dallas semiconductor DS9006K service manual

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FEATURES
DS9006 SIP Stik Motherboard
Sample connectors for 30–, 35–, and 40–contact SIP
Stiks
Adaptor pins for wire wrap
DS9006K
PRELIMINAR
DS9006K
SIP Stik Prototyping Kit
Application note
3–D P ACKAGING BOOSTS DENSITY
Eurocard Form Factor Shown. Stiks, RJ45, D–Sub, and DIN not included.
DESCRIPTION
The DS9006K SIP Stik Prototyping Kit includes a printed circuit board for prototyping SIP Stiks. The wi­re–wrapped unit can then be housed in a molded enclo­sure for standalone applications. An application note
explains how to maximize use of th e DS9006 SIP Stik Motherboard printed circuit board using SIP Stiks. See data sheets for the DS9005 Eurocard Enclosure and DS9006 for more information on these items.
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