Danfoss H55 Data sheet

Data Sheet
Micro Plate Heat Exchanger Type H55
For increased heat pump business
40% charge compared with a traditional BPHE. The ideal solution to meet the world`s climate and energy aspirations.
The H55(L)-C is a Condenser optimized for R410A in high eciency residential heat pumps with capacities between 4-40 kW.
The heat exchanger features innovative Micro Plate technology that improves heat transfer and reduces the amount of material used.
To meet demands for higher COPs in heat pumps, the H55L-C is designed to work eciently with close temperature approaches.
The H55L-C is approved to 48 bar to cope with high water temperature applications such as the renovation market.
The design has been veried with regards to the defrost operation cycle.
The low hold-up volume reduces the system refrigerant charge and oers valuable savings.
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a Applications C: chiller H: heat pump HDW: heat pump double wall
d Specic duty E= evaporator C= condenser
Plate design
Omit
L: L-type M: M-type H: H-type W: W-type X: Asymmetric Z: Z ow
Conguration
Omit: single
D: Dual circuit U: Mixing chamber
e Distributor version
Omit
B F Plate stacking sequence
Omit: a-b-a…
R: b-a-b…
b Platform
(1)
22,30,55,62,118…
c Pressure Service
Omit: 30bar
L: 45/49bar
f Number of plates
(2)
Micro plate heat exchanger, type H55
Features
• Minimal hold-up volume: Less refrigerant charge
• Reduced pressure drop: For a more ecient system
• Smaller footprint: Enabling more compact system
• Reduced CO2 footprint: Environmentally friendly with high heat transfer and minimal refrigerant charge
Portfolio overview
H55L-C: Condenser optimized for high density refrigerants in heat pump application, from 4 to 40kW.
H55-C: Condenser optimized for medium density refrigerants in heat pump application, from 4 to 40kW.
Table 1: Designation
(1)
(1)
Heat exchanging surface per plate 1/1000 m².
Heat exchanging surface per plate 1/1000 m².
(2)
(2)
Rule:
Rule:
• Single: even number
• Single: even number
• Dual: even number not multiple of 4
• Dual: even number not multiple of 4
Media
Refrigerants
R410A, R407C, R452B, R454B, R290, R32 For other refrigerants please contact your Danfoss Sales representative.
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Item
Material
Specication
Cover plates
Stainless steel
AISI 304L
Plates
Stainless steel
AISI 316L
Connections
Stainless steel
AISI 304L
Brazing
ller
Pure copper
Cu
Micro plate heat exchanger, type H55
Product specication
Dimensions
Figure 1: Dimensions
A:
H55L-C: 11.5 + 1.44xN [0.45 + 0.057xN] H55-C: 9.5 + 1.44xN [0.37 + 0.057xN] N: Number of Plate
Operating conditions
Preconditions:
N = number of plates Max number of plates: 150
Pressure and temperature data*:
Min. working temperature: -196 °C (-320 °F) Max. working temperature: 200 °C (390 °F) H52-C Max. working pressure: 30 bar (435psi) H55L-C: Max. working pressure: 48 bar (696psi) [UL: 45 bar (653psi)]
For details, refer to the Third party approvals chapter.
Weight*
H55-C: 2.32 + 0.135 x N [kg] / 5.11 + 0.297xN [lb] H55L-C: 2.67 + 0.135xN [kg] / 5.89 + 0.297xN [lb] N: Number of Plate *without connections
Material specication
Table 2: Standard materials
Other material combinations are available on request. Please contact your Danfoss sales representative for more information.
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Circuits
Connection type options
Connection size option(inch.)
Q1-Q2 (water-brine side)
BSP Gas male
½, ¾, 1, 1 ¼
BSP Gas female
½, ¾, 1
DIN R male
1, 1 ¼
NPT
1, 1 ¼
Victaulic
1, 1 ¼
Q3 -Q4 (refrigerant side)
Soldering
3
8
, ½,
5
8, ¾, 7⁄8, 1 1⁄8
Stud bolt position
Bolt sizes
327 mm, middle
140 x 60 mm, middle
M8x20mm M8x25mm M8x30mm
Micro plate heat exchanger, type H55
Conguration ow
Figure 2: Conguration ow
Parallel ow: Q1 - Q2 [H1 - H2]: brine/secondary side Q3 - Q4 [H3 - H4]: refrigerant/primary side
Hold up volume
Q1-Q2: 0.061 x N/2 [l] Q3-Q4: 0.061 x (N-2)/2 [l] N: Number of Plate
Ordering
Global or local standard code numbers can be accessed via Store.Danfoss.com on local subsites, with full set of technical data as well as relevant assets such as documentation and drawings. Since the portfolio may contain dierent types depending on country, this document contains only a summarized list of standard code numbers with a few data relevant for the product selection.
Conguring and calculating products
The H55(L)-C can be easily customized based on the application needs; model size can be evaluated using Hexact software.
For details, product conguration and code creation please contact your Danfoss Sales representative.
Mechanical connections
Table 3: Mechanical connections
Accessories and spare parts
MPHE products are not serviceable, i.e. cannot be taken apart and repaired, and there are no spare parts program. As for accessories, stud bolts, feet on front and/or back cover plates for mounting support and handling are available upon request.
Table 4: Stud bolts:
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Micro plate heat exchanger, type H55
Contact your Danfoss sales representative for further information.
Certicates, declarations, and approvals
The list contains all certicates, declarations, and approvals for this product type. Individual code number may have some or all of these approvals, and certain local approvals may not appear on the list.
Some approvals may change over time. You can check the most current status at danfoss.com or contact your local Danfoss representative if you have any questions.
Third party approvals
All MPHE and BPHE are certied to European Pressure Equipment Directive (PED) and are approved by Underwriters Laboratories (UL).
Other certications are available upon request: Kraia, EAC, UA, AS; for others and more details please contact your local Danfoss representative.
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