Datasheet 100351SCX, 100351SC, 100351QIX, 100351QI, 100351QCX Datasheet (Fairchild Semiconductor)

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© 2000 Fairchild Semiconductor Corporation DS009885 www.fairchildsemi.com
July 1988 Revised August 2000
100351 Low Power Hex D-Type Flip-Flop
100351 Low Power Hex D-Type Flip-Flop
General Description
The 100351 contains six D-type edge-triggered, master/ slave flip-flops with true and compl emen t outputs , a pair of common Clock inputs (CP
a
and CPb) and common Master
Reset (MR) input. Data enters a master when both CP
a
and CPb are LOW and transfers to the slave when CPa and CP
b
(or both) go HIGH. The MR input override s all other
inputs and makes the Q outputs LOW. All inputs have 50 k
Ω pull-down resistors.
Features
■ 40% power reduction of the 100151
■ 2000V ESD protection
■ Pin/function compatible with 100151
■ Voltage compensated operating range:
−4.2V to −5.7V
■ Available to industrial grade temperature range
Ordering Code:
Devises also availab le in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code.
Logic Symbol
Pin Descriptions
Connection Diagrams
24-Pin DIP/SOIC
28-Pin PLCC
Order Number Package Number Package Description
100351SC M24B 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 100351PC N24E 24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-010, 0.400 Wide 100351QC V28A 28-Lead Plastic Lead Chip Carrier (PLCC), JEDEC MO-047, 0.450 Square 100351QI V28A 28-Lead Plastic Lead Chip Carrier (PLCC), JEDEC MO-047, 0.450 Square
Industrial Temperature Range (
−40°C to +85°C)
Pin Names Description
D
0–D5
Data Inputs
CP
a
, CP
b
Common Clock Inputs MR Asynchronous Master Reset Input Q
0–Q5
Data Outputs Q
0–Q5
Complementary Data Outputs
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Truth Tables
(Each Flip-flop)
Synchronous Operation
H = HIGH Voltage Level L = LOW Voltage Level X = Don’t Care
t = Time before CP positive transition
t+1 = Time after CP positive transiti on
= LOW-to-HIGH transition
Asynchronous Operati on
Logic Diagram
Inputs Outputs
D
n
CP
a
CP
b
MR Qn(t+1)
L
LL L
H
LL H
LL
LL
HL
LH
XH
LQ
n
(t)
X
HL Q
n
(t)
XL LL Q
n
(t)
Inputs Outputs
D
n
CP
a
CP
b
MR Qn(t+1)
XXXH L
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100351
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: The “Absolute Maximum Ratings” are those value s beyond which
the safety of the dev ice cannot b e guaranteed . The device sh ould not be operated at these limit s. The parametric values defi ned in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The “Recomm ended O peratin g Cond itions ” table will defin e the condition s for actual device operation.
Note 2: ESD testing conforms to MIL-STD-883, Method 3015.
Commercial Version DC Electrical Characteristics
(Note 3)
V
EE
= −4.2V to −5.7V, VCC = V
CCA
= GND, T
C
= 0°C to +85°C
Note 3: The specified limits represent the “worst case” value for the parameter. Since these values normally occur at the temperature extremes, additional noise immunity and guardbanding can be achieved by decreasin g the al l owable syste m opera ti ng ran ge s. Cond it i ons fo r t estin g sho w n in the tabl es are cho­sen to guarantee operation under “worst case” conditions.
DIP AC Electrical Characteristics
V
EE
= −4.2V to −5.7V, VCC = V
CCA
= GND
Storage Temperature (T
STG
) −65°C to +150°C
Maximum Junction Temperature (T
J
) +150°C
V
EE
Pin Potential to Ground Pin −7.0V to +0.5V
Input Voltage (DC) V
EE
to +0.5V
Output Current (DC Output HIGH)
−50 mA
ESD (Note 2)
≥2000V
Case Temperature (T
C
)
Commercial 0
°C to +85°C
Industrial
−40°C to +85°C
Supply Voltage (V
EE
) −5.7V to −4.2V
Symbol Parameter Min Typ Max Units Conditions
V
OH
Output HIGH Voltage −1025 −955 −870
mV
VIN =VIH (Max) Loading with
V
OL
Output LOW Voltage −1830 −1705 −1620 or VIL (Min) 50Ω to −2.0V
V
OHC
Output HIGH Voltage −1035
mV
VIN = VIH (Min) Loading with
V
OLC
Output LOW Voltage −1610 or VIL (Max) 50Ω to −2.0V
V
IH
Input HIGH Voltage −1165 −870 mV Guaranteed HIGH Signal for All Inputs
V
IL
Input LOW Voltage −1830 −1475 mV Guaranteed LOW Signal for All Inputs
I
IL
Input LOW Current 0.50 µAVIN = VIL (Min)
I
IH
Input HIGH Current
MR 350
D
0–D5
240 µAVIN = VIH (Max)
CP
a
, CP
b
350
I
EE
Power Supply Current −129 −62 mA Inputs OPEN
Symbol Parameter
TC = 0°CT
C
= +25°CT
C
= +85°C
Units Conditions
Min Max Min Max Min Max
f
MAX
Toggle Frequency 375 375 375 MHz Figures 2, 3
t
PLH
Propagation Delay
0.80 2.00 0.80 2.0 0.90 2.10 ns Figures 1, 3
t
PHL
CPa, CPb to Output
t
PLH
Propagation Delay
1.10 2.30 1.10 2.30 1.20 2.40 ns Figures 1, 4
t
PHL
MR to Output
t
TLH
Transition Time
0.35 1.20 0.35 1.20 0.35 1.20 ns Figures 1, 3
t
THL
20% to 80%, 80% to 20%
t
S
Setup Time D0–D
5
0.40 0.40 0.40 ns Figure 5
MR (Release Time) 1.60 1.60 1.60 Figure 4
t
H
Hold Time
0.80 0.80 0.80 ns Figure 5
D0–D
5
tPW(H) Pulse Width HIGH
2.00 2.00 2.00 ns Figures 3, 4
CPa, CPb, MR
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Commercial Version (Continued) SOIC and PLCC AC Electrical Characteristics
V
EE
= −4.2V to −5.7V, VCC = V
CCA
= GND
Note 4: Output-to-Output Skew is defined as the absolute value of the difference between the actual propagation delay for any outputs within the same pack­aged device. Th e specif ications apply to any out puts s witchin g in the sa me dire ction e ither HI GH-to-LO W ( t
OSHL
), or LOW-to-HIGH ( t
OSLH
), or in opposite
directions both HL and LH (t
OST
). Parameters t
OST
and tPS guaranteed by design.
Symbol Parameter
TC = 0°CT
C
= +25°CT
C
= +85°C
Units Conditions
Min Max Min Max Min Max
f
MAX
Toggle Frequency 375 375 375 MHz Figures 2, 3
t
PLH
Propagation Delay
0.80 1.80 0.80 1.80 0.90 1.90 ns Figures 1, 3
t
PHL
CPa, CPb to Output
t
PLH
Propagation Delay
1.10 2.10 1.10 2.10 1.20 2.20 ns Figures 1, 4
t
PHL
MR to Output
t
TLH
Transition Time
0.45 1.70 0.45 1.60 0.45 1.70 ns Figures 1, 3
t
THL
20% to 80%, 80% to 20%
t
S
Setup Time D
0–D5
0.30 0.30 0.30 ns Figure 5
MR (Release Time) 1.50 1.50 1.50 Figure 4
t
H
Hold Time
0.80 0.80 0.80 ns Figure 5
D
0–D5
tPW(H) Pulse Width HIGH
2.00 2.00 2.00 ns Figures 3, 4
CPa, CPb, MR
t
OSHL
Maximum Skew Common Edge PLCC only Output-to-Output Variation 220 220 220 ps (Note 4) Clock to Output Path
t
OSLH
Maximum Skew Common Edge PLCC only Output-to-Output Variation 210 210 210 ps (Note 4) Clock to Output Path
t
OST
Maximum Skew Opposite Edge PLCC only Output-to-Output Variation 240 240 240 ps (Note 4) Clock to Output Path
t
PS
Maximum Skew PLCC only Pin (Signal) Transition Variation 230 230 230 ps (Note 4) Clock to Output Path
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Industrial Version PLCC DC Electrical Characteristics
V
EE
=−4.2V to −5.7V, VCC=V
CCA
= GND, TC= 0°C to +85°C (Note 5)
Note 5: The specified limits represent the “worst case” value for the parameter. Since these values normally occur at the temperature extremes, additional noise immunity and guardbanding can be achieved by decreasin g the al l owable syste m opera ti ng ran ge s. Cond it i ons fo r t estin g sho w n in the tabl es are cho­sen to guarantee operation under “worst case” conditions.
PLCC AC Electrical Characteristics
V
EE
= −4.2V to −5.7V, VCC = V
CCA
= GND
Symbol Parameter
TC = −40°CTC = 0° to +85°C
Units Conditions
Min Max Min Max
V
OH
Output HIGH Voltage −1085 −870 −1025 −870
mV
VIN =VIH (Max) Loading with
V
OL
Output LOW Voltage −1830 −1575 −1830 −1620 or VIL (Min) 50Ω to −2.0V
V
OHC
Output HIGH Voltage −1095 −1035
mV
VIN = VIH (Min) Loading with
V
OLC
Output LOW Voltage −1565 −1610 or VIL (Max) 50Ω to −2.0V
V
IH
Input HIGH Voltage −1170 −870 −1165 −870 mV Guaranteed HIGH Signal
for All Inputs
V
IL
Input LOW Voltage −1830 −1480 −1830 −1475 mV Guaranteed LOW Signal
for All Inputs
I
IL
Input LOW Current 0.50 0.50 µAVIN = VIL (Min)
I
IH
Input HIGH Current
MR 350 350
D0–D
5
240 240 µAVIN = VIH (Max)
CPa, CP
b
350 350
I
EE
Power Supply Current −129 −62 −129 −62 mA Inputs OPEN
Symbol Parameter
T
C
= −40°CT
C
= +25°CT
C
= +85°C
Units Conditions
Min Max Min Max Min Max
f
MAX
Toggle Frequency 375 375 375 MHz Figures 2, 3
t
PLH
Propagation Delay
0.80 1.80 0.80 1.80 0.90 1.90 ns Figures 1, 3
t
PHL
CPa, CPb to Output
t
PLH
Propagation Delay
1.10 2.10 1.10 2.10 1.20 2.20 ns Figures 1, 4
t
PHL
MR to Output
t
TLH
Transition Time
0.45 1.70 0.45 1.60 0.45 1.70 ns Figures 1, 3
t
THL
20% to 80%, 80% to 20%
t
S
Setup Time D
0–D5
0.60 0.30 0.30 ns Figure 5
MR (Release Time) 2.20 1.50 1.50 Figure 4
t
H
Hold Time
0.60 0.90 0.90 ns Figure 5
D0–D
5
tPW(H) Pulse Width HIGH
2.00 2.00 2.00 ns Figures 3, 4
CPa, CPb, MR
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Test Circuitry
Notes:
V
CC
, V
CCA
= +2V, VEE = −2.5V
L1 and L2 = equal length 50Ω impedance lines R
T
= 50Ω terminator internal to scope
Decoupling 0.1 µF from GND to V
CC
and V
EE
All unused outputs are loaded with 50Ω to G ND C
L
= Fixture and stray capacitance ≤ 3 pF
FIGURE 1. AC Test Circuit
Notes:
V
CC
, V
CCA
= +2V, VEE = −2.5V L1 and L2 = equal length 50Ω impedance lines R
T
= 50Ω terminator internal to scope
Decoupling 0.1 µF from GND to V
CC
and V
EE
All unused outputs are loaded with 50Ω to G ND C
L
= Jig and stray capacitance ≤ 3 pF
FIGURE 2. Toggle Frequency Test Circuit
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Switching Waveforms
FIGURE 3. Propagation Delay (Clock) and Transition Times
FIGURE 4. Propagation Delay (Reset)
Notes:
t
S
is the minimum time bef ore the transition of the c loc k th at inf ormation must be pres ent at t he data input.
t
H
is the minimum time after the transition of the cl oc k th at inf ormation must remain unc hanged at the data input .
FIGURE 5. Setup a nd Hold Time
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Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M24B
24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-010, 0.400 Wide
Package Number N24E
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100351 Low Power Hex D-Type Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
28-Lead Plastic Lead Chip Carrier (PLCC), JEDEC MO-047, 0.450 Square
Package Number V28A
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provide d in the labe l ing, can be re a­sonably expected to result in a significant injury to the user.
2. A critical compo nent in any com ponen t of a life s upp ort device or system whose failure to perform can be rea­sonably expected to cause the failure of the l ife support device or system, or to affect its safety or effectiveness.
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