C to +125˚C

Symbol Parameter Min Max Units T

C

Conditions Notes

V

OH

Output HIGH Voltage −1025 −870 mV 0˚C to

(Notes 3, 4,

5)

+125˚C

−1085 −870 mV −55˚C V

IN

=

V (Max) Loading with

V

OL

Output LOW Voltage −1830 −1620 mV 0˚C to or V

IL (Min)

50Ω to −2.0V

+125˚C

−1830 −1555 mV −55˚C

V

OHC

Output HIGH Voltage −1035 mV 0˚C to

(Notes 3, 4,

5)

+125˚C

−1085 mV −55˚C V

IN

=

V

IH

(Min) Loading with

V

OLC

Output LOW Voltage −1610 mV 0˚C to or VIL(Max) 50Ω to −2.0V

+125˚C

−1555 mV −55˚C

V

IH

Input HIGH Voltage −1165 −870 mV −55˚C to Guaranteed HIGH Signal

(Notes 3, 4,

5, 6)

+125˚C for All Inputs

V

IL

Input LOW Voltage −1830 −1475 mV −55˚C to Guaranteed LOW Signal

(Notes 3, 4,

5, 6)

+125˚C for All Inputs

I

IL

Input LOW Current 0.50 µA −55˚C to V

EE

=

−4.2V

(Notes 3, 4,

5)

+125˚C V

IN

=

V

IL

(Min)

I

IH

Input HIGH Current

(Notes 3, 4,

5)

I

0X–I3X

340 µA 0˚C to

S

0,S1

,E 300 +125˚C V

EE

=

−5.7V

I

0X–I3X

490 µA −55˚C V

IN

=

V

IH

(Max)

S

0,S1

,E 450

I

EE

Power Supply Current −80 −30 mA −55˚C to Inputs Open

(Notes 3, 4,

5)

+125˚C

Note 3: F100K 300 Series cold temperaturetesting is performed bytemperature soaking (to guarantee junction temperature equals−55˚C), then testing immediately
without allowing for thejunction temperature to stabilize due to heat dissapation afterpower-up. This provides “coldstart” specs which can beconsidered a worst case
condition at cold temperatures.

Note 4: Screen tested 100%on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.
Note 5: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.
Note 6: Guaranteed by applying specified input condition and testing V

OH/VOL

.

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Military Version
AC Electrical Characteristics

V

EE

=

−4.2V to −5.7V, V

CC

=

V

CCA

=

GND

Symbol Parameter T

C

=

−55˚C T

C

=

+25˚C T

C

=

+125˚C Units Conditions Notes

Min Max Min Max Min Max

t

PLH

Propagation Delay 0.10 1.90 0.20 1.70 0.20 2.00 ns

(Notes 7,

8, 9, 11)

t

PHLI0x–I3x

to Output

t

PLH

Propagation Delay 0.40 2.70 0.60 2.40 0.50 2.90 ns

t

PHL

S0,S1to Output

Figures 1, 2

t

PLH

Propagation Delay 0.50 2.70 0.60 2.40 0.50 2.90 ns

t

PHL

E to Output

t

TLH

Transition Time 0.20 1.60 0.30 1.50 0.20 1.60 ns

(Note 10)

t

THL

20%to 80%,80%to 20

%

Note 7: F100K 300 Series cold temperaturetesting is performed bytemperature soaking (to guarantee junction temperature equals−55˚C), then testing immediately
after power-up. This provides “cold start” specs which can be considered a worst case condition at cold temperatures.

Note 8: Screen tested 100%on each device at +25˚C temperature only, Subgroup A9.
Note 9: Sample tested (Method 5005, Table I) on each mfg. lot at +25˚C, Subgroup A9, and at +125˚C and −55˚C temperatures, Subgroups A10 and A11.
Note 10: Not tested at +25˚C, +125˚C and −55˚C temperature (design characterization data).
Note 11: The propagation delay specified is for single output switching. Delays may vary up to 300 ps with multiple outputs switching.

Test Circuitry

DS100975-6

Notes:

V

CC,VCCA

=

+2V, V

EE

=

−2.5V
L1 and L2=equal length 50Ω impedance lines
R

T

=

50Ω terminator internal to scope

Decoupling 0.1 µF from GND to V

CC

and V

EE

All unused outputs are loaded with 50Ω to GND
C

L

=

Fixture and stray capacitance ≤ 3pF

Pin numbers shown are for flatpak; for DIP see logic symbol

FIGURE 1. AC Test Circuit

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Switching Waveforms

DS100975-7

FIGURE 2. Propagation Delay and Transition Times

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Physical Dimensions inches (millimeters) unless otherwise noted

24-Lead Ceramic Dual-In-Line Package (D)

Package Number J24E

24-Lead Ceramic Flatpak (F)

Package Number W24B

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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE­VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI­CONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or sys­tems which, (a) are intended for surgical implant into
the body,or (b) supportor sustain life, and whose fail­ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonablyexpected to result in a significant injury
to the user.

2. A critical component in any component of a life support
device or system whose failure to perform can be rea­sonably expected to cause the failure of the life support
device orsystem, or to affect its safety oreffectiveness.

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100371 Low Power Triple 4-Input Multiplexer with Enable

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.