Danfoss H55-C Data sheet

Data sheet

Micro Plate Heat Exchanger

For increased heat pump business

H55-C Heat Pump Condenser

40%

charge compared with
a traditional BPHE. The
ideal solution to meet
the world`s climate
and energy aspirations.

ra.danfoss.com

H55-C Heat pump Condenser
Micro Plate Heat Exchanger

Introduction

Key features

Q4 Q1

466

525

Q3 Q2

50

109

Condenser optimised for R407C in high eciency residential heat pumps with capacities between 4-40 kW. The heat exchanger features

innovative Micro Plate technology that improves heat transfer and reduces the amount of material used.

To meet demands for higher COPs in heat pumps, the H55-C is designed to work eciently with close temperature approaches. The low

hold-up volume reduces the refrigerant charge and oers valuable savings.

• Minimal hold up volume: Less refrigerant charge

• High heat transfer: For a more ecient heat pump

• Smaller footprint: Enabling more compact heat pumps

• Reduced CO2 footprint: Environmentally friendly with high heat transfer and minimal refrigerant charge.

9.5+1.44 x n 29

H1 H4

H2 H3

Technical data

n = number of plates

Standard
materials

Standard
connections

Third part
approvals

Accessories
– stud bolts

evaporator

DKQB.PD.300.Q5.02 © Copyright Danfoss RC-MDP | sw | 08 2014

Min. working temperature: -190 °C
Max. working temperature: 200 °C
Max. working pressure: 30 bar
Hold up volume Q1-Q2/Q3-Q4 (l): 0.061×n/2 / 0.061×(n-2)/2
Weight (kg): 2.32+0.135×n Max. no. of plates: 150

Cover plates: AISI 304
Connections: AISI 304

Other material combinations are available on request. Please contact your Danfoss sales representative for more information.

Standard connections as per below are optimised for this product as condenser in heat pump system. For other connections, please contact
your Danfoss representative.

Q3 (Refrigerant outlet): soldering 1/2”, 5/8” or 7/8”
Q4 (Refrigerant inlet): soldering 1/4”, 3/8“ or 5/8”
Q1-Q2 (Brine side): External threaded G 1”

Europe: Pressure Equipment Directive (PED). America: Underwriters Laboratory Inc (UL). The third party approvals stated are standard for all our
products. For details of other existing approvals or to discuss how we can meet your local needs, please contact your Danfoss representative.

Stud bolts on front and/or back plates for mounting support are available upon request. Please contact your Danfoss sales representative
for further information.

A corresponding MPHE for evaporator duties (H55-E) is also available, fully tested and ready for heat pump applicationsCorresponding

Plates: AISI 316
Brazing ller: Pure copper