Host Configuration and Integration Guide
DAP Technologies is the leading manufacturer of rugged mobile computing solutions
and services for any setting, including harsh environments. DAP designs and
manufactures mobile computers for a range of demanding industries including Utilities,
Field Service, Emergency Services, Public Safety, Transportation and Logistics.
Our new product line will include an OEM wi-fi & Bluetooth combo module.
We have CE5000B series which includes CE5320B and CE5240B (where the only
difference is screen orientation)
CE5000B Series
We also have CE3000B series which includes only CE3240B for now
CE3240B
And we have CE8000B series which includes CE8640B (half VGA screen), CE8810B
(full VGA screen) and CE8820B (wide VGA screen)
CE8640B
CE8810B & CE8820B
A very important note is that all these products all have the same electronic design (same
processor, FPGA, memory,…), so same design but different form factor to fit in our
existing casings.
The same OEM module will be used in all products with same antennas that are located
on mainboards (PCB mounted).
The electrical interface between OEM module and our mainboards is the same and the
physical interface is a board-to-board connector.
OEM 802.11bg/BT Combo Module
Changes or modifications not expressly approved by DAP Technologies could void the
user's authority to operate the equipment.
In order to comply with the FCC RF exposure requirements this module must be installed
in specific host configurations as defined in this document. For CE8000B series the
antennas are installed on the main board with a least 2.5 cm spacing from the antennas to
the bottom of the enclosure. The CE3000B and CE5000B series are hand held with the
antennas installed on a piggyback board that is located below the LCD display. There is
not provision for simultaneous transmission of BT and 802.11b/g. The end user manual
for all final host configurations must include the following warning statement. In order to